公开(公告)号：JP5365113B2

公开(公告)日：2013-12-11

申请号：JP2008232627

申请日：2008-09-10

Applicant: 日立化成株式会社

Inventor： 義信 尾崎 ,  恵一 畠山 ,  崇 増子 ,  祐樹 中村 ,  正信 宮原

IPC: H01L21/301 ,  C09J7/00 ,  C09J201/00 ,  H01L21/52 ,  H01L23/12 ,  H01L25/065 ,  H01L25/07 ,  H01L25/18

CPC classification number: H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/83 ,  H01L2224/29 ,  H01L2224/2919 ,  H01L2224/29298 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/83 ,  H01L2224/92247 ,  H01L2924/00011 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/01077 ,  H01L2924/01082 ,  H01L2924/0665 ,  H01L2924/09701 ,  H01L2924/15311 ,  H01L2924/15747 ,  H01L2924/351 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2224/2929

Abstract: PROBLEM TO BE SOLVED: To provide a method for manufacturing a semiconductor device for adjusting the cutting conditions of a semiconductor wafer. SOLUTION: In the method for manufacturing the semiconductor device, a first varnish containing a first adhesive resin composition and a second varnish containing a second adhesive resin composition different from the first one are overlaid on a base material 2. Then, the first and second varnishes are dried to form an adhesive film 1 on the base material 2. A semiconductor wafer W is stuck to the adhesive film 1. The semiconductor wafer W is cut and the adhesive film 1 is notched so that the adhesive film 1 remains partially. COPYRIGHT: (C)2010,JPO&INPIT

公开(公告)号：JP5343450B2

公开(公告)日：2013-11-13

申请号：JP2008214222

申请日：2008-08-22

Applicant: 日立化成株式会社

Inventor： 崇 増子 ,  正信 宮原

IPC: C09J179/08 ,  C09J4/06 ,  C09J7/02 ,  C09J11/04 ,  C09J163/00 ,  H01L21/52

CPC classification number: H01L24/83 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/83101 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15747 ,  H01L2924/00014 ,  H01L2924/00

Abstract: PROBLEM TO BE SOLVED: To provide an adhesive film having enough lamination processability at low temperature, combining with high heat resistance and low stickiness, and an adhesive sheet using the adhesive film. SOLUTION: The adhesive film 1 for fixing a semiconductor device comprises, a polyimide resin having a glass transition temperature of 10-80°C and a weight average molecular weight of 20,000-100,000, a thermosetting resin, and an inorganic filler. The adhesive film has melt viscosity at 100°C of 500-5,000 Pa s and film surface tack strength at 40°C of ≤50 gf. COPYRIGHT: (C)2009,JPO&INPIT

公开(公告)号：JP5186706B2

公开(公告)日：2013-04-24

申请号：JP2009168976

申请日：2009-07-17

Applicant: 日立化成株式会社

Inventor： 崇司 川守 ,  崇 増子 ,  茂樹 加藤木 ,  雅昭 安田

IPC: C09J179/08 ,  C09J7/00 ,  C09J163/00 ,  H01L21/52 ,  H01L23/29 ,  H01L23/31

CPC classification number: H01L23/488 ,  C09J179/08 ,  G03F7/037 ,  H01L21/2007 ,  H01L21/76251 ,  H01L21/78 ,  H01L27/14618 ,  H01L27/14683 ,  H01L2224/48091 ,  Y10T156/1002 ,  Y10T428/24479 ,  Y10T428/24802 ,  H01L2924/00014

公开(公告)号：JPWO2011058998A1

公开(公告)日：2013-04-04

申请号：JP2011540523

申请日：2010-11-10

Applicant: 日立化成株式会社

Inventor： 一行 満倉 ,  一行 満倉 ,  崇司 川守 ,  崇司 川守 ,  増子　崇 ,  崇 増子 ,  加藤木　茂樹 ,  茂樹 加藤木 ,  真二郎 藤井 ,  真二郎 藤井

IPC: H01L21/52 ,  C08F2/44 ,  C09J4/02 ,  C09J11/06 ,  C09J201/00 ,  C09J201/02 ,  H01L25/065 ,  H01L25/07 ,  H01L25/18

CPC classification number: H01L24/27 ,  C08G73/10 ,  C09J179/08 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L25/0657 ,  H01L2224/274 ,  H01L2224/27416 ,  H01L2224/27418 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/83191 ,  H01L2224/8385 ,  H01L2224/92247 ,  H01L2225/0651 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01084 ,  H01L2924/04953 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: (A)放射線重合性化合物、(B)光開始剤、及び(C)熱硬化性樹脂、を含み、前記(B)成分が、(B1)波長365nmの光に対する分子吸光係数が100ml/g・cm以上である化合物を含み、溶剤の含有量が5質量%以下である液状半導体用接着剤組成物。

公开(公告)号：JP5157255B2

公开(公告)日：2013-03-06

申请号：JP2007139504

申请日：2007-05-25

Applicant: 日立化成株式会社

Inventor： 崇 増子 ,  崇司 川守

IPC: C09J163/00 ,  C09J4/00 ,  C09J7/02 ,  C09J179/08 ,  C09J183/10 ,  G03F7/037 ,  H01L21/52

CPC classification number: G03F7/0757 ,  G03F7/037 ,  G03F7/038 ,  H01L2224/29012 ,  H01L2924/01019 ,  H01L2924/10253 ,  H01L2924/00

Abstract: PROBLEM TO BE SOLVED: To provide a photosensitive adhesive composition having the pattern formability by an alkali developer and satisfactory re-adhesivity after exposure as well, and to provide an adhesive film, an adhesive sheet and an adhesive pattern each using the composition, and a semiconductor device. SOLUTION: This photosensitive adhesive composition can form a pattern by development and the storage modulus at 100°C after pattern formation is 10 MPa or lower. COPYRIGHT: (C)2008,JPO&INPIT