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公开(公告)号:TWI450363B
公开(公告)日:2014-08-21
申请号:TW099119021
申请日:2010-06-11
Inventor: 黃宏麟 , HUANG, HON LIN , 蕭景文 , HSIAO, CHING WEN , 許國經 , HSU, KUO CHING , 陳承先 , CHEN, CHEN SHIEN
IPC: H01L21/768
CPC classification number: H01L23/544 , H01L21/6836 , H01L23/481 , H01L24/11 , H01L24/13 , H01L24/14 , H01L24/16 , H01L24/81 , H01L25/0657 , H01L2221/6834 , H01L2221/68372 , H01L2223/54453 , H01L2223/54493 , H01L2224/05001 , H01L2224/05008 , H01L2224/05009 , H01L2224/05024 , H01L2224/05025 , H01L2224/05026 , H01L2224/05124 , H01L2224/05139 , H01L2224/05144 , H01L2224/05147 , H01L2224/05184 , H01L2224/0557 , H01L2224/05571 , H01L2224/05624 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/11002 , H01L2224/1147 , H01L2224/11901 , H01L2224/13007 , H01L2224/1308 , H01L2224/13082 , H01L2224/13083 , H01L2224/131 , H01L2224/13124 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/13184 , H01L2224/81193 , H01L2224/81801 , H01L2225/06513 , H01L2225/06541 , H01L2924/00013 , H01L2924/01006 , H01L2924/01011 , H01L2924/01012 , H01L2924/01013 , H01L2924/01019 , H01L2924/0102 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01327 , H01L2924/014 , H01L2924/09701 , H01L2924/14 , H01L2924/19041 , H01L2924/19043 , H01L2924/3511 , H01L2924/00014 , H01L2224/13099 , H01L2924/013
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公开(公告)号:TWI429047B
公开(公告)日:2014-03-01
申请号:TW099129825
申请日:2010-09-03
Inventor: 黃宏麟 , HUANG, HON LIN , 蕭景文 , HSIAO, CHING WEN , 許國經 , HSU, KUO CHING , 陳承先 , CHEN, CHEN SHIEN
IPC: H01L23/52
CPC classification number: H01L24/11 , H01L23/3157 , H01L23/481 , H01L24/13 , H01L24/81 , H01L2221/68327 , H01L2221/68359 , H01L2224/0361 , H01L2224/03912 , H01L2224/0401 , H01L2224/05558 , H01L2224/05572 , H01L2224/1147 , H01L2224/11823 , H01L2224/11849 , H01L2224/119 , H01L2224/11912 , H01L2224/13027 , H01L2224/13083 , H01L2224/13099 , H01L2224/131 , H01L2224/13111 , H01L2224/13147 , H01L2224/13155 , H01L2224/13562 , H01L2224/1357 , H01L2224/13611 , H01L2224/818 , H01L2924/00014 , H01L2924/0002 , H01L2924/01013 , H01L2924/01022 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01073 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/01327 , H01L2924/014 , H01L2924/04953 , H01L2924/14 , H01L2924/19041 , H01L2224/05552
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公开(公告)号:TWI397985B
公开(公告)日:2013-06-01
申请号:TW098134249
申请日:2009-10-09
Inventor: 許國經 , HSU, KUO CHING , 陳承先 , CHEN, CHEN SHIEN , 黃宏麟 , HUANG, HON LIN
IPC: H01L23/535
CPC classification number: H01L24/11 , H01L23/481 , H01L24/05 , H01L24/12 , H01L2224/0231 , H01L2224/02311 , H01L2224/02372 , H01L2224/0401 , H01L2224/04042 , H01L2224/05022 , H01L2224/13024 , H01L2224/13027 , H01L2224/13099 , H01L2224/13155 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01023 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/01327 , H01L2924/014 , H01L2924/05042 , H01L2924/14 , H01L2924/19041 , H01L2924/19043
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公开(公告)号:TWI474453B
公开(公告)日:2015-02-21
申请号:TW101120422
申请日:2012-06-07
Inventor: 鄭心圃 , JENG, SHIN PUU , 吳偉誠 , WU, WEI CHENG , 侯上勇 , HOU, SHANG YUN , 余振華 , YU, CHEN HUA , 劉醇鴻 , LIU, TZUAN HORNG , 邱志威 , CHIU, TZU WEI , 許國經 , HSU, KUO CHING
IPC: H01L23/488 , H01L21/60
CPC classification number: H01L22/34 , G01R31/2884 , H01L21/76885 , H01L22/32 , H01L23/49838 , H01L24/11 , H01L24/13 , H01L24/16 , H01L2224/02126 , H01L2224/0401 , H01L2224/05001 , H01L2224/0554 , H01L2224/10126 , H01L2224/13005 , H01L2224/16225 , H01L2924/12044 , H01L2924/15311 , H01L2924/00
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公开(公告)号:TWI464848B
公开(公告)日:2014-12-11
申请号:TW099113812
申请日:2010-04-30
Inventor: 余振華 , YU, CHEN HUA , 黃宏麟 , HUANG, HON LIN , 許國經 , HSU, KUO CHING , 陳承先 , CHEN, CHEN SHIEN
IPC: H01L23/488 , H01L23/52 , H01L21/768
CPC classification number: H01L23/481 , H01L21/6836 , H01L21/76898 , H01L23/525 , H01L24/11 , H01L24/13 , H01L24/14 , H01L24/81 , H01L25/0657 , H01L25/50 , H01L2224/0231 , H01L2224/03462 , H01L2224/03464 , H01L2224/0401 , H01L2224/05567 , H01L2224/05568 , H01L2224/11002 , H01L2224/11462 , H01L2224/1147 , H01L2224/13023 , H01L2224/1308 , H01L2224/13083 , H01L2224/13111 , H01L2224/13124 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/13171 , H01L2224/13172 , H01L2224/13184 , H01L2224/13583 , H01L2224/13655 , H01L2224/81001 , H01L2224/81193 , H01L2224/81801 , H01L2225/06513 , H01L2225/06527 , H01L2225/06541 , H01L2924/00013 , H01L2924/0002 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01024 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/14 , H01L2924/19041 , H01L2924/19043 , H01L2924/00014 , H01L2224/13099 , H01L2224/05552
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公开(公告)号:TWI416692B
公开(公告)日:2013-11-21
申请号:TW098115087
申请日:2009-05-07
Inventor: 張宏賓 , CHANG, HUNG PIN , 許國經 , HSU, KUO CHING , 陳承先 , CHEN, CHEN SHIEN , 邱文智 , CHIOU, WEN CHIH , 余振華 , YU, CHEN HUA
IPC: H01L23/538 , H01L23/485 , H01L21/60
CPC classification number: H01L23/5384 , H01L21/568 , H01L21/6835 , H01L23/481 , H01L24/11 , H01L24/12 , H01L24/14 , H01L24/16 , H01L24/17 , H01L24/81 , H01L25/0657 , H01L25/50 , H01L2221/68372 , H01L2224/0231 , H01L2224/02311 , H01L2224/0401 , H01L2224/05009 , H01L2224/05027 , H01L2224/0557 , H01L2224/13009 , H01L2224/13025 , H01L2224/13099 , H01L2224/13147 , H01L2224/1401 , H01L2224/1701 , H01L2224/81001 , H01L2224/81005 , H01L2224/81193 , H01L2224/812 , H01L2224/81801 , H01L2225/06513 , H01L2225/06524 , H01L2225/06541 , H01L2924/00014 , H01L2924/0002 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01022 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01073 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/04953 , H01L2924/12042 , H01L2924/14 , H01L2924/15788 , H01L2924/19041 , H01L2924/19043 , H01L2924/00012 , H01L2224/05552 , H01L2924/00
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公开(公告)号:TWI402939B
公开(公告)日:2013-07-21
申请号:TW097109167
申请日:2008-03-14
Inventor: 陳志華 , CHEN, CHIHHUA , 陳承先 , CHEN, CHENSHIEN , 郭正錚 , KUO, CHENCHENG , 許國經 , HSU, KUOCHING , 卿愷明 , CHING, KAIMING
IPC: H01L21/768 , H01L23/52
CPC classification number: H01L21/76898 , H01L21/6835 , H01L23/481 , H01L24/03 , H01L24/05 , H01L2221/6834 , H01L2224/0401 , H01L2224/0557 , H01L2224/05624 , H01L2224/05639 , H01L2224/05647 , H01L2224/13009 , H01L2924/0002 , H01L2924/01013 , H01L2924/01014 , H01L2924/01019 , H01L2924/01022 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01073 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/04941 , H01L2924/14 , H01L2924/19041 , H01L2924/19043 , H01L2924/00014 , H01L2224/05552
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公开(公告)号:TW201324718A
公开(公告)日:2013-06-16
申请号:TW101120422
申请日:2012-06-07
Inventor: 鄭心圃 , JENG, SHIN PUU , 吳偉誠 , WU, WEI CHENG , 侯上勇 , HOU, SHANG YUN , 余振華 , YU, CHEN HUA , 劉醇鴻 , LIU, TZUAN HORNG , 邱志威 , CHIU, TZU WEI , 許國經 , HSU, KUO CHING
IPC: H01L23/488 , H01L21/60
CPC classification number: H01L22/34 , G01R31/2884 , H01L21/76885 , H01L22/32 , H01L23/49838 , H01L24/11 , H01L24/13 , H01L24/16 , H01L2224/02126 , H01L2224/0401 , H01L2224/05001 , H01L2224/0554 , H01L2224/10126 , H01L2224/13005 , H01L2224/16225 , H01L2924/12044 , H01L2924/15311 , H01L2924/00
Abstract: 所述實施例提供一機制,其用於形成金屬凸塊於一封裝積體電路晶片上之帶有測試墊的金屬墊上。形成一保護層以覆蓋測試墊與可能覆蓋金屬墊之部分。保護層不覆蓋遠離測試墊區域與金屬墊區域的表面。藉由保護層之測試墊與金屬墊之部分之有限的覆蓋,減少對於形成於金屬墊與金屬凸塊之間的一凸塊下冶金(under bump metallurgy,UBM)層的介面電阻(interface resistance)。此種介面電阻的減少導致金屬凸塊之電阻的減少。
Abstract in simplified Chinese: 所述实施例提供一机制,其用于形成金属凸块于一封装集成电路芯片上之带有测试垫的金属垫上。形成一保护层以覆盖测试垫与可能覆盖金属垫之部分。保护层不覆盖远离测试垫区域与金属垫区域的表面。借由保护层之测试垫与金属垫之部分之有限的覆盖,减少对于形成于金属垫与金属凸块之间的一凸块下冶金(under bump metallurgy,UBM)层的界面电阻(interface resistance)。此种界面电阻的减少导致金属凸块之电阻的减少。
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公开(公告)号:TWI485756B
公开(公告)日:2015-05-21
申请号:TW099121418
申请日:2010-06-30
Inventor: 余振華 , YU, CHEN HUA , 許國經 , HSU, KUO CHING , 陳承先 , CHEN, CHEN SHIEN , 蕭景文 , HSIAO, CHING WEN
IPC: H01L21/30
CPC classification number: H01L21/187 , H01L21/6835 , H01L2221/68318 , H01L2221/68327 , H01L2221/68381 , Y10T428/1476
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公开(公告)号:TWI470737B
公开(公告)日:2015-01-21
申请号:TW098121566
申请日:2009-06-26
Inventor: 張仕承 , CHANG, SHIH CHENG , 林錦聯 , LIN, JIN-LIEN , 許國經 , HSU, KUO CHING , 卿愷明 , CHING, KAI MING , 吳俊毅 , WU, JIUN YI , 陳炎輝 , CHEN, YEN HUEI
IPC: H01L21/768 , G02B6/12 , H01L31/12
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