公开(公告)号：US20250153280A1

公开(公告)日：2025-05-15

申请号：US19019729

申请日：2025-01-14

Applicant: Alpha Assembly Solutions Inc.

Inventor： Rahul Raut ,  Nirmalya Kumar Chaki ,  Bawa Singh ,  Ranjit Pandher ,  Siuli Sarkar

IPC: B23K35/26 ,  B23K35/02 ,  B23K35/362 ,  B23K101/42 ,  B23K103/08

Abstract: A solder paste comprising: a solder alloy, and a solder flux comprising an activator, wherein the activator comprises an organic acid activator and an organic amine activator, and wherein the molar ratio of organic acid activator to organic amine activator is from 0.8 to 2.5. A method of forming a solder joint comprising: (i) providing two or more work pieces to be joined; (ii) providing the solder paste of claim 1; and (iii) heating the solder paste in the vicinity of the work pieces to be joined.

公开(公告)号：US12278022B2

公开(公告)日：2025-04-15

申请号：US18376896

申请日：2023-10-05

Applicant: Alpha Assembly Solutions Inc.

Inventor： Narahari Pujari ,  Bawa Singh ,  Ravi Bhatkal ,  Siuli Sarkar ,  Anubhav Rustogi

IPC: H01B1/22 ,  B22F1/052 ,  B22F1/068 ,  B22F1/107 ,  B22F1/17 ,  B23K35/02 ,  B23K35/30 ,  B23K35/36 ,  B23K35/362 ,  H05K1/09 ,  H05K1/18 ,  H05K3/12

Abstract: A conductive paste and method of manufacturing thereof. The conductive paste comprises conductive particles dispersed in an organic medium, the organic medium comprising: (a) a solvent; and (b) a binder comprising a polyester. The conductive paste typically comprises silver and may contain various other additives. A stretchable conductive layer can be formed by curing the conductive paste.

公开(公告)号：US12233483B2

公开(公告)日：2025-02-25

申请号：US17286704

申请日：2019-10-23

Applicant: ALPHA ASSEMBLY SOLUTIONS INC.

Inventor： Rahul Raut ,  Nirmalyakumar Chaki ,  Bawa Singh ,  Ranjit Pandher ,  Siuli Sarkar

IPC: B23K35/02 ,  B23K35/26 ,  B23K35/362 ,  C22C12/00 ,  B23K101/42 ,  B23K103/08

Abstract: A solder alloy comprising: from 40 to 65 wt. % bismuth; from I to IO wt. % indium; at least one of: from 0.1 to 5 wt. % gallium, from 0.1 to 5 wt. % zinc, from 0.1 to 2 w. % copper, from 0.01 to 0.1 wt. % cobalt, from 0.1 to 2 wt. % silver, from 0.005 to 0.05 wt. % titanium, and from 0.01 to 1 wt. % nickel; optionally up to 1 wt. % of one or more of: vanadium, rare earth metals, neodymium, chromium, iron, aluminium, phosphorus, gold, tellurium, selenium, calcium, vanadium, molybdenum, platinum, magnesium, silicon, and manganese; and the balance tin together with any unavoidable impurities.

公开(公告)号：US20240413117A1

公开(公告)日：2024-12-12

申请号：US18806922

申请日：2024-08-16

Applicant: ALPHA ASSEMBLY SOLUTIONS INC.

Inventor： Shamik Ghoshal ,  Nirmalya Kumar Chaki ,  Poulami Sengupta Roy ,  Siuli Sarkar ,  Anubhav Rustogi

IPC: H01L23/00 ,  B22F1/052 ,  B22F1/102 ,  B22F1/107 ,  B22F1/17 ,  B22F7/04 ,  B23K1/00 ,  B23K35/02 ,  B23K35/30 ,  B23K35/36 ,  B23K35/365 ,  B23K101/40 ,  B23K103/00 ,  H01B1/22 ,  H01L25/00 ,  H05K3/32 ,  H10K50/842

Abstract: A sintering powder comprising: a first type of metal particles having a mean longest dimension of from 100 nm to 50 μm.

公开(公告)号：US12084583B2

公开(公告)日：2024-09-10

申请号：US17524891

申请日：2021-11-12

Applicant: Alpha Assembly Solutions Inc.

Inventor： Narahari Pujari ,  Jayaprakash Sundaramurthy ,  Siuli Sarkar ,  Ravindra M. Bhatkal

IPC: C09D11/322 ,  B41F15/40 ,  B41M5/00 ,  C09D11/037 ,  C09D11/101 ,  C09D11/102 ,  C09D11/104 ,  C09D11/107 ,  C09D11/38 ,  H05K1/03 ,  H05K3/00 ,  C09D11/30

CPC classification number: C09D11/322 ,  B41F15/40 ,  B41M5/0023 ,  C09D11/037 ,  C09D11/101 ,  C09D11/102 ,  C09D11/104 ,  C09D11/107 ,  C09D11/38 ,  H05K1/0393 ,  H05K3/0011 ,  C09D11/30 ,  H05K2201/0133 ,  C09D11/10 ,  C09D11/52

Abstract: The present invention relates to flexible and stretchable UV and thermally curable dielectric ink compositions that can be thermo or vacuum formed. The flexible ink can form a stretchable dielectric coating having excellent adhesion. The dielectric ink compositions can be applied on a circuit board, such as a paper-phenolic resin board, plastic board (PMMA, PET or the like) or a glass-epoxy resin board, by screen printing or the like, followed by heat/UV curing. The compositions are suitable for use in applications such as a capacitive touch, in-mold forming, creating cross over insulation layers, and manufacturing electronic circuitry and devices.

公开(公告)号：US11929341B2

公开(公告)日：2024-03-12

申请号：US17255289

申请日：2019-06-21

Applicant: ALPHA ASSEMBLY SOLUTIONS INC.

Inventor： Shamik Ghosal ,  Remya Chandran ,  Venodh Manoharan ,  Siuli Sarkar ,  Bawa Singh ,  Rahul Raut

IPC: B22F1/102 ,  B22F1/052 ,  B22F1/07 ,  B22F5/00 ,  B22F9/24 ,  B23K35/02 ,  B23K35/30 ,  H01L23/00 ,  B82Y40/00

CPC classification number: H01L24/29 ,  B22F1/052 ,  B22F1/07 ,  B22F1/102 ,  B22F5/006 ,  B22F9/24 ,  B23K35/025 ,  B23K35/302 ,  B22F2301/10 ,  B22F2304/054 ,  B22F2304/056 ,  B22F2304/058 ,  B82Y40/00

Abstract: A sintering powder comprising copper particles, wherein: the particles are at least partially coated with a capping agent, and the particles exhibit a D10 of greater than or equal to 100 nm and a D90 of less than or equal to 2000 nm.

公开(公告)号：US20240029916A1

公开(公告)日：2024-01-25

申请号：US18376896

申请日：2023-10-05

Applicant: Alpha Assembly Solutions Inc.

Inventor： Narahari PUJARI ,  Bawa SINGH ,  Ravi BHATKAL ,  Siuli SARKAR ,  Anubhav RUSTOGI

IPC: H01B1/22 ,  H05K1/09 ,  B22F1/17 ,  B22F1/052 ,  B22F1/068 ,  B22F1/107 ,  B23K35/02 ,  B23K35/30 ,  B23K35/36 ,  B23K35/362 ,  H05K3/12

CPC classification number: H01B1/22 ,  H05K1/095 ,  B22F1/17 ,  B22F1/052 ,  B22F1/068 ,  B22F1/107 ,  B23K35/025 ,  B23K35/3006 ,  B23K35/3613 ,  B23K35/362 ,  H05K3/1216 ,  H05K3/1241 ,  H05K2201/0245 ,  H05K2201/0133 ,  H05K1/189

Abstract: A conductive paste and method of manufacturing thereof. The conductive paste comprises conductive particles dispersed in an organic medium, the organic medium comprising: (a) a solvent; and (b) a binder comprising a polyester. The conductive paste typically comprises silver and may contain various other additives. A stretchable conductive layer can be formed by curing the conductive paste.

公开(公告)号：US11842974B2

公开(公告)日：2023-12-12

申请号：US16612883

申请日：2018-05-11

Applicant: Alpha Assembly Solutions Inc.

Inventor： Angelo Gulino ,  Bogdan Bankiewicz ,  Oscar Khaselev ,  Anna Lifton ,  Michael T. Marczi ,  Girard Sidone ,  Paul Salerno ,  Paul J. Koep

IPC: H01L23/00 ,  B23K35/26 ,  B23K35/30 ,  C22C13/00 ,  B23K101/42

CPC classification number: H01L24/29 ,  B23K35/262 ,  B23K35/302 ,  C22C13/00 ,  H01L24/83 ,  B23K2101/42 ,  H01L2224/29209 ,  H01L2224/29211 ,  H01L2224/29216 ,  H01L2224/29239 ,  H01L2224/29247 ,  H01L2224/29311 ,  H01L2224/29324 ,  H01L2224/29339 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29364 ,  H01L2224/29369 ,  H01L2224/83815 ,  H01L2924/014 ,  H01L2924/0105 ,  H01L2924/01013 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01078 ,  H01L2924/01082

Abstract: A solder material comprising a solder alloy and a thermal conductivity modifying component. The solder material has a bulk thermal conductivity of between about 75 and about 150 W/m-K and is usable in enhancing the thermal conductivity of the solder, allowing for optimal heat transfer and reliability in electronic packaging applications.

公开(公告)号：US20230356333A1

公开(公告)日：2023-11-09

申请号：US18217156

申请日：2023-06-30

Applicant: Alpha Assembly Solutions Inc.

Inventor： Md Hasnine ,  Lik Wai Kho

IPC: B23K35/26 ,  C22C13/02 ,  C22C13/00

CPC classification number: B23K35/262 ,  B23K35/26 ,  C22C13/00 ,  C22C13/02 ,  B23K35/0244

Abstract: A lead-free silver-free solder alloy may comprise tin, copper, bismuth, cobalt, and antimony. Alternatively, the alloy may comprise gallium in lieu of cobalt. The alloy may further comprise nickel, germanium, or both. The copper may be present in an amount from about 0.5% to 0.9% by weight of the solder. The bismuth may be present in an amount from about 1.0% to about 3.5% by weight of the solder. The cobalt may be present in an amount from about 0.02% to about 0.08% by weight of the solder. Where gallium is used in lieu of cobalt, the gallium may be present in an amount from about 0.2% to about 0.8% by weight of the solder. The antimony may be present in an amount between about 0.0% to about 0.09% by weight of the solder. The balance of the solder is tin.

公开(公告)号：US20220216357A1

公开(公告)日：2022-07-07

申请号：US17595690

申请日：2020-05-22

Applicant: ALPHA ASSEMBLY SOLUTIONS INC.

Inventor： Narahari PUJARI ,  Siuli SARKAR ,  Carl BILGRIEN

IPC: H01L31/05

Abstract: A method of fabricating a solar module by interconnection of a plurality of photovoltaic (PV) cells in which at least a first PV cell is interconnected to a second PV cell using an electrically-conductive adherent comprising or consisting of a solder paste. The solder paste comprises particles of solder alloy dispersed in a solder flux. The solder alloy comprises a Sn-containing solder alloy having a liquidus temperature of less than 225° C.