公开(公告)号：US20170176496A1

公开(公告)日：2017-06-22

申请号：US14975386

申请日：2015-12-18

Applicant: Akshay Mathkar ,  Nachiket R. Raravikar ,  James C. Matayabas, Jr. ,  Jin Yang

Inventor： Akshay Mathkar ,  Nachiket R. Raravikar ,  James C. Matayabas, Jr. ,  Jin Yang

IPC: G01R1/073 ,  G01R31/28 ,  H01F38/20 ,  H01F41/02 ,  H01F27/28 ,  H01F27/29

CPC classification number: H01R43/24 ,  G01R1/07378

Abstract: Prober space transformer to interface an E-testing apparatus to an unpackaged die. The space transformer may include a substrate and a perforated cover plate disposed on the substrate. The substrate may include conductive traces and an array of conductive probe pins extend outwardly from anchor points on the substrate. The pins are electrically coupled to at least one of the conductive traces on the substrate as a prober interface between an E-testing apparatus and a DUT. The cover plate may be affixed to a surface of the substrate and includes an array of perforations through which the array of conductive pins may pass. The cover plate may be synthetic polymer resin or a polymer-based composite, fabricated, for example by perforating a mold preform.

公开(公告)号：US09613933B2

公开(公告)日：2017-04-04

申请号：US14198479

申请日：2014-03-05

Applicant: Thomas J. De Bonis ,  Lilia May ,  Rajen S. Sidhu ,  Mukul P. Renavikar ,  Ashay A. Dani ,  Edward R. Prack ,  Carl L. Deppisch ,  Anna M. Prakash ,  James C. Matayabas, Jr. ,  Jason Jieping Zhang ,  Srinivasa R. Aravamudhan ,  Chang Lin

Inventor： Thomas J. De Bonis ,  Lilia May ,  Rajen S. Sidhu ,  Mukul P. Renavikar ,  Ashay A. Dani ,  Edward R. Prack ,  Carl L. Deppisch ,  Anna M. Prakash ,  James C. Matayabas, Jr. ,  Jason Jieping Zhang ,  Srinivasa R. Aravamudhan ,  Chang Lin

IPC: H01L23/12 ,  H01L25/065 ,  H01L25/10 ,  H01L23/31 ,  H01L23/498 ,  H01L23/00

CPC classification number: H01L23/49816 ,  H01L21/4853 ,  H01L21/565 ,  H01L21/76802 ,  H01L23/3128 ,  H01L23/49822 ,  H01L24/16 ,  H01L24/17 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/13023 ,  H01L2224/16227 ,  H01L2224/16238 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/0652 ,  H01L2225/06548 ,  H01L2225/06586 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/37001 ,  H01L2924/00

Abstract: An apparatus is described that includes a substrate and a mold compound disposed on the substrate. The semiconductor die is embedded within the mold compound and is electrically coupled to lands on the substrate. Solder balls are disposed around the semiconductor die on the substrate. Each of the solder balls have a solid coating thereon. The solid coating contains a cleaning agent to promote its solder ball's coalescence with another solder ball. Respective vias are formed in the mold compound that expose the solder balls and their respective solid coatings. In combined or alternate embodiments outer edges of the mold compound have smaller thickness than regions of the mold compound between the vias and the semiconductor die. In combined or alternate embodiments micro-channels exist between the solder balls and the mold compound.

公开(公告)号：US20150163921A1

公开(公告)日：2015-06-11

申请号：US14102676

申请日：2013-12-11

Applicant: Sasha Oster ,  Robert L. Sankman ,  Charles Gealer ,  Omkar Karhade ,  John S. Guzek ,  Ravi V. Mahajan ,  James C. Matayabas, JR. ,  Johanna Swan ,  Feras Eid ,  Shawna Liff ,  Timothy McIntosh ,  Telesphor Teles Kamgaing ,  Adel Elsherbini ,  Kemal Aygun

Inventor： Sasha Oster ,  Robert L. Sankman ,  Charles Gealer ,  Omkar Karhade ,  John S. Guzek ,  Ravi V. Mahajan ,  James C. Matayabas, JR. ,  Johanna Swan ,  Feras Eid ,  Shawna Liff ,  Timothy McIntosh ,  Telesphor Teles Kamgaing ,  Adel Elsherbini ,  Kemal Aygun

IPC: H05K1/18 ,  G06F1/16 ,  H05K13/04

CPC classification number: H05K1/189 ,  G06F1/163 ,  H01L21/568 ,  H01L24/19 ,  H01L24/96 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/24137 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/18162 ,  H05K1/0393 ,  H05K1/181 ,  H05K1/185 ,  H05K13/0469 ,  H05K2201/0137 ,  H05K2203/1469 ,  Y10T29/49146 ,  H01L2924/00

Abstract: This disclosure relates generally to devices, systems, and methods for making a flexible microelectronic assembly. In an example, a polymer is molded over a microelectronic component, the polymer mold assuming a substantially rigid state following the molding. A routing layer is formed with respect to the microelectronic component and the polymer mold, the routing layer including traces electrically coupled to the microelectronic component. An input is applied to the polymer mold, the polymer mold transitioning from the substantially rigid state to a substantially flexible state upon application of the input.

Abstract translation: 本公开一般涉及用于制造柔性微电子组件的装置，系统和方法。 在一个实例中，聚合物模制在微电子部件上，聚合物模具在模制之后呈现基本刚性的状态。 相对于微电子部件和聚合物模具形成布线层，布线层包括电耦合到微电子部件的迹线。 输入被施加到聚合物模具，聚合物模具在施加输入时从基本刚性状态转变到基本上柔性的状态。

公开(公告)号：US08920919B2

公开(公告)日：2014-12-30

申请号：US13625612

申请日：2012-09-24

Applicant: Hitesh Arora ,  James C. Matayabas, Jr.

Inventor： Hitesh Arora ,  James C. Matayabas, Jr.

IPC: B32B27/32

CPC classification number: C08L25/06 ,  B82Y30/00 ,  C08K3/04 ,  C08K3/041 ,  C08K3/042 ,  C08K7/24 ,  C08K2201/011 ,  C08L23/02 ,  C08L23/20 ,  C08L53/00 ,  Y10T428/25 ,  Y10T428/31938 ,  C08L9/00 ,  C08L53/025

Abstract: Certain embodiments relate to compositions that may be used as thermal interface materials in electronic assemblies. One such composition includes a block copolymer matrix comprising polystyrene and polybutene. The composition also includes a filler positioned in the copolymer matrix, the filler comprising carbon. The filler may in certain embodiments be a material selected from the group consisting of graphite, graphene, and carbon nanotubes. composition may include routing structures and their formation. Assemblies may include the composition positioned between a die and a heat spreader. Other embodiments are described and claimed.

Abstract translation: 某些实施方案涉及可用作电子组件中的热界面材料的组合物。 一种这样的组合物包括包含聚苯乙烯和聚丁烯的嵌段共聚物基体。 组合物还包括位于共聚物基质中的填料，填料包含碳。 在某些实施方案中，填料可以是选自石墨，石墨烯和碳纳米管的材料。 组成可以包括路由结构及其形成。 组件可以包括定位在模具和散热器之间的组合物。 描述和要求保护其他实施例。

公开(公告)号：US20110250458A1

公开(公告)日：2011-10-13

申请号：US13169784

申请日：2011-06-27

Applicant: James C. Matayabas, JR. ,  Tian-An Chen

Inventor： James C. Matayabas, JR. ,  Tian-An Chen

IPC: B32B27/38 ,  C08L63/00 ,  C08G59/14

CPC classification number: C08G59/18 ,  C08G59/20 ,  H01L2224/16245 ,  H01L2224/32245 ,  H01L2224/40245 ,  H01L2924/181 ,  Y10T428/2848 ,  Y10T428/31511 ,  Y10T428/31515 ,  H01L2924/00012

Abstract: An embodiment of the present invention is a technique to form a resin. A mixture is formed by a curing agent dissolved in the epoxy resin. The epoxy resin contains a first rigid rod mesogen. The curing agent contains a second rigid rod mesogen and one of a hydroxyl, amine, and anhydride.

Abstract translation: 本发明的一个实施方案是形成树脂的技术。 混合物由溶解在环氧树脂中的固化剂形成。 环氧树脂含有第一刚性棒介晶。 固化剂含有第二刚性棒介晶和羟基，胺和酸酐之一。

公开(公告)号：US07060747B2

公开(公告)日：2006-06-13

申请号：US10034699

申请日：2001-12-27

Applicant: James C. Matayabas, Jr.

Inventor： James C. Matayabas, Jr.

IPC: C08K3/08

CPC classification number: H01L23/3737 ,  C08G77/12 ,  C08G77/20 ,  C08K3/013 ,  C08K3/08 ,  C08K3/22 ,  C08K3/28 ,  C08K9/02 ,  C08K2201/001 ,  C08L83/00 ,  C08L83/04 ,  H01L23/36 ,  H01L23/42 ,  H01L23/49833 ,  H01L2224/16225 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/3011 ,  H01L2224/0401

Abstract: A curable material useful as thermal material comprises at least one vinyl-terminated silicone oil, at least one conductive filler, and at least one hydrogen terminated silicone oil. The hydrogen terminated silicone oil is used to reduce a shear modulus G′ of the cured thermal interface material.

公开(公告)号：US5608034A

公开(公告)日：1997-03-04

申请号：US532044

申请日：1995-09-22

Applicant: Stephen N. Falling ,  Stephen A. Godleski ,  Patricia Lopez-Maldonado ,  Peter B. MacKenzie ,  Laughlin G. McCullough ,  James C. Matayabas, Jr.

Inventor： Stephen N. Falling ,  Stephen A. Godleski ,  Patricia Lopez-Maldonado ,  Peter B. MacKenzie ,  Laughlin G. McCullough ,  James C. Matayabas, Jr.

IPC: C08G65/28 ,  C08G65/02 ,  C08G65/12 ,  C08G65/14 ,  C08G65/26

CPC classification number: C08G65/269 ,  C08G65/12 ,  C08G65/14

Abstract: Polyether polymers obtained by the reaction or polymerization of 3,4-epoxy-1-butene in the presence of an onium iodide compound such as an ammonium or phosphonium iodide, an organotin compound such as a trihydrocarbyltin iodide, and a nucleophilic hydroxyl initiator compound. The polyether polymers comprise n units of residue (1) and m units of residue (2), wherein the total value of n+m is 2 to 70, m/(n+m) is greater than 0.75 and up to 0.98, and residues (1) and (2) have the structures: ##STR1##

Abstract translation: 通过在碘鎓化合物如碘化铵或碘化鏻，有机锡化合物如三烃基碘化物和亲核羟基引发剂化合物的存在下，通过3,4-环氧-1-丁烯的反应或聚合获得的聚醚聚合物。 聚醚聚合物包含n个残基（1）单元和m个残基（2），其中n + m的总值为2-70，m /（n + m）大于0.75，最高为0.98， 残基（1）和（2）具有以下结构：（1）OCH2CHCHCH2。 （2）

公开(公告)号：US5536882A

公开(公告)日：1996-07-16

申请号：US398245

申请日：1995-03-03

Applicant: James C. Matayabas, Jr. ,  Stephen N. Falling

Inventor： James C. Matayabas, Jr. ,  Stephen N. Falling

IPC: C07C43/178 ,  C08G65/02 ,  C08G65/14 ,  C08G65/26 ,  C08G65/28 ,  C07C41/06

CPC classification number: C07C43/178 ,  C08G65/14 ,  C08G65/26

Abstract: Disclosed are novel polyether compounds obtained by the reaction or polymerization of 3,4-epoxy-1-butene in the presence of an acidic catalyst and a nucleophilic initiator compound. The polyether compounds comprise n units of residue (1) and m units of residue (2), wherein the total value of n+m is 2 to 70, n/(n+m) is a value in the range of 0.70 to 0.95, and residues (1) and (2) have the structures: ##STR1##

Abstract translation: 公开了在酸性催化剂和亲核引发剂化合物的存在下通过3,4-环氧-1-丁烯的反应或聚合获得的新型聚醚化合物。 聚醚化合物包含n个残基（1）单元和m个残基（2），其中n + m的总值为2〜70，n /（n + m）为0.70〜0.95的范围内的值 ，残基（1）和（2）具有以下结构：（1）OCH 2 CHCHCH 2。 （2）

公开(公告)号：US5466759A

公开(公告)日：1995-11-14

申请号：US327951

申请日：1994-10-24

Applicant: James C. Matayabas, Jr. ,  Stephen N. Falling

Inventor： James C. Matayabas, Jr. ,  Stephen N. Falling

IPC: C08G65/32 ,  C08G65/14 ,  C08G65/322 ,  C07C43/10 ,  C07C43/13 ,  C08G65/20

CPC classification number: C08G65/14 ,  C08G65/322

Abstract: Disclosed are novel saturated polyether compounds comprised of n units of residue (1) and m units of residue (2), wherein (i) residues (1) and (2) have the structures: ##STR1## (ii) the total value of n+m is 2 to 70 and m/(n+m) is 0.05 to 0.98; (ii) at least 98 percent of the terminal hydroxyl groups of the polyether have the structure: ##STR2## The polyethers are obtained by first polymerizing 3,4-epoxy-1-butene to produce unsaturated polyether precursors comprising residues (1A) and (2A) having the structures: ##STR3## and then hydrogenating the unsaturated polyether precursors. The hydrogenation advantageously is performed in the presence of a nickel hydrogenation catalyst.

Abstract translation: 公开了由n个残基（1）和m个残基（2）组成的新型饱和聚醚化合物，其中（i）残基（1）和（2）具有以下结构：（ⅱ） n + m为2〜70，m /（n + m）为0.05〜0.98。 （ii）聚醚的至少98％的末端羟基具有以下结构：聚醚是通过首先聚合3,4-环氧-1-丁烯制备不饱和聚醚前体而得到的，其包含残基（1A）和（ 2A），具有以下结构：，然后氢化不饱和聚醚前体。 氢化有利地在镍氢化催化剂存在下进行。

公开(公告)号：US5434314A

公开(公告)日：1995-07-18

申请号：US181736

申请日：1994-01-18

Applicant: James C. Matayabas, Jr. ,  Stephen N. Falling

Inventor： James C. Matayabas, Jr. ,  Stephen N. Falling

IPC: C07C43/178 ,  C08G65/02 ,  C08G65/14 ,  C08G65/26 ,  C08G65/28 ,  C07C43/11 ,  C07C43/18

CPC classification number: C07C43/178 ,  C08G65/14 ,  C08G65/26

Abstract: Disclosed are novel polyether compounds obtained by the reaction or polymerization of 3,4-epoxy-1-butene in the presence of an acidic catalyst and a nucleophilic initiator compound. The polyether compounds comprise n units of residue (1) and m units of residue (2), wherein the total value of n+m is 2 to 70, n/(n+m) is a value in the range of 0.70 to 0.95, and residues (1) and (2) have the structures: ##STR1##

Abstract translation: 公开了在酸性催化剂和亲核引发剂化合物的存在下通过3,4-环氧-1-丁烯的反应或聚合获得的新型聚醚化合物。 聚醚化合物包含n个残基（1）单元和m个残基（2），其中n + m的总值为2〜70，n /（n + m）为0.70〜0.95的范围内的值 ，残基（1）和（2）具有以下结构：（1）OCH2CHCHCH2（2）