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公开(公告)号：US20140113131A1
公开(公告)日：2014-04-24
申请号：US14126696
申请日：2012-05-21
发明人： Mitsushi Yamamoto , Keiji Hayashi
CPC分类号： C09J9/00 , B23K26/18 , C08K3/08 , C08K3/10 , C09J7/22 , C09J7/241 , C09J7/255 , C09J2201/606 , C09J2201/622 , C09J2205/106 , C09J2423/006 , C09J2467/006 , Y10T428/28 , Y10T428/2804
摘要： Provided is a pressure-sensitive adhesive film suitable for an application involving cutting with a short-wavelength laser having a center wavelength of 1.0 μm to 1.1 μm. A pressure-sensitive adhesive film 1 according to the present invention comprises a resin film 10 as a substrate, and a pressure-sensitive adhesive layer 20 provided at least on a first face of resin film 10. Substrate 10 has a laser beam absorbance of 20% or higher in a wavelength range of 1000 nm to 1100 nm, and comprises a laser beam-absorbing layer 42 comprising a laser beam-absorbing agent 402 that increases the laser beam absorbance. As laser beam-absorbing agent 402, at least one species selected from a metal powder and a metallic compound powder can be preferably used.
摘要翻译： 提供了适用于涉及用中心波长为1.0μm至1.1μm的短波长激光切割的应用的压敏粘合剂膜。 根据本发明的压敏粘合剂膜1包括作为基底的树脂膜10和至少设置在树脂膜10的第一面上的压敏粘合剂层20.基板10的激光束吸光度为20 在1000nm至1100nm的波长范围内的％或更高，并且包括激光束吸收层42，其包括增加激光束吸光度的激光束吸收剂402。 作为激光束吸收剂402，可以优选使用选自金属粉末和金属化合物粉末中的至少一种。
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公开(公告)号：US20240359140A1
公开(公告)日：2024-10-31
申请号：US18292208
申请日：2022-07-14
CPC分类号： B01D63/107 , B01D53/228 , B01D71/54 , B01D71/70 , B01D2256/10 , B01D2257/504 , B01D2313/143 , B01D2313/146
摘要： The present invention provides a spiral membrane element suitable for suppressing a decrease in a permeation rate of a permeated fluid from a separation membrane. The spiral membrane element of the present invention includes a central tube and a separation membrane that is wound around the central tube. The central tube has an opening for guiding, to an inside of the central tube, a permeated fluid having permeated through the separation membrane. The opening extends in a longitudinal direction of the central tube.
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公开(公告)号：US20240335797A1
公开(公告)日：2024-10-10
申请号：US18575980
申请日：2022-05-16
发明人： Toshiyuki KAWASHIMA , Shunsuke NOMI , Yasuyuki SAKAKIBARA , Jianhua FANG , Jingqiu YU , Xiaoxia GUO
IPC分类号： B01D71/64
CPC分类号： B01D71/641 , B01D2257/504 , B01D2258/06
摘要： An object of the present invention is to provide a gas separation membrane containing a novel sulfonated polyimide and having superior gas separation performance. The gas separation membrane of the present invention contains a sulfonated polyimide represented by the following general formula (1):
wherein Ar is an aryl group, X is more than 0 and 1 or less, and M+ is H+ or a metal cation.-
公开(公告)号：US20240292528A1
公开(公告)日：2024-08-29
申请号：US18444079
申请日：2024-02-16
发明人： Shusaku SHIBATA , Takaya KOUCHI , Teppei NIINO
IPC分类号： H05K1/02
CPC分类号： H05K1/0296
摘要： A wiring circuit board includes a base insulating layer, a conductive layer, and a cover insulating layer. The conductive layer has a terminal and a wiring. The wiring has a body portion and a connecting portion. The connecting portion connects the body portion to the terminal. The cover insulating layer has a cover body portion and a protruding portion. The cover body portion covers the body portion. The protruding portion covers the connecting portion. The protruding portion protrudes from the cover body portion.
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公开(公告)号：US20240291108A1
公开(公告)日：2024-08-29
申请号：US18573979
申请日：2022-06-27
发明人： Kyotaro YAMADA , Yuki TAKEDA , Motoki HAISHI , Kenji FURUTA
IPC分类号： H01M50/451 , H01M50/403 , H01M50/489
CPC分类号： H01M50/451 , H01M50/403 , H01M50/489
摘要： A multilayer body for a battery according to the present invention includes: a separator including a porous base material formed in a plate shape, and an inorganic material layer situated over either or both of opposite principal surfaces of the porous base material; and an organic support over which the separator is laminated.
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公开(公告)号：US12070331B2
公开(公告)日：2024-08-27
申请号：US16977361
申请日：2019-02-28
发明人： Alan Quinn , Colin Gehrig , Denis Greco , Marco Sebastiani
CPC分类号： A61B5/681 , A61B5/01 , A61B5/02416 , A61B5/02438 , A61B5/7445 , A61B2560/0214 , A61B2560/0443 , A61B2562/18 , A61B2562/222 , A61B2562/227
摘要： An aspect of the present disclosure generally relates to a wearable physiological device comprising: (a) a first housing assembly comprising: a first housing body; a first circuit assembly removably coupled to the first housing body; a user interface assembly communicatively connected to the first circuit assembly; and (b) a second housing assembly removably coupled to the first housing assembly, the second housing assembly comprising: a second housing body; a second circuit assembly removably coupled to the second housing body, the second circuit assembly comprising a set of physiological sensors; a removable battery disposed on the second circuit assembly; and a flexible connector communicatively connecting the second circuit assembly to the first circuit assembly, wherein the set of physiological sensors are configured for measuring physiological signals from a user wearing the wearable physiological device, the physiological signals communicable to the user interface assembly.
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公开(公告)号：US20240269780A1
公开(公告)日：2024-08-15
申请号：US18281221
申请日：2022-03-07
发明人： Masatoshi KATO , Ayumi NITTA , Naofumi KOSAKA
IPC分类号： B23K35/02 , B23K35/26 , B23K35/362 , C09J7/35 , C09J9/02 , C09J11/04 , C09J11/06 , C09J163/00 , C22C12/00 , H01R12/52 , H05K3/36
CPC分类号： B23K35/0233 , B23K35/264 , B23K35/362 , C09J7/35 , C09J9/02 , C09J11/04 , C09J11/06 , C09J163/00 , C22C12/00 , H01R12/52 , H05K3/368 , C09J2400/16 , C09J2400/20 , C09J2433/00 , C09J2463/00 , H05K2203/048
摘要： A bonding sheet according to the present invention contains a matrix resin; solder particles; and a fluxing agent. In the bonding sheet, the solder particles are dispersed in the matrix resin, and the fluxing agent is unevenly distributed around the solder particles in the matrix resin. The method for producing the bonding sheet of the present invention includes a first step of dissolving a fluxing agent in a first solvent to prepare a fluxing agent solution; a second step of mixing a second solvent, a matrix resin component, solder particles, and the fluxing agent solution to prepare a mixed composition; and a third step of applying the mixed composition onto a substrate to form a coated film, and then drying the coated film to form a bonding sheet.
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公开(公告)号：US20240263033A1
公开(公告)日：2024-08-08
申请号：US18561059
申请日：2022-05-13
IPC分类号： C09D133/06 , C08F218/08 , C08F220/18 , C09D5/02
CPC分类号： C09D133/064 , C08F218/08 , C08F220/1804 , C09D5/022 , C09D133/062 , C08F2800/10
摘要： Provided is a paint-protective coating material formed from a liquid coating composition. The coating composition comprises, as its base polymer, a polymer (A) that is a polymerization product of monomers comprising an acrylic monomer. The paint-protective coating material has a storage modulus at 70° C. of 0.40 MPa or higher and 1.30 or lower, a storage modulus at 23° C. of 250 MPa or higher and 800 MPa or lower, and a storage modulus at −30° C. of 2300 MPa or less.
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公开(公告)号：US20240260177A1
公开(公告)日：2024-08-01
申请号：US18007388
申请日：2021-05-24
发明人： Kenya TAKIMOTO , Naoki SHIBATA , Hayato TAKAKURA
CPC分类号： H05K1/0298 , H05K3/02
摘要： Provided is a method for producing a wiring circuit board that includes the steps of forming a first metal layer on a metal supporting substrate; forming an insulating layer on the first metal layer; removing a portion of the first metal layer, the portion being exposed at the opening portion of the insulating layer, to expose the metal supporting substrate at the opening portion; forming a second metal layer on a portion of the metal supporting substrate exposed at the opening portion and on the insulating layer; and forming a conductive layer on the second metal layer. A wiring circuit board includes the metal supporting substrate, the first metal layer having a first opening portion, the insulating layer having a second opening portion having an opening along the first opening portion, the second metal layer connected to the metal supporting substrate, and the conductive layer on the second metal layer.
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公开(公告)号：US20240237200A1
公开(公告)日：2024-07-11
申请号：US18557010
申请日：2022-01-26
发明人： Makoto TSUNEKAWA
CPC分类号： H05K1/0296 , H05K3/245 , H05K2201/2018 , H05K2203/0228
摘要： An assembly sheet includes a plurality of wiring circuit boards, a frame, and a reinforcement portion. The wiring circuit board has a support layer, a base insulating layer disposed on a one-surface of the support layer in a thickness direction, and a conductive pattern disposed on a one-surface of the base insulating layer in the thickness direction. The frame supports the wiring circuit board. The reinforcement portion reinforces the frame. The reinforcement portion is disposed on an other-surface of the frame in the thickness direction.
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