-
公开(公告)号：US07943861B2
公开(公告)日：2011-05-17
申请号：US11576987
申请日：2005-03-15
申请人： Tsutomu Iwai , Yoshihiro Kodera , Shinya Maeda , Hiroyuki Watanabe , Kazunari Suzuki , Kiyotaka Tsukada
发明人： Tsutomu Iwai , Yoshihiro Kodera , Shinya Maeda , Hiroyuki Watanabe , Kazunari Suzuki , Kiyotaka Tsukada
IPC分类号： H05K1/11
CPC分类号： H01L23/49816 , H01L21/4853 , H01L23/498 , H01L24/48 , H01L24/73 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2924/00014 , H01L2924/01004 , H01L2924/01012 , H01L2924/01019 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/12041 , H01L2924/15311 , H01L2924/19041 , H05K3/244 , H05K3/3463 , H05K3/4644 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49155 , Y10T29/49156 , Y10T29/49165 , H01L2924/00012 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A composite layer composed of an Ni layer 72 and a Pd layer 73 is formed on a solder pad 77U, and a solder 76α on the composite layer is composed of a solder containing no lead. Because a Pd layer (palladium layer) reduces phenomenons such as repellency of the solder, adhesiveness with the solder can be enhanced. Because a Pd layer has a higher degree of rigidity than a gold layer, thermal stress is absorbed into the Pd layer and buffered so as to reduce the degree of transmission of stress to the solder bump, or to the solder layer, by means of thermal stress.
摘要翻译： 在焊盘77U上形成由Ni层72和Pd层73构成的复合层，复合层上的焊料76α由不含铅的焊料构成。 由于Pd层（钯层）减少诸如焊料排斥性的现象，因此可以提高与焊料的粘合性。 由于Pd层比金层具有更高的刚度，因此热应力被吸收到Pd层中并被缓冲，以便通过热量降低对焊料凸块或焊料层的应力传递程度 强调。
-
公开(公告)号：US08156646B2
公开(公告)日：2012-04-17
申请号：US12494948
申请日：2009-06-30
申请人： Tsutomu Iwai , Yoshihiro Kodera , Shinya Maeda , Hiroyuki Watanabe , Kazunari Suzuki , Kiyotaka Tsukada
发明人： Tsutomu Iwai , Yoshihiro Kodera , Shinya Maeda , Hiroyuki Watanabe , Kazunari Suzuki , Kiyotaka Tsukada
CPC分类号： H01L23/49816 , H01L21/4853 , H01L23/498 , H01L24/48 , H01L24/73 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2924/00014 , H01L2924/01004 , H01L2924/01012 , H01L2924/01019 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/12041 , H01L2924/15311 , H01L2924/19041 , H05K3/244 , H05K3/3463 , H05K3/4644 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49155 , Y10T29/49156 , Y10T29/49165 , H01L2924/00012 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A composite layer composed of an Ni layer and a Pd layer is formed on a solder pad, and a solder on the composite layer is composed of a solder containing no lead. Because a Pd layer (palladium layer) reduces phenomenons such as repellency of the solder, adhesiveness with the solder can be enhanced. Because a Pd layer has a higher degree of rigidity than a gold layer, thermal stress is absorbed into the Pd layer and buffered so as to reduce the degree of transmission of stress to the solder bump, or to the solder layer, by thermal stress.
摘要翻译： 在焊盘上形成由Ni层和Pd层构成的复合层，复合层上的焊料由不含铅的焊料构成。 由于Pd层（钯层）减少诸如焊料排斥性的现象，因此可以提高与焊料的粘合性。 由于Pd层比金层具有更高的刚度，因此热应力被吸收到Pd层中并进行缓冲，从而通过热应力降低对焊料凸块或焊料层的应力传递程度。
-
公开(公告)号：US20080264681A1
公开(公告)日：2008-10-30
申请号：US11576987
申请日：2005-03-15
申请人： Tsutomu Iwai , Yoshihiro Kodera , Shinya Maeda , Hiroyuki Watanabe , Kazunari Suzuki , Kiyotaka Tsukada
发明人： Tsutomu Iwai , Yoshihiro Kodera , Shinya Maeda , Hiroyuki Watanabe , Kazunari Suzuki , Kiyotaka Tsukada
CPC分类号： H01L23/49816 , H01L21/4853 , H01L23/498 , H01L24/48 , H01L24/73 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2924/00014 , H01L2924/01004 , H01L2924/01012 , H01L2924/01019 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/12041 , H01L2924/15311 , H01L2924/19041 , H05K3/244 , H05K3/3463 , H05K3/4644 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49155 , Y10T29/49156 , Y10T29/49165 , H01L2924/00012 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A composite layer composed of an Ni layer and a Pd layer is formed on a solder pad, and a solder on the composite layer is composed of a solder containing no lead. Because a Pd layer (palladium layer) reduces phenomenons such as repellency of the solder, adhesiveness with the solder can be enhanced. Because a Pd layer has a higher degree of rigidity than a gold layer, thermal stress is absorbed into the Pd layer and buffered so as to reduce the degree of transmission of stress to the solder bump, or to the solder layer, by thermal stress.
摘要翻译： 在焊盘上形成由Ni层和Pd层构成的复合层，复合层上的焊料由不含铅的焊料构成。 由于Pd层（钯层）减少诸如焊料排斥性的现象，因此可以提高与焊料的粘合性。 由于Pd层比金层具有更高的刚度，因此热应力被吸收到Pd层中并进行缓冲，从而通过热应力降低对焊料凸块或焊料层的应力传递程度。
-
公开(公告)号：US20090285980A1
公开(公告)日：2009-11-19
申请号：US12494948
申请日：2009-06-30
申请人： Tsutomu IWAI , Yoshihiro Kodera , Shinya Maeda , Hiroyuki Watanabe , Kazunari Suzuki , Kiyotaka Tsukada
发明人： Tsutomu IWAI , Yoshihiro Kodera , Shinya Maeda , Hiroyuki Watanabe , Kazunari Suzuki , Kiyotaka Tsukada
IPC分类号： B05D5/12
CPC分类号： H01L23/49816 , H01L21/4853 , H01L23/498 , H01L24/48 , H01L24/73 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2924/00014 , H01L2924/01004 , H01L2924/01012 , H01L2924/01019 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/12041 , H01L2924/15311 , H01L2924/19041 , H05K3/244 , H05K3/3463 , H05K3/4644 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49155 , Y10T29/49156 , Y10T29/49165 , H01L2924/00012 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A composite layer composed of an Ni layer and a Pd layer is formed on a solder pad, and a solder on the composite layer is composed of a solder containing no lead. Because a Pd layer (palladium layer) reduces phenomenons such as repellency of the solder, adhesiveness with the solder can be enhanced. Because a Pd layer has a higher degree of rigidity than a gold layer, thermal stress is absorbed into the Pd layer and buffered so as to reduce the degree of transmission of stress to the solder bump, or to the solder layer, by thermal stress.
摘要翻译： 在焊盘上形成由Ni层和Pd层构成的复合层，复合层上的焊料由不含铅的焊料构成。 由于Pd层（钯层）减少诸如焊料排斥性的现象，因此可以提高与焊料的粘合性。 由于Pd层比金层具有更高的刚度，因此热应力被吸收到Pd层中并进行缓冲，从而通过热应力降低对焊料凸块或焊料层的应力传递程度。
-
公开(公告)号：US06358630B1
公开(公告)日：2002-03-19
申请号：US09424582
申请日：1999-11-26
申请人： Kiyotaka Tsukada , Hiroyuki Kobayashi , Yoshikazu Ukai , Kenji Chihara , Yoshihide Tohyama , Yasuyoshi Okuda , Yoshihiro Kodera
发明人： Kiyotaka Tsukada , Hiroyuki Kobayashi , Yoshikazu Ukai , Kenji Chihara , Yoshihide Tohyama , Yasuyoshi Okuda , Yoshihiro Kodera
IPC分类号： B32B1501
CPC分类号： H05K3/244 , B23K35/007 , B23K35/262 , H01L23/49816 , H01L24/48 , H01L24/49 , H01L2224/131 , H01L2224/13147 , H01L2224/13155 , H01L2224/13157 , H01L2224/1357 , H01L2224/136 , H01L2224/48091 , H01L2224/48227 , H01L2224/49109 , H01L2924/00013 , H01L2924/00014 , H01L2924/0102 , H01L2924/01039 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/12042 , H01L2924/15153 , H01L2924/1517 , H01L2924/1532 , H01L2924/181 , H05K3/3436 , H05K3/3463 , H05K2201/0215 , H05K2201/10234 , H05K2201/10242 , H05K2201/10992 , H05K2203/041 , H05K2203/0415 , Y02P70/613 , Y10T428/12028 , Y10T428/12701 , Y10T428/12708 , Y10T428/12875 , Y10T428/12903 , Y10T428/12944 , H01L2924/014 , H01L2224/13099 , H01L2924/00 , H01L2224/45015 , H01L2924/207 , H01L2924/00012 , H01L2224/45099 , H01L2224/05599 , H01L2224/85399
摘要： This invention relates to a solder member for external connection joined to a connection terminal formed on a surface of a printed wiring board corresponding to a conductor pattern and having an electroless Ni/Au plated layer, wherein the solder member is a ball-shaped solder containing finely powdered copper and has an excellent joint strength to the connection terminal.
摘要翻译： 本发明涉及一种用于外部连接的焊料构件，其与形成在与导体图案相对应的印刷电路板的表面上的连接端子接合，并且具有无电镀Ni / Au镀层，其中，焊料构件是含有 细铜粉，对连接端子具有优异的接合强度。
-
-
-
-
搜索结果
5 条记录 (耗时 0.014 秒)
