公开(公告)号：US07497003B2

公开(公告)日：2009-03-03

申请号：US10400473

申请日：2003-03-28

申请人： Akira Tanaka ,  Kazuki Honda ,  Koji Sano ,  Tomoko Handa

发明人： Akira Tanaka ,  Kazuki Honda ,  Koji Sano ,  Tomoko Handa

IPC分类号： H04R31/00

CPC分类号： H04R31/00 ,  H04R9/046 ,  H04R31/003 ,  H04R31/006 ,  H04R2209/024 ,  H04R2231/003 ,  Y10T29/49005

摘要： The speaker design support apparatus can reduce time for designing the speaker instead of many design trials, and comprises the input means that a user inputs necessary data for voice coil and for magnetic circuit and for diaphragm, and the calculation means for calculate the speaker characteristic based on the inputted data from the input means, and the display for displaying the calculated results by the calculation means.

摘要翻译： 扬声器设计支持装置可以减少设计扬声器而不是许多设计试验的时间，并且包括输入装置，用户输入音圈和磁路和隔膜的必要数据，以及用于计算扬声器特性的计算装置 对来自输入装置的输入数据和由计算装置显示计算结果的显示。

公开(公告)号：US20220326632A1

公开(公告)日：2022-10-13

申请号：US17657471

申请日：2022-03-31

申请人： Keiji MAKABE ,  Akira Tanaka ,  Hidekazu Kakinuma ,  Tsukiko Takahashi

发明人： Keiji MAKABE ,  Akira Tanaka ,  Hidekazu Kakinuma ,  Tsukiko Takahashi

IPC分类号： G03G9/097 ,  G03G15/08 ,  G03G9/08

摘要： [Object] An object of the invention is to provide a toner that can both achieve a higher level of low temperature fixability and suppression of the toner scattering.
[Means of Achieving the Object]
The disclosure is to provide a toner, including base-particles, and an external-additive, wherein a glass-transition temperature obtained from a DSC-curve at a second-warming of a THF-insoluble component is −50° C. or higher and 10° C. or lower, wherein an average circularity of the toner is 0.975 or more and 0.985 or lower, wherein the toner satisfies the following formula: 1.5≤Bt−0.025−Ct≤3.0, wherein the Bt [m2/g] is a BET-specific-surface area of the toner-particles, and the Ct [%] is a coverage by the external-additive, and, at least a portion of a surface of the external-additive is coated with either an oxide of a metallic element, a hydroxide of the metallic element, or both.

公开(公告)号：US10303072B2

公开(公告)日：2019-05-28

申请号：US15889461

申请日：2018-02-06

申请人： Akira Tanaka ,  Hiroyuki Takeda ,  Junichi Awamura ,  Hiroshi Yamada ,  Daichi Hisakuni ,  Yasuo Kamada

发明人： Akira Tanaka ,  Hiroyuki Takeda ,  Junichi Awamura ,  Hiroshi Yamada ,  Daichi Hisakuni ,  Yasuo Kamada

IPC分类号： G03G9/087 ,  C08G63/42 ,  C08G63/20 ,  G03G15/00 ,  C08G63/195 ,  C08G63/16 ,  C08G63/66 ,  C08G18/75 ,  C08G18/42

摘要： A toner is provided. The toner contains a polyester resin. The toner has a glass transition temperature (Tg1st) at first temperature rising of differential scanning calorimetry (DSC) of from 45° C. to 65° C. The toner includes a component insoluble in tetrahydrofuran (THF) having two glass transition temperatures (Tga1st and Tgb1st) at the first temperature rising of DSC, where Tga1st is in a range of −45° C. to 5° C. and Tgb1st is in a range of 45° C. to 70° C. The toner includes a component soluble in THF having a glass transition temperature (Tg2nd) at second temperature rising of DSC of from 40° C. to 65° C.

公开(公告)号：US08686398B2

公开(公告)日：2014-04-01

申请号：US13599852

申请日：2012-08-30

申请人： Akira Tanaka ,  Yoko Motojima

发明人： Akira Tanaka ,  Yoko Motojima

IPC分类号： H01L29/06

CPC分类号： H01L33/06 ,  H01L33/0079 ,  H01L33/22 ,  H01L33/32 ,  H01L33/38 ,  H01L33/382 ,  H01L33/387 ,  H01L33/405 ,  H01L33/42 ,  H01L2924/0002 ,  H01L2924/00

摘要： A semiconductor light emitting device includes a first conductivity-type first semiconductor layer, a second conductivity-type second semiconductor layer, a semiconductor light emitting layer, and first and second electrodes. The semiconductor light emitting layer is provided between the first semiconductor layer and the second semiconductor layer, and includes a multiple quantum well structure. The quantum well structure includes well layers and barrier layers each laminated alternately, each of the well layers being not less than 6 nm and not more than 10 nm. The first and second electrodes are electrically connected to the first and second semiconductor layers such that current flows in a direction substantially vertical to the main surface.

摘要翻译： 半导体发光器件包括第一导电型第一半导体层，第二导电型第二半导体层，半导体发光层以及第一和第二电极。 半导体发光层设置在第一半导体层和第二半导体层之间，并且包括多量子阱结构。 量子阱结构包括交替层叠的阱层和势垒层，每个阱层不小于6nm且不大于10nm。 第一和第二电极电连接到第一和第二半导体层，使得电流在基本垂直于主表面的方向上流动。

公开(公告)号：US08570240B2

公开(公告)日：2013-10-29

申请号：US12996839

申请日：2008-06-27

申请人： Akira Tanaka ,  Machiko Oouchida ,  Hiroyuki Mori

发明人： Akira Tanaka ,  Machiko Oouchida ,  Hiroyuki Mori

IPC分类号： H01Q1/36

CPC分类号： H04B13/00

摘要： A communication sheet structure for transmitting electromagnetic waves, and thereby performing communication, is characterized in that the communication sheet structure includes a planar base material with a relative dielectric constant at a frequency of from 800 MHz to 10 GHz of from 1.0 to 15.0, and one side of the base material includes conductor A existing portion and non-existing portion, and the other side of the base material includes a conductor B existing over 90% or more thereof. The communication sheet structure enables communication in two dimensions, and the communication sheet structure is extremely excellent in communication performances.

摘要翻译： 用于传送电磁波，从而进行通信的通信片结构的特征在于，通信片结构包括平面基底材料，其相对介电常数在800MHz至10GHz的频率范围为1.0至15.0，一个 基体材料的一侧包括导体A存在部分和不存在部分，并且基材的另一侧包括存在于其中90％以上的导体B. 通信片结构使得能够在二维方面进行通信，并且通信片结构在通信性能方面非常优异。

公开(公告)号：US20130228742A1

公开(公告)日：2013-09-05

申请号：US13599852

申请日：2012-08-30

申请人： Akira Tanaka ,  Yoko Motojima

发明人： Akira Tanaka ,  Yoko Motojima

IPC分类号： H01L33/06

CPC分类号： H01L33/06 ,  H01L33/0079 ,  H01L33/22 ,  H01L33/32 ,  H01L33/38 ,  H01L33/382 ,  H01L33/387 ,  H01L33/405 ,  H01L33/42 ,  H01L2924/0002 ,  H01L2924/00

摘要： A semiconductor light emitting device includes a first conductivity-type first semiconductor layer, a second conductivity-type second semiconductor layer, a semiconductor light emitting layer, and first and second electrodes. The semiconductor light emitting layer is provided between the first semiconductor layer and the second semiconductor layer, and includes a multiple quantum well structure. The quantum well structure includes well layers and barrier layers each laminated alternately, each of the well layers being not less than 6 nm and not more than 10 nm. The first and second electrodes are electrically connected to the first and second semiconductor layers such that current flows in a direction substantially vertical to the main surface.

摘要翻译： 半导体发光器件包括第一导电型第一半导体层，第二导电型第二半导体层，半导体发光层以及第一和第二电极。 半导体发光层设置在第一半导体层和第二半导体层之间，并且包括多量子阱结构。 量子阱结构包括交替层叠的阱层和势垒层，每个阱层不小于6nm且不大于10nm。 第一和第二电极电连接到第一和第二半导体层，使得电流在基本垂直于主表面的方向上流动。

公开(公告)号：US08410473B2

公开(公告)日：2013-04-02

申请号：US13291176

申请日：2011-11-08

申请人： Akira Tanaka

发明人： Akira Tanaka

IPC分类号： H01L29/06

CPC分类号： H01L33/06 ,  B82Y20/00 ,  H01L33/025 ,  H01L33/32 ,  H01S5/309 ,  H01S5/34333

摘要： A light emitting device includes: a first layer made of a semiconductor of a first conductivity type; a second layer made of a semiconductor of a second conductivity type; an active layer including a multiple quantum well provided between the first layer and the second layer, impurity concentration of the first conductivity type in each barrier layer of the multiple quantum well having a generally flat distribution or increasing toward the second layer, average of the impurity concentration in the barrier layer on the second layer side as viewed from each well layer of the multiple quantum well being equal to or greater than average of the impurity concentration in the barrier layer on the first layer side, and average of the impurity concentration in the barrier layer nearest to the second layer being higher than average of the impurity concentration in the barrier layer nearest to the first layer.

摘要翻译： 发光器件包括：由第一导电类型的半导体制成的第一层; 由第二导电类型的半导体制成的第二层; 包括设置在第一层和第二层之间的多量子阱的有源层，多量子阱的每个势垒层中的第一导电类型的杂质浓度具有大致平坦的分布或朝着第二层增加，杂质的平均值 从多量子阱的各阱层观察的第二层侧的阻挡层的浓度等于或大于第一层侧的阻挡层中的杂质浓度的平均值，以及 最靠近第二层的阻挡层高于最靠近第一层的势垒层中的杂质浓度的平均值。

公开(公告)号：US08035212B2

公开(公告)日：2011-10-11

申请号：US12621387

申请日：2009-11-18

申请人： Akira Tanaka ,  Minoru Takizawa ,  Mitsuyoshi Tanimoto ,  Akihiko Happoya

发明人： Akira Tanaka ,  Minoru Takizawa ,  Mitsuyoshi Tanimoto ,  Akihiko Happoya

IPC分类号： H01L23/48

CPC分类号： H01L21/563 ,  H01L23/295 ,  H01L23/3121 ,  H01L24/743 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/10253 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2224/0401

摘要： According to one embodiment, a semiconductor chip mounting body, with an enhanced shock-resistance at portions of the bonding member corresponding to the corners of a semiconductor chip, is provided. The semiconductor chip mounting body includes a circuit board having a circuit pattern formed on a mounting surface thereof, a semiconductor chip mounted on the circuit pattern of the circuit board, and a bonding member arranged at least between the circuit board and the semiconductor chip, and on the sides of the semiconductor chip to fix the semiconductor chip on the circuit board. The bonding member contains thermosetting resin and magnetic powder dispersed in the thermosetting resin. The magnetic powder is locally disposed in portions of the bonding member which is located the corners of the semiconductor chip.

摘要翻译： 根据一个实施例，提供一种半导体芯片安装体，其在与半导体芯片的角部对应的接合部件的部分处具有增强的抗冲击性。 半导体芯片安装体包括电路板，其电路图案形成在其安装表面上，安装在电路板的电路图案上的半导体芯片和至少布置在电路板和半导体芯片之间的接合部件，以及 在半导体芯片的侧面上将半导体芯片固定在电路板上。 接合部件包含分散在热固性树脂中的热固性树脂和磁性粉末。 磁性粉末局部地设置在位于半导体芯片的角部的接合部件的部分中。

公开(公告)号：US08016184B2

公开(公告)日：2011-09-13

申请号：US12887542

申请日：2010-09-22

申请人： Koichi Kanryo ,  Akio Katsube ,  Akira Tanaka

发明人： Koichi Kanryo ,  Akio Katsube ,  Akira Tanaka

IPC分类号： B23K31/02 ,  B05D5/12

CPC分类号： H05K1/0218 ,  H01L23/552 ,  H01L24/97 ,  H01L25/165 ,  H01L25/50 ,  H01L2224/16225 ,  H01L2224/97 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/12041 ,  H01L2924/15159 ,  H01L2924/19105 ,  H05K3/0052 ,  H05K3/284 ,  H05K2201/098 ,  H05K2203/1316 ,  H01L2224/81

摘要： A method for manufacturing an electronic component module is performed such that a shield layer can be formed as a thin film and an electronic component can be effectively shielded. A collective substrate including a plurality of electronic component modules including a plurality of electronic components is batch-sealed with a resin. A cut section is formed from a top surface of the sealed resin to a position that reaches a grounding electrode arranged in the substrate at a boundary section of the electronic component module so as to expose the grounding electrode. A conductive paste is applied on side surfaces and the top surface. Then, a conductive thin film is formed by spin coating, and the electronic component module is cut.

摘要翻译： 执行电子部件模块的制造方法，使得可以形成屏蔽层作为薄膜，并且可以有效地屏蔽电子部件。 包括多个电子部件的多个电子部件模块的集合基板用树脂进行间歇式密封。 切割部从密封树脂的顶表面形成到在电子部件模块的边界部分到达布置在基板中的接地电极的位置，以露出接地电极。 在侧表面和顶表面上施加导电膏。 然后，通过旋涂形成导电性薄膜，切断电子部件模块。

公开(公告)号：US20110130061A1

公开(公告)日：2011-06-02

申请号：US12674561

申请日：2008-10-03

申请人： Akira Tanaka ,  Machiko Oouchida ,  Hiroyuki Mori

发明人： Akira Tanaka ,  Machiko Oouchida ,  Hiroyuki Mori

IPC分类号： D03D15/00

CPC分类号： D03D15/00 ,  D03D1/0041 ,  D03D15/0083 ,  D03D15/0088 ,  D03D15/0094 ,  D06M15/564 ,  D06M15/643 ,  D06M2101/32 ,  D10B2331/04 ,  D10B2401/063 ,  D10B2507/00 ,  D10B2507/04 ,  Y10T442/3065 ,  Y10T442/3504

摘要： The fabric material useful for sports equipment such paragliders, hanggliders and yacht sails is a composite fabric comprising a substrate fabric comprising a woven polyester fiber fabric and an impregnation-adhered layer formed on the substrate fabric and comprising a silicone-copolymerized urethane resin, wherein the substrate fabric has a basis mass of 20-80 g/m2, the impregnation-adhered layer is in an amount of 5-40% by mass based on the mass of the substrate fabric, and the composite fabric has a basis mass of 21-100 g/m2 and an air permeability of 1.0 ml/cm2/s or less.

摘要翻译： 用于运动器材如滑翔伞，吊车和游艇帆布的织物材料是一种复合织物，其包含基底织物，该基底织物包含编织的聚酯纤维织物和形成在基底织物上的浸渍粘附层，并且包含硅氧烷共聚的聚氨酯树脂，其中 基材的基质的质量为20〜80g / m 2，浸渍附着层的质量为基质织物的质量为5〜40质量％，复合织物的质量为21〜 100g / m 2，透气度为1.0ml / cm 2 / s以下。