公开(公告)号：US20110304990A1

公开(公告)日：2011-12-15

申请号：US12884058

申请日：2010-09-16

申请人： Chang Hyun Lim ,  Jung Eun Kang ,  Seog Moon Choi ,  Kwang Soo Kim ,  Sung Keun Park

发明人： Chang Hyun Lim ,  Jung Eun Kang ,  Seog Moon Choi ,  Kwang Soo Kim ,  Sung Keun Park

IPC分类号： H05K7/20 ,  B32B38/04 ,  B32B38/10 ,  H05K1/00 ,  B32B37/02

CPC分类号： H05K1/0203 ,  H05K1/053 ,  H05K1/141 ,  H05K2201/062 ,  H05K2201/09745 ,  H05K2201/10166 ,  Y10T29/49083 ,  Y10T29/49124 ,  Y10T29/49155 ,  Y10T156/10 ,  Y10T156/1056 ,  Y10T156/1064

摘要： Disclosed herein are a heat-radiating substrate and a method of manufacturing the same. The heat-radiating substrate includes: a core layer including a core metal layer and a core insulating layer formed on the core metal layer and divided into a first region and a second region; a circuit layer formed in the first region of the core layer; a build-up layer formed in the second region of the core layer and including a build-up insulating layer and a build-up circuit layer; an adhesive layer formed between the second region of the core layer and the build-up layer; and an impregnation device mounted on the build-up layer to be impregnated into the adhesive layer. A heat generating element is mounted on the circuit layer and a thermally weakened element is mounted on the build-up layer, thereby preventing the thermally weakened element from being damaged by heat of the heat generating element. The impregnation device is formed on the build-up layer and is impregnated into the adhesive layer, thereby efficiently utilizing a space.

摘要翻译： 这里公开了散热基板及其制造方法。 散热基板包括：芯层，其包括芯金属层和形成在芯金属层上的芯绝缘层，并分为第一区域和第二区域; 形成在芯层的第一区域中的电路层; 形成在所述芯层的所述第二区域中的堆积层，并且包括积聚绝缘层和积聚电路层; 形成在芯层的第二区域和积层之间的粘合层; 以及安装在堆积层上以浸渍到粘合剂层中的浸渍装置。 发热元件安装在电路层上，并且热增强元件安装在积层上，从而防止热弱化元件被发热元件的热​​量损坏。 浸渍装置形成在堆积层上并浸渍在粘合剂层中，从而有效地利用空间。

公开(公告)号：US08315056B2

公开(公告)日：2012-11-20

申请号：US12884058

申请日：2010-09-16

申请人： Chang Hyun Lim ,  Jung Eun Kang ,  Seog Moon Choi ,  Kwang Soo Kim ,  Sung Keun Park

发明人： Chang Hyun Lim ,  Jung Eun Kang ,  Seog Moon Choi ,  Kwang Soo Kim ,  Sung Keun Park

IPC分类号： H05K7/20 ,  H05K1/03

CPC分类号： H05K1/0203 ,  H05K1/053 ,  H05K1/141 ,  H05K2201/062 ,  H05K2201/09745 ,  H05K2201/10166 ,  Y10T29/49083 ,  Y10T29/49124 ,  Y10T29/49155 ,  Y10T156/10 ,  Y10T156/1056 ,  Y10T156/1064

摘要： Disclosed herein are a heat-radiating substrate and a method of manufacturing the same. The heat-radiating substrate includes: a core layer including a core metal layer and a core insulating layer formed on the core metal layer and divided into a first region and a second region; a circuit layer formed in the first region of the core layer; a build-up layer formed in the second region of the core layer and including a build-up insulating layer and a build-up circuit layer; an adhesive layer formed between the second region of the core layer and the build-up layer; and an impregnation device mounted on the build-up layer to be impregnated into the adhesive layer. A heat generating element is mounted on the circuit layer and a thermally weakened element is mounted on the build-up layer, thereby preventing the thermally weakened element from being damaged by heat of the heat generating element. The impregnation device is formed on the build-up layer and is impregnated into the adhesive layer, thereby efficiently utilizing a space.

摘要翻译： 这里公开了散热基板及其制造方法。 散热基板包括：芯层，其包括芯金属层和形成在芯金属层上的芯绝缘层，并分为第一区域和第二区域; 形成在芯层的第一区域中的电路层; 形成在所述芯层的所述第二区域中的堆积层，并且包括积聚绝缘层和积聚电路层; 形成在芯层的第二区域和积层之间的粘合层; 以及安装在堆积层上以浸渍到粘合剂层中的浸渍装置。 发热元件安装在电路层上，并且热增强元件安装在积层上，从而防止热弱化元件被发热元件的热​​量损坏。 浸渍装置形成在堆积层上并浸渍在粘合剂层中，从而有效地利用空间。

公开(公告)号：US20120000697A1

公开(公告)日：2012-01-05

申请号：US12954416

申请日：2010-11-24

申请人： Jung Eun Kang ,  Seog Moon Choi ,  Sung Keun Park ,  Chang Hyun Lim ,  Kwang Soo Kim

发明人： Jung Eun Kang ,  Seog Moon Choi ,  Sung Keun Park ,  Chang Hyun Lim ,  Kwang Soo Kim

IPC分类号： H05K1/03 ,  H05K3/02 ,  H05K1/02

CPC分类号： H05K1/053 ,  H01L23/13 ,  H01L23/142 ,  H01L23/498 ,  H01L2224/73265 ,  H01L2924/13034 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H05K3/107 ,  H05K3/108 ,  H05K2201/10166 ,  H05K2203/0315 ,  H05K2203/0369 ,  H01L2924/00 ,  H01L2924/00014

摘要： Disclosed herein is a printed circuit board, including: a substrate having a cavity formed therein; an anodic oxide layer formed by anodizing the substrate; and a circuit layer formed in the cavity. The printed circuit board is advantageous in that, since a circuit layer is formed in a cavity of a substrate, a circuit layer having a thickness necessary for realizing a high-power semiconductor package can be easily formed, and the difficulty of supplying and demanding the raw material of a thick film plating resist can be overcome. Further, the printed circuit board is advantageous in that electrical shorts occurring at the time of forming a thick circuit layer and electrical shorts generated by the compounds remaining after etching can be prevented, thus improving the electrical reliability and stability of a circuit layer.

摘要翻译： 本文公开了一种印刷电路板，包括：其中形成有腔的基板; 通过阳极氧化所述基板形成的阳极氧化层; 以及形成在空腔中的电路层。 印刷电路板的优点在于，由于电路层形成在基板的空腔中，所以可以容易地形成具有实现大功率半导体封装所需的厚度的电路层，并且难以供应和要求 可以克服厚膜电镀抗蚀剂的原料。 此外，印刷电路板的优点在于，可以防止在形成厚电路层时发生的电短路和蚀刻后残留的化合物产生的电短路，从而提高电路层的电可靠性和稳定性。

公开(公告)号：US08502374B2

公开(公告)日：2013-08-06

申请号：US13281285

申请日：2011-10-25

申请人： Kwang Soo Kim ,  Young Ki Lee ,  Sung Keun Park ,  Seog Moon Choi ,  Chang Hyun Lim

发明人： Kwang Soo Kim ,  Young Ki Lee ,  Sung Keun Park ,  Seog Moon Choi ,  Chang Hyun Lim

IPC分类号： H01L23/34

CPC分类号： H01L23/49575 ,  H01L23/3107 ,  H01L23/3142 ,  H01L23/4334 ,  H01L23/49531 ,  H01L24/48 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2924/00014 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： Disclosed herein are a power module package and a method for manufacturing the same. The power module package includes: a base substrate having grooves formed between a plurality of semiconductor device mounting areas; semiconductor devices mounted on the semiconductor device mounting areas of the base substrate; and a molding formed on the base substrate and in inner portions of the grooves.

摘要翻译： 这里公开了功率模块封装及其制造方法。 功率模块封装包括：具有形成在多个半导体器件安装区域之间的沟槽的基底基板; 安装在基底基板的半导体器件安装区域上的半导体器件; 以及形成在基底基板上和凹槽的内部中的模制件。

公开(公告)号：US20110284382A1

公开(公告)日：2011-11-24

申请号：US12868071

申请日：2010-08-25

申请人： Sung Keun Park ,  Sang Hyun Shin ,  Kwang Soo Kim ,  Seog Moon Choi

发明人： Sung Keun Park ,  Sang Hyun Shin ,  Kwang Soo Kim ,  Seog Moon Choi

IPC分类号： C25D5/02 ,  C25D7/00

CPC分类号： H05K1/0256 ,  C23C26/00 ,  C25D5/02 ,  C25D5/48 ,  C25D7/123 ,  C25D11/02 ,  C25D11/18 ,  C25D11/20 ,  C25D11/24 ,  H01L21/4846 ,  H01L23/142 ,  H01L23/49894 ,  H01L25/0655 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/13034 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/19107 ,  H05K1/053 ,  H05K3/06 ,  H05K3/108 ,  H05K2203/0315 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/00012

摘要： Disclosed herein is a printed circuit board, including: a metal substrate; an anodic oxide layer formed by anodizing the metal substrate; circuit layers formed on the anodic oxide layer; and a first sol-gel layer formed by applying a photocatalytic material between circuit wirings of the circuit layers and then curing the applied photocatalytic material. The printed circuit board is advantageous in that it can be realized into a high-voltage package printed circuit board because a sol-gel layer is formed between circuit wirings of circuit layers.

摘要翻译： 这里公开了一种印刷电路板，包括：金属基板; 通过阳极氧化金属基材形成的阳极氧化层; 形成在阳极氧化层上的电路层; 以及通过在电路层的电路布线之间施加光催化材料然后固化所施加的光催化材料而形成的第一溶胶 - 凝胶层。 印刷电路板的优点在于，由于在电路层的电路布线之间形成溶胶 - 凝胶层，所以可以实现为高压封装印刷电路板。

公开(公告)号：US08941220B2

公开(公告)日：2015-01-27

申请号：US13484160

申请日：2012-05-30

申请人： Kwang Soo Kim ,  Young Ki Lee ,  Seog Moon Choi ,  Sung Keun Park

发明人： Kwang Soo Kim ,  Young Ki Lee ,  Seog Moon Choi ,  Sung Keun Park

IPC分类号： H01L23/495 ,  H01L23/433 ,  H01L23/498 ,  H01L23/31 ,  H01L23/00 ,  H01L25/065

CPC分类号： H01L23/4334 ,  H01L23/3121 ,  H01L23/49531 ,  H01L23/49575 ,  H01L23/49833 ,  H01L24/16 ,  H01L24/48 ,  H01L25/0652 ,  H01L25/0655 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48463 ,  H01L2224/4847 ,  H01L2924/00014 ,  H01L2924/13034 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： Disclosed herein is a power module package, including: a first substrate having first semiconductor chips mounted thereon; and a second substrate having second semiconductor chips mounted thereon, the second substrate being coupled with the first substrate such that a side surface in a thickness direction thereof is disposed on an upper surface of the first substrate.

摘要翻译： 本文公开了一种功率模块封装，包括：第一衬底，其上安装有第一半导体芯片; 以及具有安装在其上的第二半导体芯片的第二基板，所述第二基板与所述第一基板结合，使得其厚度方向的侧表面设置在所述第一基板的上表面上。

公开(公告)号：US20120319260A1

公开(公告)日：2012-12-20

申请号：US13484160

申请日：2012-05-30

申请人： Kwang Soo Kim ,  Young Ki Lee ,  Seog Moon Choi ,  Sung Keun Park

发明人： Kwang Soo Kim ,  Young Ki Lee ,  Seog Moon Choi ,  Sung Keun Park

IPC分类号： H01L23/495

CPC分类号： H01L23/4334 ,  H01L23/3121 ,  H01L23/49531 ,  H01L23/49575 ,  H01L23/49833 ,  H01L24/16 ,  H01L24/48 ,  H01L25/0652 ,  H01L25/0655 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48463 ,  H01L2224/4847 ,  H01L2924/00014 ,  H01L2924/13034 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： Disclosed herein is a power module package, including: a first substrate having first semiconductor chips mounted thereon; and a second substrate having second semiconductor chips mounted thereon, the second substrate being coupled with the first substrate such that a side surface in a thickness direction thereof is disposed on an upper surface of the first substrate.

摘要翻译： 本文公开了一种功率模块封装，包括：第一衬底，其上安装有第一半导体芯片; 以及具有安装在其上的第二半导体芯片的第二基板，所述第二基板与所述第一基板结合，使得其厚度方向的侧表面设置在所述第一基板的上表面上。

公开(公告)号：US20130009290A1

公开(公告)日：2013-01-10

申请号：US13247603

申请日：2011-09-28

申请人： Chang Hyun Lim ,  Young Ki Lee ,  Kwang Soo Kim ,  Seog Moon Choi

发明人： Chang Hyun Lim ,  Young Ki Lee ,  Kwang Soo Kim ,  Seog Moon Choi

IPC分类号： H01L25/065 ,  H01L21/98

CPC分类号： H01L23/49575 ,  H01L23/3107 ,  H01L23/4334 ,  H01L23/49531 ,  H01L23/49551 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L25/071 ,  H01L25/50 ,  H01L2224/291 ,  H01L2224/29187 ,  H01L2224/29188 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/45139 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48463 ,  H01L2224/4847 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/13034 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/15311 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599

摘要： Disclosed herein is a power module package including: a first substrate; a second substrate having a pad for connection to the first substrate formed on one side or both sides of one surface thereof and having external connection terminals for connection to the outside formed on the other surface thereof; and a lead frame having one end bonded to the first substrate and the other end bonded to the pad of the second substrate to thereby vertically connect the first and second substrates to each other.

摘要翻译： 本文公开了一种功率模块封装，包括：第一基板; 第二基板，其具有用于连接到其一个表面的一侧或两侧上的第一基板的焊盘，并且具有用于连接到形成在其另一个表面上的外部的外部连接端子; 以及引线框架，其一端接合到第一基板，另一端接合到第二基板的焊盘，从而使第一和第二基板彼此垂直连接。

公开(公告)号：US08664755B2

公开(公告)日：2014-03-04

申请号：US13247603

申请日：2011-09-28

申请人： Chang Hyun Lim ,  Young Ki Lee ,  Kwang Soo Kim ,  Seog Moon Choi

发明人： Chang Hyun Lim ,  Young Ki Lee ,  Kwang Soo Kim ,  Seog Moon Choi

IPC分类号： H01L23/495 ,  H01L21/00

CPC分类号： H01L23/49575 ,  H01L23/3107 ,  H01L23/4334 ,  H01L23/49531 ,  H01L23/49551 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L25/071 ,  H01L25/50 ,  H01L2224/291 ,  H01L2224/29187 ,  H01L2224/29188 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/45139 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48463 ,  H01L2224/4847 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/13034 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/15311 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599

摘要： Disclosed herein is a power module package including: a first substrate; a second substrate having a pad for connection to the first substrate formed on one side or both sides of one surface thereof and having external connection terminals for connection to the outside formed on the other surface thereof; and a lead frame having one end bonded to the first substrate and the other end bonded to the pad of the second substrate to thereby vertically connect the first and second substrates to each other.

摘要翻译： 本文公开了一种功率模块封装，包括：第一基板; 第二基板，其具有用于连接到其一个表面的一侧或两侧上的第一基板的焊盘，并且具有用于连接到形成在其另一个表面上的外部的外部连接端子; 以及引线框架，其一端接合到第一基板，另一端接合到第二基板的焊盘，从而将第一和第二基板彼此垂直连接。

公开(公告)号：US20130020111A1

公开(公告)日：2013-01-24

申请号：US13253866

申请日：2011-10-05

申请人： Kyu Hwan Oh ,  Jong Man Kim ,  Seog Moon Choi ,  Young Hoon Kwak ,  Kwang Soo Kim ,  Young Ki Lee

发明人： Kyu Hwan Oh ,  Jong Man Kim ,  Seog Moon Choi ,  Young Hoon Kwak ,  Kwang Soo Kim ,  Young Ki Lee

IPC分类号： H05K1/05 ,  H05K1/02 ,  H05K3/10 ,  H05K1/00

CPC分类号： H05K1/053 ,  H01L23/142 ,  H01L2924/0002 ,  H05K2203/0315 ,  Y10T29/49155 ,  H01L2924/00

摘要： Disclosed herein are a substrate for a power module package and a method for manufacturing the same, including: a base substrate made of a metal material; an anodized layer formed on the base substrate; and a circuit layer formed on the anodized layer, wherein the anodized layer is formed to correspond to circuit patterns on the circuit layer or is formed to be divided into a plurality of areas.

摘要翻译： 本文公开了一种用于功率模块封装的基板及其制造方法，包括：由金属材料制成的基底; 形成在基底基板上的阳极化层; 以及形成在所述阳极氧化层上的电路层，其中所述阳极化层形成为对应于所述电路层上的电路图案，或者形成为被划分为多个区域。