公开(公告)号：US20080054476A1

公开(公告)日：2008-03-06

申请号：US11976629

申请日：2007-10-26

申请人： Frank Egitto ,  Stephen Krasniak ,  John Lauffer ,  Voya Markovich ,  Luis Matienzo

发明人： Frank Egitto ,  Stephen Krasniak ,  John Lauffer ,  Voya Markovich ,  Luis Matienzo

IPC分类号： H01L23/52

CPC分类号： H05K3/384 ,  H05K1/056 ,  H05K3/386 ,  H05K2201/0355 ,  H05K2201/0358 ,  H05K2203/0353 ,  H05K2203/0723

摘要： A circuitized substrate with a conductive layer which assures enhanced adhesion of the layer to selected dielectric layers used to form the circuitized substrate. The conductive layer includes at least one surface with the appropriate roughness to enable such adhesion and also good signal passage if the layer is used as a signal layer.

摘要翻译： 具有导电层的电路化衬底，其确保该层对用于形成电路化衬底的所选介电层的附着力增强。 导电层包括具有适当粗糙度的至少一个表面以实现这种粘附，并且如果该层用作信号层，则还具有良好的信号通过。

公开(公告)号：US20060121738A1

公开(公告)日：2006-06-08

申请号：US11327493

申请日：2006-01-09

申请人： Frank Egitto ,  Stephen Krasniak ,  John Lauffer ,  Voya Markovich ,  Luis Matienzo

发明人： Frank Egitto ,  Stephen Krasniak ,  John Lauffer ,  Voya Markovich ,  Luis Matienzo

IPC分类号： H01L21/311 ,  C25D5/10

CPC分类号： H05K3/384 ,  H05K1/056 ,  H05K3/386 ,  H05K2201/0355 ,  H05K2201/0358 ,  H05K2203/0353 ,  H05K2203/0723

摘要： A method of treating a conductive layer to assure enhanced adhesion of the layer to selected dielectric layers used to form a circuitized substrate. The conductive layer includes at least one surface with the appropriate roughness to enable such adhesion and also good signal passage if the layer is used as a signal layer. The method is extendible to the formation of such substrates, including to the formation of multilayered substrates having many conductive and dielectric layers. Such substrates may include one or more electrical components (e.g., semiconductor chips) mounted thereon and may also be mounted themselves onto other substrates.

摘要翻译： 一种处理导电层以确保该层对用于形成电路化基底的所选介电层的附着力的方法。 导电层包括具有适当粗糙度的至少一个表面以实现这种粘附，并且如果该层用作信号层，则还具有良好的信号通过。 该方法可扩展到形成这种衬底，包括形成具有许多导电和电介质层的多层衬底。 这样的基板可以包括安装在其上的一个或多个电气部件（例如，半导体芯片），并且也可以将它们本身安装到其它基板上。

公开(公告)号：US20070006452A1

公开(公告)日：2007-01-11

申请号：US11177413

申请日：2005-07-11

申请人： Frank Egitto ,  Voya Markovich ,  Luis Matienzo

发明人： Frank Egitto ,  Voya Markovich ,  Luis Matienzo

IPC分类号： B32B37/00 ,  H05K3/30

CPC分类号： H05K3/462 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01087 ,  H01L2924/15311 ,  H01L2924/16195 ,  H01L2924/3011 ,  H05K3/4069 ,  H05K3/429 ,  H05K3/445 ,  H05K2201/015 ,  H05K2201/0245 ,  H05K2201/09536 ,  H05K2201/096 ,  H05K2201/10378 ,  H05K2203/1152 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49147 ,  Y10T29/49155 ,  Y10T29/49163 ,  Y10T29/49165 ,  Y10T156/1056 ,  Y10T156/1062

摘要： A method of making a circuitized substrate which includes a high temperature dielectric material in combination with a low temperature conductive paste, the paste including an organic binder component and at least one metallic component. The flakes of the metallic component are sintered to form a conductive path through the dielectric when the dielectric is used as a layer in the substrate.

摘要翻译： 一种制造电路化基板的方法，该基板包括与低温导电浆料组合的高温电介质材料，所述糊料包括有机粘合剂成分和至少一种金属成分。 当电介质用作衬底中的层时，金属部件的薄片被烧结以形成通过电介质的导电路径。

公开(公告)号：US20070007032A1

公开(公告)日：2007-01-11

申请号：US11177442

申请日：2005-07-11

申请人： Frank Egitto ,  Voya Markovich ,  Luis Matienzo

发明人： Frank Egitto ,  Voya Markovich ,  Luis Matienzo

IPC分类号： H05K1/03 ,  H05K1/09 ,  H05K1/11

CPC分类号： H05K3/462 ,  H05K3/4069 ,  H05K3/429 ,  H05K3/445 ,  H05K2201/015 ,  H05K2201/0245 ,  H05K2201/09536 ,  H05K2201/096 ,  H05K2201/10378 ,  H05K2203/1152 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49165

摘要： A circuitized substrate which includes a high temperature dielectric material in combination with a low temperature conductive paste, the paste including an organic binder component and at least one metallic component. The flakes of the metallic component are sintered to form a conductive path through the dielectric when the dielectric is used as a layer in the substrate.

摘要翻译： 一种电路化基板，包括与低温导电浆料组合的高温电介质材料，所述糊料包括有机粘合剂成分和至少一种金属成分。 当电介质用作衬底中的层时，金属部件的薄片被烧结以形成通过电介质的导电路径。

公开(公告)号：US20080022520A1

公开(公告)日：2008-01-31

申请号：US11905188

申请日：2007-09-28

申请人： Frank Egitto ,  Voya Markovich ,  Luis Matienzo

发明人： Frank Egitto ,  Voya Markovich ,  Luis Matienzo

IPC分类号： H05K3/36 ,  H05K3/20

CPC分类号： H05K3/462 ,  H05K3/4069 ,  H05K3/429 ,  H05K3/445 ,  H05K2201/015 ,  H05K2201/0245 ,  H05K2201/09536 ,  H05K2201/096 ,  H05K2201/10378 ,  H05K2203/1152 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49165

摘要： A method of making a multilayered circuitized substrate assembly which includes bonding at least two circuitized substrates each including at least one layer of high temperature dielectric material, one of these layers in turn including at least one thru-hole therein having therein a quantity of a a low temperature conductive paste, the paste including an organic binder component and at least one metallic component. The flakes of the metallic component are sintered during the bonding to form a conductive path through the dielectric of one of the substrates.

摘要翻译： 一种制造多层电路化基板组件的方法，该方法包括粘合至少两个电路化基板，每个电路基板包括至少一层高温介电材料，这些层中的一个依次包括至少一个其中具有一定数量的低电介质材料的通孔 所述膏体包含有机粘合剂成分和至少一种金属成分。 金属部件的薄片在接合期间被烧结以形成通过其中一个基板的电介质的导电路径。

公开(公告)号：US20080105457A1

公开(公告)日：2008-05-08

申请号：US12007178

申请日：2008-01-08

申请人： Frank Egitto ,  Voya Markovich ,  Luis Matienzo

发明人： Frank Egitto ,  Voya Markovich ,  Luis Matienzo

IPC分类号： H05K1/03

CPC分类号： H05K3/462 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01087 ,  H01L2924/15311 ,  H01L2924/16195 ,  H01L2924/3011 ,  H05K3/4069 ,  H05K3/429 ,  H05K3/445 ,  H05K2201/015 ,  H05K2201/0245 ,  H05K2201/09536 ,  H05K2201/096 ,  H05K2201/10378 ,  H05K2203/1152 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49147 ,  Y10T29/49155 ,  Y10T29/49163 ,  Y10T29/49165 ,  Y10T156/1056 ,  Y10T156/1062

摘要： A circuitized substrate which includes a high temperature dielectric material in combination with a low temperature conductive paste, the paste including an organic binder component and at least one metallic component. The flakes of the metallic component are sintered to form a conductive path through the dielectric when the dielectric is used as a layer in the substrate.

摘要翻译： 一种电路化基板，包括与低温导电浆料组合的高温电介质材料，所述糊料包括有机粘合剂成分和至少一种金属成分。 当电介质用作衬底中的层时，金属部件的薄片被烧结以形成通过电介质的导电路径。

公开(公告)号：US20050064199A1

公开(公告)日：2005-03-24

申请号：US10985455

申请日：2004-11-10

申请人： Frank Egitto ,  Luis Matienzo

发明人： Frank Egitto ,  Luis Matienzo

IPC分类号： C08J5/12 ,  H01L21/312 ,  H01L21/316 ,  H01L21/768 ,  B32B9/04

CPC分类号： H01L21/02164 ,  C08J5/12 ,  C08J2379/08 ,  H01L21/02118 ,  H01L21/022 ,  H01L21/02205 ,  H01L21/02211 ,  H01L21/02216 ,  H01L21/02304 ,  H01L21/312 ,  H01L21/31612 ,  H01L21/76801 ,  H01L21/76825 ,  H01L21/76826 ,  Y10T428/31504 ,  Y10T428/31507 ,  Y10T428/31511 ,  Y10T428/31551 ,  Y10T428/31598 ,  Y10T428/31667 ,  Y10T428/31721 ,  Y10T428/31855

摘要： A method for improving the adhesion between polyimide layers and the structure formed by the method. A silicon oxide-containing layer is formed on the surface of a polyimide layer and a second layer of polyimide is formed on the silicon oxide-containing layer.

摘要翻译： 一种改善聚酰亚胺层之间的粘合性的方法和通过该方法形成的结构。 在聚酰亚胺层的表面上形成含氧化硅的层，在含氧化硅的层上形成第二层聚酰亚胺。

公开(公告)号：US20060197065A1

公开(公告)日：2006-09-07

申请号：US11072193

申请日：2005-03-04

申请人： Michael Gaynes ,  Jeffrey Gelorme ,  Luis Matienzo ,  Rebecca Northey ,  Michael Vincent

发明人： Michael Gaynes ,  Jeffrey Gelorme ,  Luis Matienzo ,  Rebecca Northey ,  Michael Vincent

IPC分类号： B32B3/00

CPC分类号： C09J163/00 ,  C08L63/00 ,  C09J9/02 ,  H05K1/095 ,  H05K3/321 ,  H05K3/4069 ,  H05K2203/122 ,  Y10T156/10 ,  Y10T428/24917

摘要： An electrically conductive adhesive (ECA) with low and stable contact resistance includes at least one melt-processable reactive resin, at least one reactive diluent, at least one rheological additive, copper particles, at least one curing agent and at least one organic acid catalyst. The ECA is useful for filling vias, and bonding together components of electronic circuit structures. It is emphasized that this abstract is provided to comply with the rules requiring an abstract which will allow a searcher or other reader quickly to ascertain the subject matter of the technical disclosure. It is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the appended issued claims. 37 CFR §1.72(b).

摘要翻译： 具有低且稳定的接触电阻的导电粘合剂（ECA）包括至少一种可熔融加工的反应性树脂，至少一种反应性稀释剂，至少一种流变助剂，铜颗粒，至少一种固化剂和至少一种有机酸催化剂 。 ECA可用于填充通孔，并将电子电路结构的组件结合在一起。 要强调的是，该摘要被提供以符合要求抽象的规则，这将允许搜索者或其他读者快速地确定技术公开的主题。 提交它的理解是，它不会用于解释或限制所附权利要求的范围或含义。 37 CFR§1.72（b）。