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公开(公告)号:US3506880A
公开(公告)日:1970-04-14
申请号:US3506880D
申请日:1969-01-29
Applicant: IBM
Inventor: LANGDON JACK L , PECORARO RAYMOND P
IPC: H01L21/00 , H01L23/29 , H01L23/485 , H01L23/58 , H01L19/00
CPC classification number: H01L23/585 , H01L21/00 , H01L23/291 , H01L23/485 , H01L24/11 , H01L2224/05124 , H01L2224/05147 , H01L2224/05155 , H01L2224/05166 , H01L2224/05171 , H01L2224/05644 , Y10T29/49204 , H01L2924/00014
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2.Carrier lifetime killer doping process for semiconductor structures and the product formed thereby 失效
Title translation: 用于半导体结构的载体生物杀灭剂过程及其形成的产物公开(公告)号:US3473976A
公开(公告)日:1969-10-21
申请号:US3473976D
申请日:1966-03-31
Applicant: IBM
Inventor: CASTRUCCI PAUL P , HESS MARTIN S , PECORARO RAYMOND P
IPC: H01L21/00 , H01L21/316 , H01L21/761 , H01L21/82 , H01L27/07 , H01L7/36
CPC classification number: H01L27/0761 , H01L21/00 , H01L21/02238 , H01L21/02255 , H01L21/31662 , H01L21/761 , H01L21/82 , H01L27/0755 , Y10S148/037 , Y10S148/049 , Y10S148/05 , Y10S148/062 , Y10S148/115
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公开(公告)号:US3266127A
公开(公告)日:1966-08-16
申请号:US34034464
申请日:1964-01-27
Applicant: IBM
Inventor: HARDING WILLIAM E , LANGDON JACK L , PECORARO RAYMOND P
IPC: H01L21/00 , H01L23/485
CPC classification number: H01L21/00 , H01L23/485 , H01L2924/0002 , Y10S148/033 , Y10S428/929 , Y10T29/49149 , Y10T428/12528 , Y10T428/12611 , Y10T428/12736 , H01L2924/00
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4.Monolithic integrated memory array structure including fabrication and package therefor 失效
Title translation: 单片集成存储器阵列结构,包括其制造和封装公开(公告)号:US3508209A
公开(公告)日:1970-04-21
申请号:US3508209D
申请日:1966-03-31
Applicant: IBM
Inventor: AGUSTA BENJAMIN , BARDELL PAUL H , CASTRUCCI PAUL P , HENLE ROBERT A , PECORARO RAYMOND P
CPC classification number: H03K3/288 , G11C11/4113 , H03K3/286
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5.Semiconductor device having compensated barrier zones between n-p junctions 失效
Title translation: 具有N-P结之间的补偿障碍区的半导体器件公开(公告)号:US3473093A
公开(公告)日:1969-10-14
申请号:US3473093D
申请日:1965-08-18
Applicant: IBM
Inventor: BILOUS OREST , MEULEMANS DARRELL R , PECORARO RAYMOND P , SELBY MICHAEL C
IPC: H01L29/73 , H01L21/00 , H01L21/331 , H01L23/485 , H01L27/00 , H01L29/00 , H01L29/861 , H01L3/00 , H01L5/00
CPC classification number: H01L27/00 , H01L21/00 , H01L23/485 , H01L29/00 , H01L2924/0002 , H01L2924/3011 , Y10S148/035 , Y10S148/062 , Y10S148/085 , Y10S438/904 , Y10S438/919 , H01L2924/00
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6.
公开(公告)号:US3445734A
公开(公告)日:1969-05-20
申请号:US3445734D
申请日:1965-12-22
Applicant: IBM
Inventor: PECORARO RAYMOND P , BILOUS OREST
IPC: H01L21/74 , H01L27/00 , H01L29/00 , H01L29/735 , H01L11/00
CPC classification number: H01L29/735 , H01L21/74 , H01L27/00 , H01L29/00 , Y10S148/037 , Y10S148/049 , Y10S148/053 , Y10S148/106 , Y10S148/145
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7.
公开(公告)号:US3431472A
公开(公告)日:1969-03-04
申请号:US3431472D
申请日:1967-10-17
Applicant: IBM
Inventor: CASTRUCCI PAUL P , PECORARO RAYMOND P
IPC: H01L21/00 , H01L21/603 , H01L3/00 , H01L5/00
CPC classification number: H01L21/00 , H01L24/80 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01033 , H01L2924/01046 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322
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公开(公告)号:US3429029A
公开(公告)日:1969-02-25
申请号:US3429029D
申请日:1963-06-28
Applicant: IBM
Inventor: LANGDON JACK L , PECORARO RAYMOND P
CPC classification number: H01L23/585 , H01L21/00 , H01L23/291 , H01L23/485 , H01L24/11 , H01L2224/05124 , H01L2224/05147 , H01L2224/05155 , H01L2224/05166 , H01L2224/05171 , H01L2224/05644 , H01L2924/00014
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公开(公告)号:US3401055A
公开(公告)日:1968-09-10
申请号:US42258664
申请日:1964-12-31
Applicant: IBM
Inventor: LANGDON JACK L , CLARENCE KARAN , PECORARO RAYMOND P , TOTTA PAUL A
IPC: B23K35/00 , C23C14/04 , H01L21/60 , H01L23/485
CPC classification number: H01L24/11 , B23K35/001 , C23C14/042 , H01L23/485 , H01L2224/05144 , H01L2224/05147 , H01L2224/05171 , H01L2224/056 , H01L2224/13099 , H01L2924/01006 , H01L2924/01013 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01073 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/351 , H01L2924/00 , H01L2924/00014
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