公开(公告)号：US20190391386A1

公开(公告)日：2019-12-26

申请号：US16464257

申请日：2016-12-27

Applicant: Intel Corporation

Inventor： Kyle Yazzie ,  Anna M. Prakash ,  Suriyakala Ramalingam ,  Liwei Wang ,  Robert Starkston ,  Arnab Choudhury ,  Sandeep S. Iyer ,  Amanuel M. Abebaw ,  Nick Labanok

IPC: G02B26/08 ,  B81C3/00

Abstract: Aspects of the embodiments are directed to coupling a permanent magnet (PM) with a microelectromechanical systems (MEMS) device. In embodiments, an adhesive, such as an epoxy or resin or other adhesive material, can be used to move the PM towards the MEMS device to magnetically couple the PM to the MEMS device. In embodiments, an adhesive that is configured to shrink up on curing can be applied (e.g., using a pick and place tool) to a location between the MEMS device and the PM. As a result of curing, the adhesive can pull the PM towards the MEMS device. In embodiments, an adhesive that is configured to expand as a result of curing can be applied to a location between the PM and a sidewall of the chassis. As a result of curing, the adhesive can push the PM towards the MEMS device. The adhesive can also secure the PM in place.

公开(公告)号：US20180182712A1

公开(公告)日：2018-06-28

申请号：US15390809

申请日：2016-12-27

Applicant: Intel Corporation

Inventor： Chia-Pin Chiu ,  Kyle Yazzie

IPC: H01L23/544

CPC classification number: H01L23/544 ,  H01L24/83 ,  H01L2223/54426 ,  H01L2223/54486 ,  H01L2224/83122 ,  H01L2224/83132

Abstract: Particular embodiments described herein provide for a base, a plurality of fiducials on the base, and a fluid in one or more of each of the plurality of fiducials to increase recognition of each of the one or more fiducials that includes the fluid by one or more pattern recognition devices. In an example, the fluid is an epoxy and the fiducials are used to determine a placement of components in a component space.

公开(公告)号：US10278318B2

公开(公告)日：2019-04-30

申请号：US14974113

申请日：2015-12-18

Applicant: Intel Corporation

Inventor： Kyle Yazzie ,  Pramod Malatkar ,  Xiao Lu ,  Daniel Chavez-Clemente

IPC: H05K13/04 ,  H05K3/30

Abstract: A method of assembly comprising providing an assembly probe, the assembly probe having an end coupling face; providing a droplet of fluid on the end coupling face of the assembly probe; coupling an electronic component to the end coupling face of the assembly probe with the fluid droplet, the electronic component having a peripheral dimension equal to or less than 2 mm in each of length, width and height; placing the electronic component on a substrate with the assembly probe; decoupling the electronic component from the end coupling face of the assembly probe; and assembling the electronic component to the substrate.

公开(公告)号：US20170176516A1

公开(公告)日：2017-06-22

申请号：US14976881

申请日：2015-12-21

Applicant: INTEL CORPORATION

Inventor： Mohit Mamodia ,  Kyle Yazzie ,  Dingying David Xu ,  Kuang Liu ,  Paul J. Diglio ,  Pramod Malatkar

IPC: G01R31/28 ,  H05B3/26

CPC classification number: H05B3/267 ,  G01R31/2867 ,  G01R31/2875

Abstract: A thermal heat for integrated circuit die processing is described that includes a thermal barrier. In one example, the thermal head has a ceramic heater configured to carry an integrated circuit die, a metal base, and a thermal barrier between the heater and the base.

公开(公告)号：US20220165686A1

公开(公告)日：2022-05-26

申请号：US17669265

申请日：2022-02-10

Applicant: Intel Corporation

Inventor： Jimin Yao ,  Kyle Yazzie ,  Shawna M. Liff

IPC: H01L23/00 ,  H01L23/498 ,  H05K3/10 ,  B29C70/68 ,  H01L21/48 ,  H01L23/544 ,  H01L23/58

Abstract: An apparatus, comprising an Integrated Circuit (IC) package comprising a dielectric, the IC package has a first surface and an opposing second-surface, wherein the first surface is separated from the second surface by a thickness of the IC package, wherein sidewalls extend along a perimeter and through the thickness between the first surface and the second surface, and a structure comprising a frame that extends at least partially along the perimeter of the IC package, wherein the structure extends at least through the thickness of the IC package and inwardly from the sidewalls of the IC package.

公开(公告)号：US11322455B2

公开(公告)日：2022-05-03

申请号：US15845990

申请日：2017-12-18

Applicant: Intel Corporation

Inventor： Jimin Yao ,  Kyle Yazzie ,  Shawna M. Liff

IPC: H01L23/498 ,  H01L23/00 ,  H05K3/10 ,  B29C70/68 ,  H01L21/48 ,  H01L23/544 ,  H01L23/58 ,  H01L23/14 ,  B29L31/34 ,  B29K63/00

Abstract: An apparatus, comprising an Integrated Circuit (IC) package comprising a dielectric, the IC package has a first surface and an opposing second-surface, wherein the first surface is separated from the second surface by a thickness of the IC package, wherein sidewalls extend along a perimeter and through the thickness between the first surface and the second surface, and a structure comprising a frame that extends at least partially along the perimeter of the IC package, wherein the structure extends at least through the thickness of the IC package and inwardly from the sidewalls of the IC package.

公开(公告)号：US11022792B2

公开(公告)日：2021-06-01

申请号：US16464257

申请日：2016-12-27

Applicant: Intel Corporation

Inventor： Kyle Yazzie ,  Anna M. Prakash ,  Suriyakala Ramalingam ,  Liwei Wang ,  Robert Starkston ,  Arnab Choudhury ,  Sandeep S. Iyer ,  Amanuel M. Abebaw ,  Nick Labanok

IPC: G02B26/08 ,  B81C3/00

Abstract: Aspects of the embodiments are directed to coupling a permanent magnet (PM) with a microelectromechanical systems (MEMS) device. In embodiments, an adhesive, such as an epoxy or resin or other adhesive material, can be used to move the PM towards the MEMS device to magnetically couple the PM to the MEMS device. In embodiments, an adhesive that is configured to shrink up on curing can be applied (e.g., using a pick and place tool) to a location between the MEMS device and the PM. As a result of curing, the adhesive can pull the PM towards the MEMS device. In embodiments, an adhesive that is configured to expand as a result of curing can be applied to a location between the PM and a sidewall of the chassis. As a result of curing, the adhesive can push the PM towards the MEMS device. The adhesive can also secure the PM in place.

公开(公告)号：US20180350709A1

公开(公告)日：2018-12-06

申请号：US15778042

申请日：2015-11-24

Applicant: INTEL CORPORATION

Inventor： Pramod Malatkar ,  Kyle Yazzie ,  Naga Sivakumar Yagnamurthy ,  Richard J. Harries ,  Dilan Seneviratne ,  Praneeth Akkinepally ,  Xuefei Wan ,  Yonggang Li ,  Robert L. Sankman

IPC: H01L23/31 ,  H01L23/00 ,  H01L23/498 ,  H01L25/10

CPC classification number: H01L23/34 ,  H01L23/3128 ,  H01L23/48 ,  H01L23/49582 ,  H01L23/49816 ,  H01L23/562 ,  H01L25/105 ,  H01L2224/16225 ,  H01L2224/73204 ,  H01L2224/81203 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/351 ,  H01L2924/00012 ,  H01L2924/00014

Abstract: An electronic package that includes a substrate and an electronic component attached to the substrate. A laminated layer is attached to an upper surface of the substrate such that the laminated layer covers the electronic component. The electronic package may further include a stiffener mounted on the laminated layer where the stiffener is over the electronic component.

公开(公告)号：US10998275B2

公开(公告)日：2021-05-04

申请号：US16465443

申请日：2016-12-30

Applicant: Intel Corporation

Inventor： Kyle Yazzie ,  Mohit Mamodia

IPC: H01L23/00 ,  H01L23/06 ,  H01L23/498

Abstract: An apparatus is provided which comprises: a substrate to couple with one or more integrated circuit die(s), an integrated circuit die coupled to the substrate, a metal component coupled to the substrate, wherein the metal component lacks a sealing coating, and a sacrificial metal conductively coupled with the metal component, wherein the sacrificial metal comprises a more anodic metal than the metal component. Other embodiments are also disclosed and claimed.

公开(公告)号：US10985080B2

公开(公告)日：2021-04-20

申请号：US15778042

申请日：2015-11-24

Applicant: Intel Corporation

Inventor： Pramod Malatkar ,  Kyle Yazzie ,  Naga Sivakumar Yagnamurthy ,  Richard J. Harries ,  Dilan Seneviratne ,  Praneeth Akkinepally ,  Xuefei Wan ,  Yonggang Li ,  Robert L. Sankman

IPC: H01L23/31 ,  H01L23/34 ,  H01L23/48 ,  H01L25/10 ,  H01L23/00 ,  H01L23/498 ,  H01L23/538

Abstract: An electronic package that includes a substrate and an electronic component attached to the substrate. A laminated layer is attached to an upper surface of the substrate such that the laminated layer covers the electronic component. The electronic package may further include a stiffener mounted on the laminated layer where the stiffener is over the electronic component.