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    INTERCONNECT CABLE WITH EDGE FINGER CONNECTOR
    1.
    发明申请
    INTERCONNECT CABLE WITH EDGE FINGER CONNECTOR 审中-公开
    带有指尖连接器的互连电缆

    公开(公告)号：US20150357736A1

    公开(公告)日：2015-12-10

    申请号：US14822693

    申请日：2015-08-10

    Applicant: INTEL CORPORATION

    Inventor： Donald T. Tran ,  Rajasekaran Swaminathan

    IPC: H01R12/72 ,  H01R13/6581 ,  H01R43/20

    CPC classification number: H01R12/721 ,  H01R12/714 ,  H01R12/81 ,  H01R13/6581 ,  H01R13/6592 ,  H01R43/205 ,  Y10T29/49174 ,  Y10T29/49176

    Abstract: Embodiments of the present disclosure are directed to an interconnect cable including a edge finger connector, and associated configurations and methods. The edge finger connector may be disposed at a first end of the interconnect cable and may connect the interconnect cable to an edge finger included in or coupled to a package substrate. The package substrate may be included in a processor package assembly, and a processor may be mounted on the substrate. The interconnect cable may include one or more elongate conductors, with contacts directly coupled to respective conductors. A second connector may be disposed at a second end of the interconnect cable, and may couple the interconnect cable to a small form-factor pluggable (SFP) case that is configured to connect the interconnect cable to an SFP cable. Other embodiments may be described and claimed.

    Abstract translation: 本公开的实施例涉及包括边缘指状连接器以及相关联的配置和方法的互连电缆。 边缘指状连接器可以设置在互连电缆的第一端处，并且可以将互连电缆连接到包括在封装衬底中或耦合到封装衬底的边缘指状物。 封装衬底可以包括在处理器封装组件中，并且处理器可以安装在衬底上。 互连电缆可以包括一个或多个细长导体，其中触点直接耦合到相应的导体。 第二连接器可以设置在互连电缆的第二端处，并且可以将互连电缆耦合到被配置为将互连电缆连接到SFP电缆的小型可插拔（SFP）壳体。 可以描述和要求保护其他实施例。

    Connector for processor package
    2.
    发明授权
    Connector for processor package 有权

    公开(公告)号：US10541494B2

    公开(公告)日：2020-01-21

    申请号：US16078613

    申请日：2016-03-31

    Applicant: Intel Corporation

    Inventor： Donald T. Tran ,  Thomas A. Boyd ,  Yong Wang ,  Kevin J. Ceurter ,  Srikant Nekkanty ,  Russell S. Aoki ,  FeiFei Cheng

    IPC: H01R13/639 ,  H01L23/32 ,  H01R12/71 ,  H01R13/627 ,  H01R13/629 ,  H01R25/00 ,  H01L23/367

    Abstract: Apparatuses, methods and storage medium associated with connectors for coupling to a computer processing unit (CPU) package are disclosed herein. In embodiments, a connector assembly for connection to a computer processing unit (CPU) package may include a connector housing. One or more electrical contacts of the connector housing may be to couple to the CPU package when the connector assembly is engaged with a mating connector assembly. The connector assembly may further include a mounting handle affixed to a top of the connector housing. The mounting handle may include a locking latch that extends from the mounting handle. The locking latch may engage with a notch within the mating connector assembly that, when engaged, the locking latch may provide a force to maintain coupling of the one or more electrical contacts with the CPU package when engaged with the mating connector assembly.

    Interconnect cable with edge finger connector
    3.
    发明授权
    Interconnect cable with edge finger connector 有权
    互连电缆与边缘指接头

    公开(公告)号：US09118151B2

    公开(公告)日：2015-08-25

    申请号：US13870938

    申请日：2013-04-25

    Applicant: Intel Corporation

    Inventor： Donald T. Tran ,  Rajasekaran Swaminathan

    IPC: H01R12/00 ,  H01R12/71 ,  H01R12/81 ,  H01R13/6592

    CPC classification number: H01R12/721 ,  H01R12/714 ,  H01R12/81 ,  H01R13/6581 ,  H01R13/6592 ,  H01R43/205 ,  Y10T29/49174 ,  Y10T29/49176

    Abstract: Embodiments of the present disclosure are directed to an interconnect cable including a edge finger connector, and associated configurations and methods. The edge finger connector may be disposed at a first end of the interconnect cable and may connect the interconnect cable to an edge finger included in or coupled to a package substrate. The package substrate may be included in a processor package assembly, and a processor may be mounted on the substrate. The interconnect cable may include one or more elongate conductors, with contacts directly coupled to respective conductors. A second connector may be disposed at a second end of the interconnect cable, and may couple the interconnect cable to a small form-factor pluggable (SFP) case that is configured to connect the interconnect cable to an SFP cable. Other embodiments may be described and claimed.

    Abstract translation: 本公开的实施例涉及包括边缘指状连接器以及相关联的配置和方法的互连电缆。 边缘指状连接器可以设置在互连电缆的第一端处，并且可以将互连电缆连接到包括在封装衬底中或耦合到封装衬底的边缘指状物。 封装衬底可以包括在处理器封装组件中，并且处理器可以安装在衬底上。 互连电缆可以包括一个或多个细长导体，其中触点直接耦合到相应的导体。 第二连接器可以设置在互连电缆的第二端处，并且可以将互连电缆耦合到被配置为将互连电缆连接到SFP电缆的小型可插拔（SFP）壳体。 可以描述和要求保护其他实施例。

    SOCKETS HAVING FINE PITCH 3D FEATURES
    5.
    发明公开
    SOCKETS HAVING FINE PITCH 3D FEATURES 审中-公开

    公开(公告)号：US20240283197A1

    公开(公告)日：2024-08-22

    申请号：US18112583

    申请日：2023-02-22

    Applicant: Intel Corporation

    Inventor： Saikat Mondal ,  Donald T. Tran ,  Zhichao Zhang ,  Srikant Nekkanty

    IPC: H01R13/6474 ,  H01R13/6461

    CPC classification number: H01R13/6474 ,  H01R13/6461

    Abstract: An apparatus and method for fine tuning impedance in a pin arrangement of a socket are described. The socket has a socket body that contains a plurality of coupling bridges. Each coupling bridge contains: a surrounding portion that at least partially surrounds a via, and a stub portion extending from the ring-shaped portion. Pins inserted in a plurality of vias are arranged in pin pairs configured to support Double Data Rate (DDR) data signals. Each first pin of at least some of the pin pairs electromagnetically coupled to a second pin of these pin pairs using one of the coupling bridges.

    Cable connector
    8.
    发明授权
    Cable connector 有权

    公开(公告)号：US09640880B2

    公开(公告)日：2017-05-02

    申请号：US14651820

    申请日：2014-07-01

    Applicant: Intel Corporation

    Inventor： Donald T. Tran ,  Jeffrey Lee ,  Gaurav Chawla

    IPC: H01R12/53 ,  H01R9/03 ,  H01R13/6592 ,  H01R13/6593 ,  H01R13/6594

    CPC classification number: H01R12/53 ,  H01R9/035 ,  H01R9/038 ,  H01R13/6592 ,  H01R13/6593 ,  H01R13/6594

    Abstract: A cable connector that includes a substrate having a plurality of conductive pads and at least one grounding pad. The cable connector further includes twin axial cable that includes a first conductor and second conductor, a first insulator that surrounds the first conductor, and a second insulator that surrounds the second conductor. The twin axial cable further includes a ground shield that surrounds the first and second insulator. The first conductor is electrically connected to one conductive pad and the second conductor is electrically connected to another of the conductive pads. The ground shield is electrically connected to the grounding pad. A shielding structure is mounted to the substrate and is electrically connected to the grounding pad. The shielding structure includes a cap and a plurality of sidewalls extending from the cap to the substrate. The twin axial cable is positioned between the side walls.

    CABLE CONNECTOR
    9.
    发明申请
    CABLE CONNECTOR 有权
    电缆连接器

    公开(公告)号：US20160276759A1

    公开(公告)日：2016-09-22

    申请号：US14651820

    申请日：2014-07-01

    Applicant: INTEL CORPORATION

    Inventor： Donald T. Tran ,  Jeffrey Lee ,  Gaurav Chawla

    IPC: H01R12/53 ,  H01R13/6594 ,  H01R13/6592 ,  H01R13/6593

    CPC classification number: H01R12/53 ,  H01R9/035 ,  H01R9/038 ,  H01R13/6592 ,  H01R13/6593 ,  H01R13/6594

    Abstract: A cable connector that includes a substrate having a plurality of conductive pads and at least one grounding pad. The cable connector further includes twin axial cable that includes a first conductor and second conductor, a first insulator that surrounds the first conductor, and a second insulator that surrounds the second conductor. The twin axial cable further includes a ground shield that surrounds the first and second insulator. The first conductor is electrically connected to one conductive pad and the second conductor is electrically connected to another of the conductive pads. The ground shield is electrically connected to the grounding pad. A shielding structure is mounted to the substrate and is electrically connected to the grounding pad. The shielding structure includes a cap and a plurality of sidewalls extending from the cap to the substrate. The twin axial cable is positioned between the side walls.

    Abstract translation: 一种电缆连接器，包括具有多个导电焊盘和至少一个接地焊盘的衬底。 电缆连接器还包括双轴向电缆，其包括第一导体和第二导体，围绕第一导体的第一绝缘体和围绕第二导体的第二绝缘体。 双轴向电缆还包括围绕第一和第二绝缘体的接地屏蔽。 第一导体电连接到一个导电焊盘，并且第二导体电连接到另一个导电焊盘。 接地屏蔽电气连接到接地垫。 屏蔽结构安装在基板上并电连接到接地垫。 屏蔽结构包括盖和从盖到基板延伸的多个侧壁。 双轴向电缆位于侧壁之间。

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