公开(公告)号：US20180361517A1

公开(公告)日：2018-12-20

申请号：US16111593

申请日：2018-08-24

Applicant: Intel Corporation

Inventor： Kabir J. Mirpuri

IPC: B23K35/02 ,  H01L23/00

CPC classification number: B23K35/025 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/11332 ,  H01L2224/13111 ,  H01L2224/16227 ,  H01L2924/014 ,  H01L2924/3511 ,  H01L2924/01083 ,  H01L2924/01029 ,  H01L2924/01047

Abstract: Embodiments herein may relate to a solder paste. The solder paste may include a solder powder and a flux. In embodiments, the flux may be a non-rosin based flux. The flux may further include a thixotropic agent (TA) that may be a non-polymer based TA. Other embodiments may be described and/or claimed.

公开(公告)号：US20170066088A1

公开(公告)日：2017-03-09

申请号：US14846489

申请日：2015-09-04

Applicant: Intel Corporation

Inventor： Mohit Sood ,  Boxi Liu ,  Wei Tan ,  Huili Xu ,  Kabir J. Mirpuri

IPC: B23K35/26 ,  B23K35/02 ,  H01L23/00 ,  H05K3/36 ,  H01L21/48 ,  H05K1/18 ,  H05K1/14 ,  H05K3/34 ,  B23K1/00 ,  H01L23/498

CPC classification number: B23K35/262 ,  B23K1/0016 ,  B23K35/0244 ,  H01L21/4853 ,  H01L23/49816 ,  H01L23/49833 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/81 ,  H01L2224/13014 ,  H01L2224/13016 ,  H01L2224/131 ,  H01L2224/13105 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13113 ,  H01L2224/13118 ,  H01L2224/13294 ,  H01L2224/133 ,  H01L2224/1339 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16502 ,  H01L2224/16505 ,  H01L2224/812 ,  H01L2224/81801 ,  H01L2224/81815 ,  H01L2224/8192 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15321 ,  H01L2924/15331 ,  H01L2924/20104 ,  H01L2924/20105 ,  H01L2924/3511 ,  H01L2924/3841 ,  H05K1/141 ,  H05K1/144 ,  H05K1/181 ,  H05K3/3436 ,  H05K3/363 ,  H05K2201/042 ,  H05K2201/10234 ,  H05K2201/10378 ,  H05K2201/10734 ,  H05K2203/041 ,  H01L2924/014 ,  H01L2924/00012 ,  H01L2924/01323 ,  H01L2924/01324 ,  H01L2924/01079 ,  H01L2924/01029 ,  H01L2924/01049 ,  H01L2924/00014 ,  H01L2924/0665

Abstract: Embodiments herein may relate to an apparatus with a ball grid array (BGA) package that includes a plurality of solder balls of an off-eutectic material. In embodiments, the respective solder balls of the plurality of solder balls may form solder joints between a substrate of the BGA and a second substrate. In some embodiments the joints may be less than approximately 0.6 micrometers from one another. Other embodiments may be described and/or claimed.

Abstract translation: 本文的实施例可以涉及具有球栅阵列（BGA）封装的装置，其包括多个非共晶材料的焊球。 在实施例中，多个焊球的相应焊球可以在BGA的衬底和第二衬底之间形成焊接接头。 在一些实施例中，接头可以彼此小于约0.6微米。 可以描述和/或要求保护其他实施例。

公开(公告)号：US10037898B2

公开(公告)日：2018-07-31

申请号：US15089208

申请日：2016-04-01

Applicant: Intel Corporation

Inventor： Kabir J. Mirpuri

IPC: H05K1/18 ,  H05K1/11 ,  H01L21/48 ,  H01L23/498 ,  B23K35/36 ,  B23K101/40 ,  H01L23/488 ,  B23K101/42

CPC classification number: H01L21/4864 ,  B23K35/3613 ,  B23K2101/40 ,  B23K2101/42 ,  H01L21/4853 ,  H01L23/488 ,  H01L23/49816 ,  H01L2225/06513 ,  H01L2225/06517 ,  H05K1/11 ,  H05K1/181 ,  H05K2201/10462 ,  H05K2201/10674

Abstract: A one-step water soluble (WS) flux process may reduce residue staining and increase yields for bond grid array (BGA) packages. In one example, the WS flux may use increased amounts of bonding polymer (BP) and reduced amounts of amine to increase viscosity. The increased viscosity may eliminate using a second no-clean flux and enable a single WS flux to both clean the associated substrate and provide stable solder ball support during reflow.

公开(公告)号：US20170278818A1

公开(公告)日：2017-09-28

申请号：US15080365

申请日：2016-03-24

Applicant: Intel Corporation

Inventor： Kabir J. Mirpuri

IPC: H01L23/00

CPC classification number: B23K35/025 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/11332 ,  H01L2224/13111 ,  H01L2224/16227 ,  H01L2924/3511 ,  H01L2924/01083 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/014

Abstract: Embodiments herein may relate to a solder paste. The solder paste may include a solder powder and a flux. In embodiments, the flux may be a non-rosin based flux. The flux may further include a thixotropic agent (TA) that may be a non-polymer based TA. Other embodiments may be described and/or claimed.

公开(公告)号：US10391590B2

公开(公告)日：2019-08-27

申请号：US16111593

申请日：2018-08-24

Applicant: Intel Corporation

Inventor： Kabir J. Mirpuri

IPC: B23K35/02 ,  H01L23/00

Abstract: Embodiments herein may relate to a solder paste. The solder paste may include a solder powder and a flux. In embodiments, the flux may be a non-rosin based flux. The flux may further include a thixotropic agent (TA) that may be a non-polymer based TA. Other embodiments may be described and/or claimed.

公开(公告)号：US10086479B2

公开(公告)日：2018-10-02

申请号：US15080365

申请日：2016-03-24

Applicant: Intel Corporation

Inventor： Kabir J. Mirpuri

IPC: H01L23/48 ,  B23K35/02 ,  H01L23/00

Abstract: Embodiments herein may relate to a solder paste. The solder paste may include a solder powder and a flux. In embodiments, the flux may be a non-rosin based flux. The flux may further include a thixotropic agent (TA) that may be a non-polymer based TA. Other embodiments may be described and/or claimed.

公开(公告)号：US20170287732A1

公开(公告)日：2017-10-05

申请号：US15089208

申请日：2016-04-01

Applicant: Intel Corporation

Inventor： Kabir J. Mirpuri

IPC: H01L21/48 ,  B23K35/36 ,  H01L23/498

CPC classification number: H01L21/4864 ,  B23K35/3613 ,  B23K2101/40 ,  B23K2101/42 ,  H01L21/4853 ,  H01L23/488 ,  H01L23/49816 ,  H01L2225/06513 ,  H01L2225/06517 ,  H05K1/11 ,  H05K1/181 ,  H05K2201/10462 ,  H05K2201/10674

Abstract: A one-step water soluble (WS) flux process may reduce residue staining and increase yields for bond grid array (BGA) packages. In one example, the WS flux may use increased amounts of bonding polymer (BP) and reduced amounts of amine to increase viscosity. The increased viscosity may eliminate using a second no-clean flux and enable a single WS flux to both clean the associated substrate and provide stable solder ball support during reflow.