公开(公告)号：US20150348940A1

公开(公告)日：2015-12-03

申请号：US14289483

申请日：2014-05-28

Applicant: Invensas Corporation

Inventor： Charles G. WOYCHIK ,  Arkalgud R. Sitaram ,  Andrew Cao ,  Bong-Sub Lee

IPC: H01L25/065 ,  H01L21/768 ,  H01L21/56 ,  H01L23/48 ,  H01L23/373 ,  H01L23/367 ,  H01L23/29 ,  H01L23/31 ,  H01L25/00 ,  H01L23/00

CPC classification number: H01L25/0657 ,  H01L21/56 ,  H01L21/561 ,  H01L21/563 ,  H01L21/6835 ,  H01L21/76898 ,  H01L23/29 ,  H01L23/295 ,  H01L23/3107 ,  H01L23/3128 ,  H01L23/367 ,  H01L23/3731 ,  H01L23/481 ,  H01L24/02 ,  H01L24/13 ,  H01L24/14 ,  H01L24/17 ,  H01L24/81 ,  H01L24/92 ,  H01L24/94 ,  H01L24/97 ,  H01L25/03 ,  H01L25/0652 ,  H01L25/18 ,  H01L25/50 ,  H01L2221/68327 ,  H01L2221/68331 ,  H01L2224/0231 ,  H01L2224/02372 ,  H01L2224/0401 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05611 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05664 ,  H01L2224/13022 ,  H01L2224/131 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13124 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13164 ,  H01L2224/13193 ,  H01L2224/14155 ,  H01L2224/14181 ,  H01L2224/16145 ,  H01L2224/16146 ,  H01L2224/16235 ,  H01L2224/1703 ,  H01L2224/17051 ,  H01L2224/17181 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29388 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2224/92125 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2225/06568 ,  H01L2225/06589 ,  H01L2924/15311 ,  H01L2924/18161 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2224/16225 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/0665 ,  H01L2924/014

Abstract: A method of forming a semiconductor package comprises forming one or more first vias in a first side of a substrate and attaching a first side of a first microelectronic element to the first side of the substrate. The first microelectronic element is electrically coupled to at least one of the one or more first vias. The method further comprise obtaining a second microelectronic element including one or more second vias in a first side of the second microelectronic element, and attaching a second side of the substrate to the first side of the second microelectronic element. The second microelectronic element is electrically coupled to at least one of the one or more first vias. Each of one or more connecting elements has a first end attached to a first side of the second microelectronic element and a second end extends beyond a second side of the first microelectronic element.

Abstract translation: 形成半导体封装的方法包括在衬底的第一侧中形成一个或多个第一通孔并将第一微电子元件的第一侧附接到衬底的第一侧。 第一微电子元件电耦合到一个或多个第一通孔中的至少一个。 该方法还包括获得第二微电子元件，该第二微电子元件包括在第二微电子元件的第一侧中的一个或多个第二通孔，以及将该基板的第二侧附接到第二微电子元件的第一侧。 第二微电子元件电耦合到一个或多个第一通孔中的至少一个。 一个或多个连接元件中的每一个具有连接到第二微电子元件的第一侧的第一端，并且第二端延伸超过第一微电子元件的第二侧。

公开(公告)号：US20150155230A1

公开(公告)日：2015-06-04

申请号：US14096387

申请日：2013-12-04

Applicant: Invensas Corporation

Inventor： Andrew Cao ,  Michael Newman

IPC: H01L23/498 ,  H01L21/48

CPC classification number: H01L21/4853 ,  H01L21/486 ,  H01L23/13 ,  H01L23/147 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/562 ,  H01L24/02 ,  H01L24/05 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/48 ,  H01L25/0657 ,  H01L25/16 ,  H01L2224/0231 ,  H01L2224/0237 ,  H01L2224/02372 ,  H01L2224/0401 ,  H01L2224/05569 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05664 ,  H01L2224/13024 ,  H01L2224/131 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/17181 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/73257 ,  H01L2224/81424 ,  H01L2224/81447 ,  H01L2224/81455 ,  H01L2224/81464 ,  H01L2924/00014 ,  H01L2924/12042 ,  H01L2924/00 ,  H01L2924/014 ,  H01L2224/45099 ,  H01L2924/00012

Abstract: A component, e.g., interposer has first and second opposite sides, conductive elements at the first side and terminals at the second side. The terminals can connect with another component, for example. A first element at the first side can comprise a first material having a thermal expansion coefficient less than 10 ppm/° C., and a second element at the second side can comprise a plurality of insulated structures separated from one another by at least one gap. Conductive structure extends through at least one insulated structure and is electrically coupled with the terminals and the conductive elements. The at least one gap can reduce mechanical stress in connections between the terminals and another component.

Abstract translation: 诸如插入件的部件具有第一和第二相对侧，第一侧的导电元件和第二侧的端子。 终端可以连接另一个组件，例如。 第一侧的第一元件可以包括具有小于10ppm /℃的热膨胀系数的第一材料，并且第二侧的第二元件可以包括通过至少一个间隙彼此分离的多个绝缘结构 。 导电结构延伸穿过至少一个绝缘结构，并与端子和导电元件电耦合。 所述至少一个间隙可以减小端子与另一部件之间的连接中的机械应力。

公开(公告)号：US10403510B2

公开(公告)日：2019-09-03

申请号：US15626577

申请日：2017-06-19

Applicant: Invensas Corporation

Inventor： Andrew Cao ,  Michael Newman

IPC: H01L21/00 ,  H01L21/48 ,  H01L23/498 ,  H01L23/00 ,  H01L25/065 ,  H01L25/16 ,  H01L23/14 ,  H01L23/13

Abstract: A component, e.g., interposer has first and second opposite sides, conductive elements at the first side and terminals at the second side. The terminals can connect with another component, for example. A first element at the first side can comprise a first material having a thermal expansion coefficient less than 10 ppm/° C., and a second element at the second side can comprise a plurality of insulated structures separated from one another by at least one gap. Conductive structure extends through at least one insulated structure and is electrically coupled with the terminals and the conductive elements. The at least one gap can reduce mechanical stress in connections between the terminals and another component.

公开(公告)号：US20170294321A1

公开(公告)日：2017-10-12

申请号：US15626577

申请日：2017-06-19

Applicant: Invensas Corporation

Inventor： Andrew Cao ,  Michael Newman

IPC: H01L21/48 ,  H01L23/14 ,  H01L25/16 ,  H01L23/00 ,  H01L25/065 ,  H01L23/13 ,  H01L23/498

CPC classification number: H01L21/4853 ,  H01L21/486 ,  H01L23/13 ,  H01L23/147 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/562 ,  H01L24/02 ,  H01L24/05 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/48 ,  H01L25/0657 ,  H01L25/16 ,  H01L2224/0231 ,  H01L2224/0237 ,  H01L2224/02372 ,  H01L2224/0401 ,  H01L2224/05569 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05664 ,  H01L2224/13024 ,  H01L2224/131 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/17181 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/73257 ,  H01L2224/81424 ,  H01L2224/81447 ,  H01L2224/81455 ,  H01L2224/81464 ,  H01L2924/00014 ,  H01L2924/12042 ,  H01L2924/00 ,  H01L2924/014 ,  H01L2224/45099 ,  H01L2924/00012

Abstract: A component, e.g., interposer has first and second opposite sides, conductive elements at the first side and terminals at the second side. The terminals can connect with another component, for example. A first element at the first side can comprise a first material having a thermal expansion coefficient less than 10 ppm/° C., and a second element at the second side can comprise a plurality of insulated structures separated from one another by at least one gap. Conductive structure extends through at least one insulated structure and is electrically coupled with the terminals and the conductive elements. The at least one gap can reduce mechanical stress in connections between the terminals and another component.

公开(公告)号：US10381326B2

公开(公告)日：2019-08-13

申请号：US14289483

申请日：2014-05-28

Applicant: Invensas Corporation

Inventor： Charles G. Woychik ,  Arkalgud R. Sitaram ,  Andrew Cao ,  Bong-Sub Lee

IPC: H01L25/065 ,  H01L23/00 ,  H01L25/00 ,  H01L21/768 ,  H01L21/56 ,  H01L23/373 ,  H01L23/367 ,  H01L23/29 ,  H01L23/31 ,  H01L23/48 ,  H01L21/683 ,  H01L25/03 ,  H01L25/18

Abstract: A method of forming a semiconductor package comprises forming one or more first vias in a first side of a substrate and attaching a first side of a first microelectronic element to the first side of the substrate. The first microelectronic element is electrically coupled to at least one of the one or more first vias. The method further comprise obtaining a second microelectronic element including one or more second vias in a first side of the second microelectronic element, and attaching a second side of the substrate to the first side of the second microelectronic element. The second microelectronic element is electrically coupled to at least one of the one or more first vias. Each of one or more connecting elements has a first end attached to a first side of the second microelectronic element and a second end extends beyond a second side of the first microelectronic element.

公开(公告)号：US09691693B2

公开(公告)日：2017-06-27

申请号：US14096387

申请日：2013-12-04

Applicant: Invensas Corporation

Inventor： Andrew Cao ,  Michael Newman

IPC: H01L23/498 ,  H01L21/48 ,  H01L25/065 ,  H01L25/16 ,  H01L23/14 ,  H01L23/13 ,  H01L23/00

CPC classification number: H01L21/4853 ,  H01L21/486 ,  H01L23/13 ,  H01L23/147 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/562 ,  H01L24/02 ,  H01L24/05 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/48 ,  H01L25/0657 ,  H01L25/16 ,  H01L2224/0231 ,  H01L2224/0237 ,  H01L2224/02372 ,  H01L2224/0401 ,  H01L2224/05569 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05664 ,  H01L2224/13024 ,  H01L2224/131 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/17181 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/73257 ,  H01L2224/81424 ,  H01L2224/81447 ,  H01L2224/81455 ,  H01L2224/81464 ,  H01L2924/00014 ,  H01L2924/12042 ,  H01L2924/00 ,  H01L2924/014 ,  H01L2224/45099 ,  H01L2924/00012

Abstract: A component, e.g., interposer has first and second opposite sides, conductive elements at the first side and terminals at the second side. The terminals can connect with another component, for example. A first element at the first side can comprise a first material having a thermal expansion coefficient less than 10 ppm/° C., and a second element at the second side can comprise a plurality of insulated structures separated from one another by at least one gap. Conductive structure extends through at least one insulated structure and is electrically coupled with the terminals and the conductive elements. The at least one gap can reduce mechanical stress in connections between the terminals and another component.