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公开(公告)号：US10795259B2
公开(公告)日：2020-10-06
申请号：US15764544
申请日：2017-02-03
申请人： LG CHEM, LTD.
发明人： Byung Ju Choi , You Jin Kyung , Woo Jae Jeong , Bo Yun Choi , Min Su Jeong
IPC分类号： G03F7/004 , G03F7/027 , G03F7/029 , C08F2/50 , C08F2/44 , H05K3/34 , C08L35/02 , C09D4/00 , C08K7/00 , C08F122/14 , C08K3/34 , H05K3/28
摘要： The present invention relates to a photo-curable and heat-curable resin composition including: an acid-modified oligomer having a photo-curable functional group having an acrylate group or an unsaturated double bond, and a carboxyl group in the molecule; a photopolymerizable monomer having at least two photo-curable unsaturated functional groups; a heat-curable binder having a heat-curable functional group; a plate-like inorganic filler having an E-modulus of 90 to 120 (Gpa); a dispersant; and a photo-initiator, and a dry film solder resist prepared therefrom.
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公开(公告)号：US09788434B2
公开(公告)日：2017-10-10
申请号：US14763414
申请日：2014-09-22
申请人： LG CHEM, LTD.
发明人： Min Su Jeong , You Jin Kyung , Byung Ju Choi , Woo Jae Jeong , Bo Yun Choi , Kwang Joo Lee , Se Jin Ku
IPC分类号： G03F7/11 , G06F7/40 , H05K3/02 , H05K3/28 , G03F7/038 , G03F7/16 , G03F7/20 , G03F7/32 , G03F7/40 , H01L21/48 , G03F7/027 , G03F7/09 , H05K3/34
CPC分类号： H05K3/027 , G03F7/027 , G03F7/038 , G03F7/09 , G03F7/16 , G03F7/20 , G03F7/327 , G03F7/40 , H01L21/4846 , H05K3/281 , H05K3/3452
摘要： The present invention relates to a preparation method for a dry film solder resist (DFSR) capable of forming the DFSR having fine unevenness on a surface by a more simplified method, and a film laminate used therein. The preparation method for a dry film solder resist includes forming a predetermined photo-curable and heat-curable resin composition on a transparent carrier film having a surface on which a fine unevenness having an average roughness (Ra) of 200 nm to 2 μm is formed; laminating the resin composition on a substrate to form a laminated structure in which the substrate, the resin composition, and the transparent carrier film are sequentially formed; exposing the resin composition and delaminating the transparent carrier film; and alkaline-developing the resin composition in a non-exposure part and performing heat-curing.
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3.发明申请PHOTO-CURABLE AND THERMO-CURABLE RESIN COMPOSITION AND DRY FILM SOLDER RESIST 有权光固化和热固性树脂组合物和干膜电镀电阻公开(公告)号：US20150205202A1
公开(公告)日：2015-07-23
申请号：US14419179
申请日：2013-07-26
申请人： LG CHEM, LTD.
发明人： Min Su Jeong , Byung Ju Choi , Woo Jae Jeong , Bo Yun Choi , Kwang Joo Lee
IPC分类号： G03F7/031
CPC分类号： G03F7/037 , C09D133/14 , G03F7/004 , G03F7/027 , G03F7/028 , G03F7/029 , G03F7/031 , G03F7/032 , G03F7/038 , G03F7/11 , G03F7/115 , H01L21/027 , H01L21/0271
摘要： The present invention relates to a photo-curable and thermo-curable resin composition which can form a DFSR having micro unevenness on the surface without a separate treatment such as plasma treatment and the like and a DFSR. The photo-curable and thermo-curable resin composition includes an acid-modified oligomer having a carboxyl group (—COON) and a photo-curable unsaturated functional group; a polyimide-based resin; a photo-polymerizable monomer having two or more photo-curable unsaturated functional groups; a thermo-curable binder having a thermo-curable functional group; and a photoinitiator.
摘要翻译： 本发明涉及一种光固化型和热固化型树脂组合物，其可以在不进行诸如等离子体处理等的单独处理和DFSR之类的表面上形成具有微不平坦性的DFSR。 光固化型和热固性树脂组合物包括具有羧基（-COON）和可光固化不饱和官能团的酸改性低聚物; 聚酰亚胺树脂; 具有2个以上光固化性不饱和官能团的光聚合性单体; 具有热固性官能团的热固性粘合剂; 和光引发剂。
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公开(公告)号：US11361878B2
公开(公告)日：2022-06-14
申请号：US16326073
申请日：2018-07-02
申请人： LG CHEM, LTD.
发明人： Woo Jae Jeong , You Jin Kyung , Byung Ju Choi , Bo Yun Choi , Kwang Joo Lee , Min Su Jeong
摘要： The present invention relates to a method for manufacturing an insulating layer which can minimize the degree of warpage caused by polymer shrinkage at the time of curing and secure the stability of a semiconductor chip located therein, and a method for manufacturing a semiconductor package using an insulating layer obtained from the manufacturing method of the insulating layer.
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公开(公告)号：US09880467B2
公开(公告)日：2018-01-30
申请号：US14419179
申请日：2013-07-26
申请人： LG CHEM, LTD.
发明人： Min Su Jeong , Byung Ju Choi , Woo Jae Jeong , Bo Yun Choi , Kwang Joo Lee
IPC分类号： G03F7/037 , G03F7/038 , G03F7/031 , G03F7/027 , G03F7/029 , G03F7/028 , G03F7/032 , G03F7/11 , G03F7/115 , G03F7/004 , H01L21/027 , C09D133/14
CPC分类号： G03F7/037 , C09D133/14 , G03F7/004 , G03F7/027 , G03F7/028 , G03F7/029 , G03F7/031 , G03F7/032 , G03F7/038 , G03F7/11 , G03F7/115 , H01L21/027 , H01L21/0271
摘要： The present invention relates to a photo-curable and thermo-curable resin composition which can form a DFSR having micro unevenness on the surface without a separate treatment such as plasma treatment and the like and a DFSR. The photo-curable and thermo-curable resin composition includes an acid-modified oligomer having a carboxyl group (—COOH) and a photo-curable unsaturated functional group; a polyimide-based resin; a photo-polymerizable monomer having two or more photo-curable unsaturated functional groups; a thermo-curable binder having a thermo-curable functional group; and a photoinitiator.
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6.发明授权Photocurable and thermosetting resin composition, dry film solder resist manufactured therefrom, and circuit board including the solder resist 有权可光固化和热固性树脂组合物，由其制造的干膜阻焊剂和包含阻焊剂的电路板公开(公告)号：US09416243B2
公开(公告)日：2016-08-16
申请号：US14411843
申请日：2014-06-17
申请人： LG CHEM, LTD.
发明人： Byung Ju Choi , Woo Jae Jeong , Bo Yun Choi , Kwang Joo Lee , Min Su Jeong , Se Jin Ku
IPC分类号： G03F7/027 , C08K3/04 , C08K3/08 , C09D133/06
CPC分类号： C08K3/04 , C08K3/041 , C08K3/08 , C08L2312/06 , C09D133/068 , C09D163/10 , G03F7/027
摘要： The present invention relates to a photocurable and thermosetting resin composition, including an acid modified oligomer, a photopolymerizable monomer, a thermosetting binder resin, a photoinitiator, two or more kinds of spherical alumina particles having different particle diameters from each other, and an organic solvent, a dry film solder resist obtained from the resin composition, and a circuit board including the dry film solder resist.
摘要翻译： 本发明涉及一种光固化性和热固性树脂组合物，其包含酸改性低聚物，光聚合性单体，热固性粘合剂树脂，光引发剂，两种或更多种彼此不同粒径的球形氧化铝颗粒和有机溶剂 ，由树脂组合物得到的干膜阻焊剂和包含干膜阻焊剂的电路板。
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公开(公告)号：US11702520B2
公开(公告)日：2023-07-18
申请号：US16767808
申请日：2019-01-09
申请人： LG CHEM, LTD.
发明人： Minsu Jeong , You Jin Kyung , Byung Ju Choi , Woo Jae Jeong , Kwang Joo Lee , Eunbyurl Cho
CPC分类号： C08J5/18 , C08G59/14 , C08K3/36 , H01L23/295 , C08J2363/00 , C08K2201/003
摘要： The present invention relates to an epoxy resin composition for molding a semiconductor having excellent heat resistance and mechanical properties and also having improved visibility while having a low coefficient of thermal expansion and thus exhibiting improved warpage characteristics, and a molding film and a semiconductor package using such an epoxy resin composition for molding a semiconductor.
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公开(公告)号：US11515245B2
公开(公告)日：2022-11-29
申请号：US16767872
申请日：2018-12-12
申请人： LG CHEM, LTD.
发明人： Minsu Jeong , You Jin Kyung , Byung Ju Choi , Woo Jae Jeong , Kwang Joo Lee , Eunbyurl Cho
IPC分类号： H01L23/498 , B29C65/02
摘要： The present invention relates to a method for manufacturing an insulating layer for a semiconductor package which can improve reliability and have excellent heat resistance by removing pores generated in the insulating layer during manufacture of an insulating layer for a semiconductor package using magnetic characteristics, and an insulating layer for a semiconductor package obtained using the method for manufacturing the insulating layer for a semiconductor package.
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公开(公告)号：US09778566B2
公开(公告)日：2017-10-03
申请号：US14925389
申请日：2015-10-28
申请人： LG CHEM, LTD.
发明人： Byung Ju Choi , You Jin Kyung , Woo Jae Jeong , Bo Yun Choi , Kwang Joo Lee , Min Su Jeong
摘要： Provided are a photocurable and thermocurable resin composition including: an acid-modified oligomer including an iminocarbonate-based compound containing a carboxyl group and a photocurable unsaturated functional group; a photopolymerizable monomer having two or more photocurable unsaturated functional groups; a thermocurable binder having a thermally curable functional group; a functional filler including one or more selected from the group consisting of carbon allotrope particles having a ceramic compound bound to a surface thereof and heat radiating ceramic particles; and a photoinitiator, and a dry film solder resist manufactured therefrom.
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10.发明申请PHOTOCURABLE AND THERMOSETTING RESIN COMPOSITION, DRY FILM SOLDER RESIST MANUFACTURED THEREFROM, AND CIRCUIT BOARD INCLUDING THE SOLDER RESIST 有权可热固化和热固化树脂组合物，其制造的干膜电阻器和包括焊锡电阻的电路板公开(公告)号：US20150191588A1
公开(公告)日：2015-07-09
申请号：US14411843
申请日：2014-06-17
申请人： LG CHEM, LTD.
发明人： Byung Ju Choi , Woo Jae Jeong , Bo Yun Choi , Kwang Joo Lee , Min Su Jeong , Se Jin Ku
IPC分类号： C08L33/08
CPC分类号： C08K3/04 , C08K3/041 , C08K3/08 , C08L2312/06 , C09D133/068 , C09D163/10 , G03F7/027
摘要： The present invention relates to a photocurable and thermosetting resin composition, including an acid modified oligomer, a photopolymerizable monomer, a thermosetting binder resin, a photoinitiator, two or more kinds of spherical alumina particles having different particle diameters from each other, and an organic solvent, a dry film solder resist obtained from the resin composition, and a circuit board including the dry film solder resist.
摘要翻译： 本发明涉及一种光固化型热固性树脂组合物，其包含酸改性低聚物，光聚合性单体，热固性粘合剂树脂，光引发剂，两种或更多种彼此不同粒径的球形氧化铝颗粒，以及有机溶剂 ，由树脂组合物得到的干膜阻焊剂和包含干膜阻焊剂的电路板。
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