公开(公告)号：US09583466B2

公开(公告)日：2017-02-28

申请号：US14141735

申请日：2013-12-27

Applicant: LuxVue Technology Corporation

Inventor： Kelly McGroddy ,  Hsin-Hua Hu ,  Andreas Bibl ,  Clayton Ka Tsun Chan

IPC: H01L25/075 ,  H01L33/00 ,  H01L33/14 ,  H01L23/00 ,  G09G3/32 ,  H01L33/20

CPC classification number: H01L25/0753 ,  G09G3/32 ,  H01L24/75 ,  H01L24/95 ,  H01L33/0079 ,  H01L33/0095 ,  H01L33/14 ,  H01L33/20 ,  H01L2924/0002 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/00

Abstract: A method and structure for forming an array of LED devices is disclosed. The LED devices in accordance with embodiments of the invention may include a confined current injection area in which a current spreading layer protrudes away from a cladding layer in a pillar configuration so that the cladding layer is wider than the current spreading layer pillar.

Abstract translation: 公开了一种用于形成LED器件阵列的方法和结构。 根据本发明的实施例的LED器件可以包括限流电流注入区域，其中电流扩散层以柱状构造从包覆层突出，使得包覆层比当前扩展层柱更宽。

公开(公告)号：US09217541B2

公开(公告)日：2015-12-22

申请号：US13894332

申请日：2013-05-14

Applicant: LuxVue Technology Corporation

Inventor： Stephen Bathurst ,  Hsin-Hua Hu ,  Andreas Bibl

IPC: H01L29/06 ,  F21K99/00 ,  H01L23/00 ,  H01L33/00

CPC classification number: F21K9/00 ,  B81C99/002 ,  H01L24/00 ,  H01L33/0095 ,  H01L2224/03002 ,  H01L2224/06181 ,  H01L2224/94 ,  H01L2924/10253 ,  H01L2924/10272 ,  H01L2924/10329 ,  H01L2924/1033 ,  H01L2924/10331 ,  H01L2924/10336 ,  H01L2924/10342 ,  H01L2924/10346 ,  H01L2924/10349 ,  H01L2924/10375 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1431 ,  H01L2924/1434 ,  H01L2924/1461 ,  Y10T29/49002 ,  H01L2224/03 ,  H01L2924/00

Abstract: A stabilization structure includes a stabilization layer on a carrier substrate. The stabilization layer includes an array of staging cavities. An array of micro devices are within the array of staging cavities. Each micro device is laterally attached to a shear release post laterally extending from a sidewall of a staging cavity. A pressure is applied to the array of micro devices from the array of transfer heads to shear the array of micro devices off the shear release posts. The sheared off micro devices are picked up from the carrier substrate using the array of transfer heads.

Abstract translation: 稳定结构包括载体基底上的稳定层。 稳定层包括分段腔阵列。 微器件阵列在分级腔阵列内。 每个微器件横向地附接到从分级腔的侧壁横向延伸的剪切释放柱。 从转移头阵列向微器件阵列施加压力以将微器件阵列剪切离开剪切释放柱。 使用转移头阵列从载体衬底拾取剪切的微器件。

公开(公告)号：US20150187740A1

公开(公告)日：2015-07-02

申请号：US14141735

申请日：2013-12-27

Applicant: LuxVue Technology Corporation

Inventor： Kelly McGroddy ,  Hsin-Hua Hu ,  Andreas Bibl ,  Clayton Ka Tsun Chan

IPC: H01L25/075 ,  H01L33/06 ,  G09G3/32 ,  H01L33/30 ,  H01L33/62 ,  H01L33/00 ,  H01L33/14

CPC classification number: H01L25/0753 ,  G09G3/32 ,  H01L24/75 ,  H01L24/95 ,  H01L33/0079 ,  H01L33/0095 ,  H01L33/14 ,  H01L33/20 ,  H01L2924/0002 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/00

Abstract: A method and structure for forming an array of LED devices is disclosed. The LED devices in accordance with embodiments of the invention may include a confined current injection area in which a current spreading layer protrudes away from a cladding layer in a pillar configuration so that the cladding layer is wider than the current spreading layer pillar.

Abstract translation: 公开了一种用于形成LED器件阵列的方法和结构。 根据本发明的实施例的LED器件可以包括限流电流注入区域，其中电流扩散层以柱状构造从包覆层突出，使得包覆层比当前扩展层柱更宽。

公开(公告)号：US20150179877A1

公开(公告)日：2015-06-25

申请号：US14137856

申请日：2013-12-20

Applicant: LuxVue Technology Corporation

Inventor： Hsin-Hua Hu ,  Kelly McGroddy ,  Andreas Bibl

IPC: H01L33/06 ,  H01L33/42 ,  H01L33/40

CPC classification number: H01L33/06 ,  H01L24/75 ,  H01L24/95 ,  H01L33/0079 ,  H01L33/24 ,  H01L33/405 ,  H01L33/42

Abstract: A nanowire device and a method of forming a nanowire device that is poised for pick up and transfer to a receiving substrate are described. In an embodiment, the nanowire device includes a base layer and a nanowire on and protruding away from a first surface of the base layer. The nanowire may include a core, a shell, and an active layer between the core and the shell. A top electrode layer may be on a second surface of the base layer opposite the first surface and in electrical contact with the core, and a bottom electrode layer may be on and electrical contact with the shell. In an embodiment, the base layer is characterized by a maximum width of the micro scale, and the nanowire is characterized by a maximum width or length of the nano scale.

Abstract translation: 描述了纳米线器件和形成用于拾取和转移到接收衬底的纳米线器件的方法。 在一个实施例中，纳米线器件包括基底层和在基底层的第一表面上并远离基底层突出的纳米线。 纳米线可以包括核心，壳体和核心和壳体之间的活性层。 顶部电极层可以在与第一表面相对的基底层的第二表面上并且与芯电接触，并且底部电极层可以在壳体上并且与壳体电接触。 在一个实施例中，基层的特征在于微尺度的最大宽度，并且纳米线的特征在于纳米尺度的最大宽度或长度。

公开(公告)号：US20150008389A1

公开(公告)日：2015-01-08

申请号：US13937000

申请日：2013-07-08

Applicant: LuxVue Technology Corporation

Inventor： Hsin-Hua Hu ,  Kevin K.C. Chang ,  Andreas Bibl

IPC: H01L33/08 ,  H01L33/04

CPC classification number: H01L33/62 ,  H01L24/75 ,  H01L24/83 ,  H01L24/95 ,  H01L25/0753 ,  H01L27/15 ,  H01L27/156 ,  H01L33/005 ,  H01L33/0079 ,  H01L33/0095 ,  H01L33/04 ,  H01L33/06 ,  H01L33/08 ,  H01L33/32 ,  H01L33/60 ,  H01L2224/83005 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2933/0066 ,  H01L2924/00

Abstract: A method and structure for stabilizing an array of micro devices is disclosed. A stabilization layer includes an array of stabilization cavities and array of stabilization posts. Each stabilization cavity includes sidewalls surrounding a stabilization post. The array of micro devices is on the array of stabilization posts. Each micro device in the array of micro devices includes a bottom surface that is wider than a corresponding stabilization post directly underneath the bottom surface.

公开(公告)号：US20140340900A1

公开(公告)日：2014-11-20

申请号：US13894332

申请日：2013-05-14

Applicant: Luxvue Technology Corporation

Inventor： Stephen Bathurst ,  Hsin-Hua Hu ,  Andreas Bibl

IPC: H05K7/08 ,  F21K99/00

CPC classification number: F21K9/00 ,  B81C99/002 ,  H01L24/00 ,  H01L33/0095 ,  H01L2224/03002 ,  H01L2224/06181 ,  H01L2224/94 ,  H01L2924/10253 ,  H01L2924/10272 ,  H01L2924/10329 ,  H01L2924/1033 ,  H01L2924/10331 ,  H01L2924/10336 ,  H01L2924/10342 ,  H01L2924/10346 ,  H01L2924/10349 ,  H01L2924/10375 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1431 ,  H01L2924/1434 ,  H01L2924/1461 ,  Y10T29/49002 ,  H01L2224/03 ,  H01L2924/00

Abstract: A stabilization structure includes a stabilization layer on a carrier substrate. The stabilization layer includes an array of staging cavities. An array of micro devices are within the array of staging cavities. Each micro device is laterally attached to a shear release post laterally extending from a sidewall of a staging cavity. A pressure is applied to the array of micro devices from the array of transfer heads to shear the array of micro devices off the shear release posts. The sheared off micro devices are picked up from the carrier substrate using the array of transfer heads.

Abstract translation: 稳定结构包括载体基底上的稳定层。 稳定层包括分段腔阵列。 微器件阵列在分级腔阵列内。 每个微器件横向地附接到从分级腔的侧壁横向延伸的剪切释放柱。 从转移头阵列向微器件阵列施加压力以将微器件阵列剪切离开剪切释放柱。 使用转移头阵列从载体衬底拾取剪切的微器件。

公开(公告)号：US20140159043A1

公开(公告)日：2014-06-12

申请号：US13842793

申请日：2013-03-15

Applicant: LUXVUE TECHNOLOGY CORPORATION

Inventor： Kapil V. Sakariya ,  Andreas Bibl ,  Hsin-Hua Hu

IPC: H01L33/62 ,  H01L29/786

CPC classification number: H01L27/156 ,  G09G3/32 ,  H01L24/95 ,  H01L25/0753 ,  H01L27/124 ,  H01L33/20 ,  H01L33/42 ,  H01L33/62 ,  H01L2924/0002 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/00

Abstract: A display panel and a method of forming a display panel are described. The display panel may include a thin film transistor substrate including a pixel area and a non-pixel area. The pixel area includes an array of bank openings and an array of bottom electrodes within the array of bank openings. A ground line is located in the non-pixel area and an array of ground tie lines run between the bank openings in the pixel area and are electrically connected to the ground line in the non-pixel area.

Abstract translation: 描述显示面板和形成显示面板的方法。 显示面板可以包括包括像素区域和非像素区域的薄膜晶体管基板。 像素区域包括堤开口的阵列和堤开口阵列内的一组底部电极。 接地线位于非像素区域中，并且阵列阵列在像素区域中的堤开口之间延伸并且电连接到非像素区域中的接地线。

公开(公告)号：US20140061687A1

公开(公告)日：2014-03-06

申请号：US14071106

申请日：2013-11-04

Applicant: LuxVue Technology Corporation

Inventor： Hsin-Hua Hu ,  Andreas Bibl ,  John A. Higginson ,  Hung-Fai Stephen Law

IPC: H01L33/08

CPC classification number: H01L33/08 ,  H01L21/67144 ,  H01L24/75 ,  H01L24/83 ,  H01L24/95 ,  H01L27/156 ,  H01L33/0079 ,  H01L33/405 ,  H01L2224/7598 ,  H01L2224/83 ,  H01L2224/95145 ,  H01L2924/01322 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/00

Abstract: A method of fabricating and transferring a micro device and an array of micro devices to a receiving substrate are described. In an embodiment, an electrically insulating layer is utilized as an etch stop layer during etching of a p-n diode layer to form a plurality of micro p-n diodes. In an embodiment, an electrically conductive intermediate bonding layer is utilized during the formation and transfer of the micro devices to the receiving substrate.

Abstract translation: 描述了将微器件和微器件阵列制造和传送到接收衬底的方法。 在一个实施例中，在蚀刻p-n二极管层以形成多个微p-n二极管期间，电绝缘层被用作蚀刻停止层。 在一个实施例中，在将微器件形成和传送到接收衬底期间，使用导电中间接合层。

公开(公告)号：US09741592B2

公开(公告)日：2017-08-22

申请号：US14466497

申请日：2014-08-22

Applicant: LuxVue Technology Corporation

Inventor： Hsin-Hua Hu ,  Andreas Bibl ,  John A. Higginson

IPC: H01L27/15 ,  H01L33/00 ,  H01L21/52 ,  H01L21/683 ,  H01L23/00 ,  H01L25/075 ,  H01L25/00

CPC classification number: H01L21/52 ,  H01L21/6835 ,  H01L21/6836 ,  H01L24/83 ,  H01L24/93 ,  H01L24/95 ,  H01L25/0753 ,  H01L25/50 ,  H01L27/156 ,  H01L33/0079 ,  H01L33/40 ,  H01L2221/6835 ,  H01L2224/95136 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/1461 ,  H01L2924/00

Abstract: A method and structure for stabilizing an array of micro devices is disclosed. The array of micro devices is formed on an array of stabilization posts formed from a thermoset material. Each micro device includes a bottom surface that is wider than a corresponding stabilization post directly underneath the bottom surface.

公开(公告)号：US09620487B2

公开(公告)日：2017-04-11

申请号：US14864570

申请日：2015-09-24

Applicant: LuxVue Technology Corporation

Inventor： Kapil V. Sakariya ,  Andreas Bibl ,  Hsin-Hua Hu

IPC: H01L25/07 ,  H01L25/075 ,  H01L33/60 ,  H01L25/16 ,  H01L33/44 ,  H01L33/62

CPC classification number: H01L25/0753 ,  H01L25/167 ,  H01L33/06 ,  H01L33/36 ,  H01L33/44 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/18 ,  H01L2224/24137 ,  H01L2224/73267 ,  H01L2224/82 ,  H01L2224/83 ,  H01L2224/92244 ,  H01L2224/95 ,  H01L2924/0002 ,  H01L2924/00

Abstract: Reflective bank structures for light emitting devices are described. The reflective bank structure may include a substrate, an insulating layer on the substrate, and an array of bank openings in the insulating layer with each bank opening including a bottom surface and sidewalls. A reflective layer spans sidewalls of each of the bank openings in the insulating layer.