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44 条记录 (耗时 0.031 秒)

    Printed circuit board and magnetic head driving device including the same
    1.
    发明授权
    Printed circuit board and magnetic head driving device including the same 有权
    印刷电路板和包括其的磁头驱动装置

    公开(公告)号：US08330054B2

    公开(公告)日：2012-12-11

    申请号：US12771500

    申请日：2010-04-30

    申请人： Mitsuru Honjo ,  Daisuke Yamauchi ,  Kei Nakamura

    发明人： Mitsuru Honjo ,  Daisuke Yamauchi ,  Kei Nakamura

    IPC分类号： H05K1/16

    CPC分类号： G11B5/4846 ,  G11B5/484 ,  H05K1/0245 ,  H05K1/189 ,  H05K3/0061 ,  H05K2201/09236 ,  H05K2201/09318 ,  H05K2201/10674 ,  H05K2201/2009

    摘要： A plurality of wiring traces are formed on a base insulating layer, and a metal layer is formed on the opposite surface of the base insulating layer. Two adjacent wiring traces constitute a transmission line pair. The width of the wiring trace is set to not more than 250 μm, and the distance between the adjacent wiring traces is set to not less than 8 μm. The thickness of the base insulating layer is selected to cause differential impedance of the transmission line pair to be not less than 10 Ω and not more than 50 Ω.

    摘要翻译： 在基底绝缘层上形成多个布线迹线，并且在基底绝缘层的相对表面上形成金属层。 两个相邻的布线迹线构成传输线对。 布线迹线的宽度设定为不大于250μm，并且相邻布线迹线之间的距离设定为不小于8μm。 选择基极绝缘层的厚度使传输线对的差分阻抗不小于10Ω; 不超过50个

    Flexible printed circuit board
    4.
    发明授权
    Flexible printed circuit board 有权
    柔性印刷电路板

    公开(公告)号：US08569629B2

    公开(公告)日：2013-10-29

    申请号：US12768258

    申请日：2010-04-27

    申请人： Tadao Ookawa ,  Mitsuru Honjo ,  Daisuke Yamauchi

    发明人： Tadao Ookawa ,  Mitsuru Honjo ,  Daisuke Yamauchi

    IPC分类号： H05K1/00 ,  H05K1/03 ,  H05K1/16 ,  H05K1/18 ,  H05K7/00 ,  H01B7/08

    CPC分类号： H05K1/0245 ,  H05K1/0393 ,  H05K3/28 ,  H05K2201/09236 ,  H05K2201/09318

    摘要： An FPC board includes a base insulating layer. A plurality of wiring traces are formed on the base insulating layer. The adjacent wiring traces are arranged at a distance d from each other, and each wiring trace has a predetermined width and a thickness t1. Each transmission line pair is constituted by the two adjacent wiring traces of the plurality of wring traces. A ratio of the thickness t1 of the wiring trace to the distance d between the adjacent wiring traces is set to 0.8 or more. A cover insulating layer may be formed on the base insulating layer to cover the wiring traces. A metal layer having a predetermined thickness may be provided on a back surface of the base insulating layer. Furthermore, a differential impedance of each transmission line pair may be set to 100 Ω.

    摘要翻译： FPC基板包括基底绝缘层。 在基底绝缘层上形成多个布线迹线。 相邻的布线轨迹彼此间距离设置，每个布线迹线具有预定的宽度和厚度t1。 每个传输线对由多个连接迹线的两个相邻的布线迹线构成。 布线迹线的厚度t1与相邻布线之间的距离d的比率设定为0.8以上。 覆盖绝缘层可以形成在基底绝缘层上以覆盖布线迹线。 可以在基底绝缘层的背面上设置具有预定厚度的金属层。 此外，每个传输线对的差分阻抗可以被设置为100Ω。

    Printed circuit board and method of manufacturing the same
    5.
    发明授权
    Printed circuit board and method of manufacturing the same 有权
    印刷电路板及其制造方法

    公开(公告)号：US09029708B2

    公开(公告)日：2015-05-12

    申请号：US13086449

    申请日：2011-04-14

    申请人： Tetsuya Oosawa ,  Mitsuru Honjo ,  Daisuke Yamauchi

    发明人： Tetsuya Oosawa ,  Mitsuru Honjo ,  Daisuke Yamauchi

    IPC分类号： H05K1/00 ,  H05K1/05 ,  H05K1/02

    CPC分类号： H05K1/056 ,  H05K1/0245 ,  H05K1/0251 ,  Y10T29/49155

    摘要： A base insulating layer is formed on a suspension body. Read wiring patterns, write wiring patterns and a ground pattern are formed in parallel on the base insulating layer. A first cover insulating layer is formed on the base insulating layer to cover the read wiring patterns, the write wiring patterns and the ground pattern. A ground layer is formed in a region on the first cover insulating layer above the write wiring patterns. A second cover insulating layer is formed on the first cover insulating layer to cover the ground layer.

    摘要翻译： 基体绝缘层形成在悬架体上。 读取布线图案，写入布线图案和接地图案在基底绝缘层上平行地形成。 第一覆盖绝缘层形成在基底绝缘层上以覆盖读取的布线图案，写入布线图案和接地图案。 在写入布线图案上方的第一覆盖绝缘层的区域中形成接地层。 第二盖绝缘层形成在第一盖绝缘层上以覆盖接地层。

    Opto-electric hybrid board and manufacturing method therefor
    6.
    发明授权
    Opto-electric hybrid board and manufacturing method therefor 有权
    光电混合电路板及其制造方法

    公开(公告)号：US08837873B2

    公开(公告)日：2014-09-16

    申请号：US13413853

    申请日：2012-03-07

    申请人： Akiko Nagafuji ,  Yuichi Tsujita ,  Masayuki Hodono ,  Masami Inoue ,  Mitsuru Honjo

    发明人： Akiko Nagafuji ,  Yuichi Tsujita ,  Masayuki Hodono ,  Masami Inoue ,  Mitsuru Honjo

    IPC分类号： G02B6/12 ,  G02B6/42 ,  G02B6/26

    CPC分类号： G02B6/4202 ,  G02B6/4231 ,  Y10T29/4914

    摘要： Provided are an opto-electric hybrid board and a manufacturing method therefor. An optical waveguide unit includes protruding portions which are extendingly provided at portions of at least one of an undercladding layer and an overcladding layer, and the protruding portions are located and formed at predetermined locations with respect to a light transmitting surface of a core. An electric circuit unit includes a bent portion having fitting holes into which the protruding portions fit and having an optical element. The fitting holes are located and formed at predetermined locations with respect to the optical element. The optical waveguide unit and the electric circuit unit are coupled to each other in a state in which the protruding portions fit into the fitting holes to form an opto-electric hybrid board.

    摘要翻译： 提供了一种光电混合基板及其制造方法。 光波导单元包括突出部分，其突出部分设置在下包层和外包层中的至少一个的部分处，并且突出部分相对于芯的透光表面定位并形成在预定位置。 电路单元包括具有嵌合孔的弯曲部分，突出部分配合并具有光学元件。 装配孔相对于光学元件定位并形成在预定位置。 光波导单元和电路单元在突出部分配合到装配孔中以形成光电混合板的状态下彼此耦合。

    Printed circuit board
    8.
    发明授权
    Printed circuit board 有权
    印刷电路板

    公开(公告)号：US08227699B2

    公开(公告)日：2012-07-24

    申请号：US12019661

    申请日：2008-01-25

    申请人： Mitsuru Honjo

    发明人： Mitsuru Honjo

    IPC分类号： H05K1/03

    CPC分类号： H05K1/0218 ,  H05K1/0216 ,  H05K1/162 ,  H05K3/4664 ,  H05K2201/0715 ,  H05K2201/09236 ,  H05K2201/09727

    摘要： A printed circuit board includes a base insulating layer, first to third signal lines, a first cover insulating layer and a conductive layer. Wide parts are formed in the first to third signal lines. The first cover insulating layer is provided on the base insulating layer so as to cover the wide parts. The conductive layer is provided on the first cover insulating layer so as to cover a portion above the wide parts.

    摘要翻译： 印刷电路板包括基底绝缘层，第一至第三信号线，第一覆盖绝缘层和导电层。 在第一至第三信号线中形成宽部分。 第一覆盖绝缘层设置在基底绝缘层上以覆盖宽部分。 导电层设置在第一覆盖绝缘层上，以覆盖宽部分上方的部分。

    Multi-layered printed circuit board with a conductive substrate and three insulating layers with wiring and ground traces
    9.
    发明授权
    Multi-layered printed circuit board with a conductive substrate and three insulating layers with wiring and ground traces 有权
    多层印刷电路板，带导电基板和三层绝缘层，布线和接地迹线

    公开(公告)号：US08017874B2

    公开(公告)日：2011-09-13

    申请号：US12388953

    申请日：2009-02-19

    申请人： Mitsuru Honjo ,  Katsutoshi Kamei

    发明人： Mitsuru Honjo ,  Katsutoshi Kamei

    IPC分类号： H05K1/00

    CPC分类号： H05K1/0248 ,  G11B5/484 ,  G11B5/4853 ,  G11B5/486 ,  H05K1/0219 ,  H05K1/0224 ,  H05K1/0245 ,  H05K1/0253 ,  H05K1/056 ,  H05K2201/09236 ,  H05K2201/09672 ,  H05K2201/0969

    摘要： A first insulating layer is formed on a suspension body, and a write wiring trace is formed on the first insulating layer. A second insulating layer is formed on the first insulating layer so as to cover the wiring trace. A write wiring trace is formed, above the write wiring trace, on the second insulating layer. A ground trace is formed on one side of the write wiring trace at a distance on the second insulating layer. A third insulating layer is formed on the second insulating layer so as to cover the wiring trace and the ground trace. An opening is formed in a region, below the write wiring trace, of the suspension body.

    摘要翻译： 在悬架体上形成第一绝缘层，在第一绝缘层上形成写入布线。 在第一绝缘层上形成第二绝缘层以覆盖布线迹线。 在第二绝缘层上形成写入布线迹线上方的写入布线。 在第二绝缘层上一定距离地在写入布线迹线的一侧上形成接地迹线。 在第二绝缘层上形成第三绝缘层，以覆盖布线迹线和接地迹线。 在悬挂体的写入配线轨迹的下方的区域形成有开口部。

    Production method of wired circuit board
    10.
    发明申请
    Production method of wired circuit board 失效
    有线电路板的生产方法

    公开(公告)号：US20050115066A1

    公开(公告)日：2005-06-02

    申请号：US10992009

    申请日：2004-11-19

    申请人： Mitsuru Honjo ,  Toshiki Naito

    发明人： Mitsuru Honjo ,  Toshiki Naito

    IPC分类号： H05K3/24 ,  H05K3/06 ,  H05K3/10 ,  H05K3/02

    CPC分类号： H05K3/108 ,  H05K3/062 ,  H05K2201/0347 ,  H05K2203/0542 ,  H05K2203/0597 ,  Y10T29/49117 ,  Y10T29/49155 ,  Y10T29/49156

    摘要： A production method of a wired circuit board that can prevent corrosion of a first thin metal film inwardly of a conductor layer, which is due to the forming of an undercut portion caused by a skirt portion of a plating resist, to prevent the peeling of a wiring circuit pattern. An insulating base layer 1 is prepared, first, and, then, a first thin metal film 2 is formed on the insulating base layer 1. Then, a plating resist 3 is formed in a reversal pattern to a wiring circuit pattern 4 on the first thin metal film 2, and a conductor layer 6 is formed in the wiring circuit pattern 4 on the first thin metal film 2 exposed form the plating resist 3. Thereafter, the plating resist 3 is removed and, then, a second thin metal film 8 is formed on the conductor layer 6 and first thin metal film 2. Thereafter, the second thin metal film 8 is removed. Then, all portions of the first thin metal layer 2, except portions thereof where the conductor layer 6 is formed, are removed. The flexible wired circuit board is produced by the processes described above.

    摘要翻译： 一种布线电路板的制造方法，其能够防止由电镀抗蚀剂的裙部形成的底切部形成导体层内部的第一薄金属膜的腐蚀，防止剥离 布线电路图案。 首先制备绝缘基底层1，然后在绝缘基底层1上形成第一薄金属膜2。 然后，以与第一薄金属膜2上的布线电路图案4相反的方式形成电镀抗蚀剂3，并且在布线电路图案4中形成导体层6，第一薄金属膜2暴露于镀层 抗拒3。 此后，除去电镀抗蚀剂3，然后在导体层6和第一薄金属膜2上形成第二薄金属膜8。 此后，去除第二薄金属膜8。 然后，除去第一薄金属层2的除了形成导体层6的部分之外的所有部分。 柔性布线电路板通过上述工艺制造。