公开(公告)号：US20210020368A1

公开(公告)日：2021-01-21

申请号：US16924413

申请日：2020-07-09

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Kazuki YOSHINO ,  Makoto OGAWA ,  Yasuhiro NISHISAKA

IPC: H01G4/232 ,  H01G4/008 ,  H01G4/30 ,  H01G4/12

Abstract: An electronic component includes a body portion and an external electrode on a surface of the body portion. The external electrode includes a base electrode layer, a first Ni plated layer, and an upper plated layer. The first Ni plated layer is provided on the base electrode layer. The upper plated layer is provided above the first Ni plated layer. The first Ni plated layer has a S concentration of not less than about 5.2×1018 atoms/cm3.

公开(公告)号：US20130141836A1

公开(公告)日：2013-06-06

申请号：US13749741

申请日：2013-01-25

Applicant: MURATA MANUFACTURING CO., LTD.

Inventor： Junichi SAITO ,  Toshihiko KOBAYASHI ,  Makoto OGAWA ,  Akihiro MOTOKI ,  Kenichi KAWASAKI ,  Tatsuo KUNISHI

IPC: H01G2/10

CPC classification number: H01G2/103 ,  B05D1/38 ,  B05D5/12 ,  B05D7/14 ,  H01G4/224

Abstract: In order to prevent the ingress of moisture into a void section of a component main body of a ceramic electronic component, at least the component main body of the ceramic electronic component is provided with water repellency using a water repellent agent. The water repellent agent is dissolved in a supercritical fluid such as, a supercritical CO2 fluid, as a solvent to provide at least the component main body with water repellency. After providing the water repellency, the water repellent agent on the outer surface of the component main body is removed. As the water repellent agent, a silane coupling agent may be used.

Abstract translation: 为了防止水分进入陶瓷电子部件的部件主体的空隙部，至少陶瓷电子部件的部件主体使用防水剂赋予防水性。 将防水剂溶解在超临界流体如超临界CO 2流体中作为溶剂，以至少提供组分主体的防水性。 在提供拒水性之后，除去组分主体外表面上的防水剂。 作为防水剂，可以使用硅烷偶联剂。

公开(公告)号：US20140312744A1

公开(公告)日：2014-10-23

申请号：US14320776

申请日：2014-07-01

Applicant: MURATA MANUFACTURING CO., LTD.

Inventor： Akihiro MOTOKI ,  Makoto OGAWA ,  Kenichi KAWASAKI ,  Shunsuke TAKEUCHI ,  Shigeyuki KURODA

IPC: H01C7/00 ,  H01L41/083 ,  H01F27/28 ,  H01G4/30

CPC classification number: H01C7/008 ,  B05D5/12 ,  H01F27/2804 ,  H01G4/005 ,  H01G4/012 ,  H01G4/228 ,  H01G4/2325 ,  H01G4/30 ,  H01G4/308 ,  H01L41/083

Abstract: A method for manufacturing a multilayer electronic component includes the steps of preparing a laminate including a plurality of laminated insulating layers and a plurality of internal electrodes disposed along interfaces between the insulating layers, edges of the internal electrodes being exposed at a predetermined surface of the laminate, and forming an external electrode on the predetermined surface to electrically connect exposed the edges of the internal electrodes. The step of forming an external electrode includes a plating step of forming a continuous plating film by depositing plating deposits on the edges of the internal electrodes exposed at the predetermined surface and by performing plating growth to be connected to each other, and a heat treatment step of performing a heat treatment at an oxygen partial pressure of about 5 ppm or less and at a temperature of about 600° C. or more.

公开(公告)号：US20140158293A1

公开(公告)日：2014-06-12

申请号：US14177472

申请日：2014-02-11

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Akihiro MOTOKI ,  Makoto OGAWA ,  Kenichi KAWASAKI ,  Shunsuke TAKEUCHI ,  Shigeyuki KURODA

IPC: H01G4/30

CPC classification number: H01C7/008 ,  B05D5/12 ,  H01F27/2804 ,  H01G4/005 ,  H01G4/012 ,  H01G4/228 ,  H01G4/2325 ,  H01G4/30 ,  H01G4/308 ,  H01L41/083

Abstract: A method for manufacturing a multilayer electronic component includes the steps of preparing a laminate including a plurality of laminated insulating layers and a plurality of internal electrodes disposed along interfaces between the insulating layers, edges of the internal electrodes being exposed at a predetermined surface of the laminate, and forming an external electrode on the predetermined surface to electrically connect exposed the edges of the internal electrodes. The step of forming an external electrode includes a plating step of forming a continuous plating film by depositing plating deposits on the edges of the internal electrodes exposed at the predetermined surface and by performing plating growth to be connected to each other, and a heat treatment step of performing a heat treatment at an oxygen partial pressure of about 5 ppm or less and at a temperature of about 600° C. or more.

Abstract translation: 一种多层电子部件的制造方法，其特征在于，具有：制造层叠绝缘层的多个层叠体和沿着绝缘层的界面配置的多个内部电极的层叠体的工序，在所述层叠体的规定表面露出内部电极的边缘 并且在所述预定表面上形成外部电极以电连接所述内部电极的边缘。 形成外部电极的步骤包括：电镀步骤，通过在暴露于预定表面的内部电极的边缘上沉积电镀沉积物并且通过进行电镀生长彼此连接来形成连续的镀膜;以及热处理步骤 在约5ppm或更低的氧分压和约600℃或更高的温度下进行热处理。

公开(公告)号：US20130152351A1

公开(公告)日：2013-06-20

申请号：US13767954

申请日：2013-02-15

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Makoto OGAWA ,  Seiichi MATSUMOTO ,  Akihiro MOTOKI ,  Toshiyuki IWANAGA ,  Tatsuo KUNISHI

IPC: H01G4/00

CPC classification number: H01G4/00 ,  C23C18/1632 ,  C23C18/1657 ,  C23C18/31 ,  C25D1/00 ,  C25D1/10 ,  H01G4/232 ,  H01G4/30 ,  H01G13/006 ,  Y10T29/43

Abstract: A method for producing a laminated ceramic capacitor allows a surface of at least a portion of a ceramic element body chip to be brought into contact with a plated layer formed in advance in a mold member, and performs heat processing on the ceramic element body chip in that contact state, thereby to form an external conductor layer made of the plated layer on the surface of at least the portion of the ceramic element body chip. Thus, a method and an apparatus for producing a ceramic electronic component accurately and precisely controls the thickness of the external conductor layer to be small, and easily controls the length of the external conductor layer.

Abstract translation: 陶瓷电容器的制造方法使陶瓷元件体芯片的至少一部分的表面与预先形成在模具部件中的镀层接触，并对陶瓷元件体芯片进行热处理 从而在陶瓷元件主体芯片的至少一部分的表面上形成由镀层形成的外部导体层。 因此，陶瓷电子部件的制造方法和装置精确而精确地控制外部导体层的厚度小，并且容易控制外部导体层的长度。

公开(公告)号：US20140211369A1

公开(公告)日：2014-07-31

申请号：US14160947

申请日：2014-01-22

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Takehisa SASABAYASHI ,  Akihiro MOTOKI ,  Makoto OGAWA

IPC: H01G4/008 ,  H01G4/30

CPC classification number: H01G4/008 ,  H01G4/0085 ,  H01G4/12 ,  H01G4/232 ,  H01G4/30

Abstract: A monolithic ceramic electronic component includes a component body and outer electrodes. The component body includes a plurality of stacked ceramic layers and a plurality of inner electrodes which extend between the ceramic layers, which contain Ni, and which include exposed ends exposed on predetermined surfaces of the component body. The outer electrodes are electrically connected to the exposed ends of the inner electrodes and are formed on the predetermined surfaces of the component body by plating. The inner electrodes include Mg—Ni coexistence regions where Mg and Ni coexist.

Abstract translation: 单片陶瓷电子部件包括部件主体和外部电极。 元件主体包括多个堆叠的陶瓷层和多个内部电极，其在包含Ni的陶瓷层之间延伸，并且其包括暴露在组件主体的预定表面上的暴露端。 外部电极与内部电极的露出端电连接，并且通过电镀形成在部件主体的预定表面上。 内部电极包括其中Mg和Ni共存的Mg-Ni共存区域。

公开(公告)号：US20210020370A1

公开(公告)日：2021-01-21

申请号：US16924411

申请日：2020-07-09

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Kazuki YOSHINO ,  Makoto OGAWA ,  Yasuhiro NISHISAKA

IPC: H01G4/232 ,  H01G4/30 ,  H01G4/008

Abstract: An electronic component includes a body portion and an external electrode. The external electrode is provided on a surface of the body portion. The external electrode includes a base electrode layer, a first Ni plated layer, and an upper plated layer. The first Ni plated layer is provided on the base electrode layer. The upper plated layer is provided above the first Ni plated layer. The first Ni plated layer includes Ni particles having an average particle size of not more than about 52 nm.

公开(公告)号：US20130242458A1

公开(公告)日：2013-09-19

申请号：US13886309

申请日：2013-05-03

Applicant: MURATA MANUFACTURING CO., LTD.

Inventor： Akihiro MOTOKI ,  Akihiro YOSHIDA ,  Makoto OGAWA

IPC: H01G4/30

CPC classification number: H01G4/30 ,  C23C18/405 ,  C23C28/023 ,  C23C28/028 ,  C25D5/10 ,  C25D5/12 ,  C25D17/20 ,  H01G4/2325 ,  Y10T428/24917

Abstract: A monolithic electronic component includes a laminate including a plurality of stacked insulating layers and a plurality of internal electrodes which extend between the insulating layers and which have end portions exposed at predetermined surfaces of the laminate, first plating layers disposed on the predetermined surfaces of the laminate, and second plating layers disposed on the first plating layer. The first plating layers are made of a metal different from that used to make the internal electrodes. The first plating layers are formed by electroless plating. The second plating layers are formed by electroplating.

Abstract translation: 单片电子部件包括层叠体，该层压体包括多个层叠绝缘层和在绝缘层之间延伸的多个内部电极，并且其端部暴露在层叠体的预定表面处，设置在层压体的预定表面上的第一镀层 以及设置在第一镀层上的第二镀层。 第一镀层由不同于制造内部电极的金属制成。 第一镀层通过无电镀形成。 第二镀层通过电镀形成。

公开(公告)号：US20150325374A1

公开(公告)日：2015-11-12

申请号：US14805491

申请日：2015-07-22

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Akihiro MOTOKI ,  Syunsuke TAKEUCHI ,  Makoto OGAWA ,  Seiichi NISHIHARA ,  Kenichi KAWASAKI ,  Shuji MATSUMOTO

IPC: H01G4/248 ,  B32B37/18 ,  H01G4/012 ,  H01G4/30 ,  H01G4/12 ,  B32B18/00 ,  C23C18/40

CPC classification number: H01G4/248 ,  B32B18/00 ,  B32B37/18 ,  B32B2307/202 ,  B32B2315/02 ,  B32B2457/00 ,  C23C18/40 ,  H01G4/005 ,  H01G4/012 ,  H01G4/12 ,  H01G4/228 ,  H01G4/30

Abstract: In a method of forming a plating layer for an external terminal electrode by applying, for example, copper plating to an end surface of a component main body with respective ends of internal electrodes exposed, and then applying a heat treatment at a temperature of about 1000° C. or more in order to improve the adhesion strength and moisture resistance of the external terminal electrode, the plating layer may be partially melted to decrease the bonding strength of the plating layer. In the step of applying a heat treatment at a temperature of about 1000° C. or more to a component main body with plating layers formed thereon, the average rate of temperature increase from room temperature to the temperature of about 1000° C. or more is set to about 100° C./minute or more. This average rate of temperature increase maintains a moderate eutectic state in the plating layer and ensures a sufficient bonding strength of the plating layer.

Abstract translation: 在形成外部端子电极用镀层的方法中，例如通过对内部电极的两端露出的部件主体的端面进行镀铜，然后在约1000℃的温度下进行热处理 ℃以上，为了提高外部端子电极的粘合强度和耐湿性，可以使镀层部分熔融，降低镀层的接合强度。 在其上形成有镀层的组件主体上，在约1000℃以上的温度下进行热处理的步骤中，平均温度从室温升高至约1000℃以上的温度 设定为约100℃/分钟以上。 该平均升温速率在镀层中保持中等的共晶状态，并确保镀层的充分的接合强度。

公开(公告)号：US20140293503A1

公开(公告)日：2014-10-02

申请号：US14228331

申请日：2014-03-28

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Takehisa SASABAYASHI ,  Akihiro MOTOKI ,  Makoto OGAWA

IPC: H01G4/005 ,  H01G4/008 ,  H01G4/30

CPC classification number: H01G4/30 ,  H01C1/148 ,  H01C7/008 ,  H01C7/18 ,  H01F17/0013 ,  H01F27/292 ,  H01G4/012 ,  H01G4/232 ,  H01G4/2325 ,  H01L41/0471 ,  H01L41/0472

Abstract: A monolithic ceramic electronic component includes an outer electrode including a first plating layer formed directly on a component body by electroless plating so as to cover an exposed portion distribution region including exposed portions of a plurality of inner electrodes and a second plating layer formed by electrolytic plating so as to cover the first plating layer. An amount of extension of the first plating E1 and an amount of extension of the second plating E2 satisfy the relationship E1/(E1+E2)≦20%, where E1 represents a distance from an edge of the exposed portion distribution region to an edge of the first plating layer, and E2 represents a distance from the edge of the first plating layer to an edge of the second plating layer.

Abstract translation: 单片陶瓷电子部件包括外电极，其包括通过化学镀直接形成在部件主体上的第一镀层，以覆盖包括多个内电极的暴露部分的暴露部分布区域和由电解电镀形成的第二镀层 以覆盖第一镀层。 第一电镀E1的延伸量和第二电镀E2的延伸量满足关系E1 /（E1 + E2）＆nlE; 20％，其中E1表示从暴露部分布区域的边缘到 第一镀层的边缘，E2表示从第一镀层的边缘到第二镀层的边缘的距离。