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公开(公告)号：US20220341053A1
公开(公告)日：2022-10-27
申请号：US17718756
申请日：2022-04-12
Inventor： Shiro HARA , Fumito IMURA , Sommawan KHUMPUANG , Yuuki ISHIDA , Toshihiro KIKUNO , Takafumi YOSHINAGA , Kayo KAMASAKI , Mitsuhiko FUKUYAMA , Tetuya MORIZONO
Abstract: The plating machine 1 comprises a plurality of treatment units 14 and a conveying means 13 that conveys a wafer W to the plurality of treatment units 14, wherein the conveying means 13 includes an arm 31 that is provided, on one end side, with a plating tool 32 that holds the wafer W, and an arm rotation drive unit 33 that rotates the arm 31 around another end side of the arm 31, and the plurality of treatment units 14 is arranged at predetermined intervals on a rotation trajectory of the plating tool 32.
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公开(公告)号：US20150380289A1
公开(公告)日：2015-12-31
申请号：US14768352
申请日：2014-02-17
Inventor： Shiro HARA , Hitoshi MAEKAWA , Shizuka NAKANO
IPC: H01L21/677
CPC classification number: H01L21/67778 , H01L21/67155 , H01L21/67167 , H01L21/67276 , H01L21/67739 , H01L21/67745
Abstract: [Problem to be Solved]A production system to facilitate the commonization of front chambers among a plurality of production devices that are different in the kind of a process to be performed for a processing substrate. According to the production system of the present invention, it is possible to reduce the development cost and production cost of the production devices.[Solution]Control units are provided separately in a processing chamber and a front chamber of a small production device. When the processing-chamber control unit outputs a load request signal, the front-chamber control unit loads a processing substrate to the processing chamber, and outputs a load acknowledgment signal. When the load acknowledgment signal is input, the processing-chamber control unit performs a process for the processing substrate, and outputs an unload request signal after the completion of the process. When the unload request signal is input, the front-chamber control unit starts the unloading of the processing substrate, and outputs an unload acknowledgment signal when the processing substrate is unloaded from the processing chamber. When the unload acknowledgment signal is input, the processing chamber starts the preparation of the next process.
Abstract translation: [待解决的问题]一种生产系统，用于促进在对处理基板进行的处理的种类不同的多个生产装置之间的前室的通用化。 根据本发明的生产系统，可以降低生产装置的开发成本和生产成本。 [解决方案]控制单元分别设置在小型生产装置的处理室和前室中。 当处理室控制单元输出负载请求信号时，前室控制单元将处理衬底加载到处理室，并输出负载确认信号。 当输入负载确认信号时，处理室控制单元执行处理衬底的处理，并且在完成处理之后输出卸载请求信号。 当输入卸载请求信号时，前室控制单元开始卸载处理基板，并且当处理基板从处理室卸载时输出卸载确认信号。 当输入卸载确认信号时，处理室开始准备下一个处理。
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公开(公告)号：US20180001354A1
公开(公告)日：2018-01-04
申请号：US15532846
申请日：2015-12-02
Inventor： Shiro HARA , Sommawan KHUMPUANG , Akio KOBAYASHI , Takeshi UMINO , Sonoko MATSUDA
CPC classification number: B08B3/08 , B08B3/04 , B08B3/12 , H01L21/67017 , H01L21/67023 , H01L21/67051 , H01L21/6708
Abstract: A treatment liquid supply device and a wet treatment device with which an extremely small quantity of the treatment liquid can be accurately supplied, as a method for supplying a treatment liquid to an extremely small wafer of half inch size, including: a syringe that sucks and discharges the treatment liquid; a treatment liquid bottle that is filled with the treatment liquid; a suction hose that has one end connected to the treatment liquid bottle and the other end connected to the syringe, and sucks the treatment liquid inside the treatment liquid bottle to the syringe; a supply hose that has one end connected to an intermediate section of the suction hose and serves to supply, to the surface of the wafer, the treatment liquid discharged by the syringe; and a three-way solenoid valve that controls opening/closing of each of the suction and supply hoses.
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公开(公告)号：US20170352570A1
公开(公告)日：2017-12-07
申请号：US15529070
申请日：2015-11-24
Inventor： Shiro HARA , Sommawan KHUMPUANG , Fumito IMURA , Michihiro INOUE , Arami SARUWATARI
IPC: H01L21/683 , H01L23/00 , H01L21/56 , H01L23/31
CPC classification number: H01L21/6835 , H01L21/02 , H01L21/565 , H01L21/568 , H01L21/683 , H01L23/3114 , H01L23/544 , H01L24/02 , H01L24/03 , H01L24/05 , H01L24/11 , H01L24/13 , H01L2221/68309 , H01L2221/68372 , H01L2223/54426 , H01L2224/02311 , H01L2224/02313 , H01L2224/02377 , H01L2224/02379 , H01L2224/0239 , H01L2224/03002 , H01L2224/03462 , H01L2224/0361 , H01L2224/03622 , H01L2224/0391 , H01L2224/0401 , H01L2224/05548 , H01L2224/11002 , H01L2224/11334 , H01L2224/11849 , H01L2224/12105 , H01L2224/13022 , H01L2224/13024 , H01L2224/94 , H01L2924/01029 , H01L2224/03 , H01L2924/00014
Abstract: An object of the present invention is to provide a circular support substrate that allows for positioning based solely on its outer periphery shape. As a means for solving the problems, a circular support substrate is provided that has at least three chords along its circumference, wherein the chords are provided at positions where they do not run linearly symmetrical to the straight line passing through the center axis of the circular support substrate.
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5.发明申请MOUNTING STRUCTURE OF MOVABLE MANUFACTURING DEVICE, FIXING STRUCTURE AND MOVABLE MANUFACTURING DEVICE 有权可移动制造装置的安装结构，固定结构和可移动制造装置公开(公告)号：US20140263938A1
公开(公告)日：2014-09-18
申请号：US14292125
申请日：2014-05-30
Applicant: NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY , DESIGN NETWORK CO., LTD.
Inventor： Shiro HARA , Shizuka NAKANO , Hitoshi MAEKAWA , Shinji FUTAGAWA , Takahiro FUKUDA
IPC: B23Q1/01
CPC classification number: B23Q1/01 , B62B3/06 , B62B5/049 , B62B5/063 , B62B2203/28 , F16M11/20 , H01L21/67775
Abstract: Mounting structure to allow a production line made up of movable manufacturing devices to be rearranged quickly, safely, and reliably. The mounting structure according to the present invention includes a fixing structure installed on a floor and a leg portion installed on a bottom plate of the movable manufacturing device. The fixing structure comprises a floor side positioning member and a floor side coupling member while the leg portion comprises a leg side positioning member and a leg side coupling member. The floor side positioning member and the leg side positioning member positions the movable manufacturing device accurately by fitting each other when the device is placed at the specified location of the fixing structure. The floor side coupling member and the leg side coupling member fixes the movable manufacturing device located on the fixing structure by coupling each other.
Abstract translation: 安装结构使得由可移动制造装置组成的生产线能够快速，安全，可靠地重新排列。 根据本发明的安装结构包括安装在地板上的固定结构和安装在可移动制造装置的底板上的脚部。 固定结构包括地板侧定位构件和地板侧联接构件，而腿部包括腿侧定位构件和腿侧联接构件。 当装置放置在固定结构的指定位置时，地板侧定位构件和腿侧定位构件将可动制造装置准确地相互配合。 地板侧联接构件和腿侧联接构件通过彼此联接固定位于固定结构上的可移动制造装置。
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Patent Agency Ranking
公开(公告)号：US20210302034A1
公开(公告)日：2021-09-30
申请号：US17210361
申请日：2021-03-23
Inventor： Shiro HARA , Hitoshi MAEKAWA , Sommawan KHUMPUANG , Takashi YAJIMA , Yuuki ISHIDA
Abstract: An encapsulated cleanroom system comprising a processing chamber and a storage section in which the processing chamber is stored, wherein, during operation, the pressure in the storage section is lower or higher than the pressures in the processing chamber and exterior space. The system can simultaneously prevent the entry of outside gases into its processing chamber and the leakage of the gases inside the processing chamber to the exterior space.
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公开(公告)号：US20180025994A1
公开(公告)日：2018-01-25
申请号：US15529072
申请日：2015-11-24
Inventor： Shiro HARA , Sommawan KHUMPUANG , Fumito IMURA , Michihiro INOUE , Arami SARUWATARI
IPC: H01L23/00 , H01L21/56 , H01L23/31 , H01L21/48 , H01L23/538 , H01L23/367
CPC classification number: H01L23/562 , H01L21/4853 , H01L21/4871 , H01L21/563 , H01L23/12 , H01L23/295 , H01L23/296 , H01L23/3114 , H01L23/3128 , H01L23/3675 , H01L23/5386 , H01L23/5389 , H01L24/19 , H01L24/20 , H01L2224/04105 , H01L2224/12105 , H01L2224/214 , H01L2224/32225 , H01L2224/32245 , H01L2224/73267 , H01L2224/82039 , H01L2224/83805 , H01L2224/83851 , H01L2224/92244 , H01L2924/10155 , H01L2924/10252 , H01L2924/10253 , H01L2924/10254 , H01L2924/10272 , H01L2924/10329 , H01L2924/1033 , H01L2924/1203 , H01L2924/1301 , H01L2924/1304 , H01L2924/14 , H01L2924/1432 , H01L2924/1461 , H01L2924/35121
Abstract: An object of the present invention is to provide a surface-mount type package for semiconductor chips which is resistant to failures caused by thermal stress. As a means for achieving the object, a method for manufacturing a surface-mount type package whose face parallel with the semiconductor chip surface has a circular cross-section, is provided, wherein such method is characterized in that it comprises at least the following steps in this order.A first step in which a semiconductor chip is bonded onto a circular support substrate.A second step in which the semiconductor chip is sealed with resin.A third step in which the resin covering the pads of the semiconductor chip is removed.A fourth step in which a rewiring layer is formed.A fifth step in which bumps are formed.
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公开(公告)号：US20170309507A1
公开(公告)日：2017-10-26
申请号：US15531962
申请日：2015-12-01
Inventor： Shiro HARA , Hitoshi MAEKAWA
IPC: H01L21/677 , H01L21/687
CPC classification number: H01L21/67745 , H01L21/677 , H01L21/67727 , H01L21/6773 , H01L21/67736 , H01L21/67742 , H01L21/67766 , H01L21/68785
Abstract: A compact manufacturing device to automatically transport a wafer transport container. The compact manufacturing device comprises a processing chamber and a device front chamber provided inside a housing, a container mounting table provided in the housing to mount a substrate transport container accommodating a processing substrate, and a container transport mechanism. The container transport mechanism delivers the substrate transport container to the adjacent compact manufacturing device along a container transport path and/or receives the substrate transport container from adjacent compact manufacturing device along the container transport path when a plurality of the compact manufacturing devices are provided in parallel.
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公开(公告)号：US20200266119A1
公开(公告)日：2020-08-20
申请号：US16497283
申请日：2018-03-28
Inventor： Shiro HARA , Sommawan KHUMPUANG , Fumito IMURA
IPC: H01L23/12 , H01L21/677 , H01L21/56 , H01L23/544
Abstract: A method of manufacturing a semiconductor package and a semiconductor package in which positional alignment between a wafer and a substrate until the wafer is mounted and packaged on the substrate is achieved accurately. A wafer is mounted on a package substrate by using first alignment marks and D-cuts as benchmarks, and then a mold resin layer is formed on the wafer in a state in which the first alignment mark is exposed. A part of the mold resin layer is removed by using the D-cuts exposed from the mold resin layer as benchmarks, so that the first alignment marks can be visually recognized. A second alignment marks are formed on the mold resin layer by using the first alignment marks as benchmarks. A Cu redistribution layer to be conducted to a pad portion is formed on a mold resin layer by using the second alignment marks as benchmarks.
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公开(公告)号：US20190164797A1
公开(公告)日：2019-05-30
申请号：US16182891
申请日：2018-11-07
Applicant: NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY , DESIGN NETWORK CO., LTD.
Inventor： Shiro HARA , Hitoshi MAEKAWA , Hiroyuki NISHIHARA , Koji SAGISAWA
IPC: H01L21/677
Abstract: An automatic clamping mechanism capable of automatically securing and releasing a wafer transport container to or from a manufacturing apparatus and having a small height dimension is provided at low cost. A wafer transport container is placed on a container placing table. A semiconductor wafer is loaded into the manufacturing apparatus main body from a wafer loading port while being placed on a container base part of the wafer transport container. An automatic clamping mechanism generates a press force component in a vertical direction at the wafer transport container and secures the wafer transport container to the container placing table by bringing claw parts of a plurality of clamping claws into contact with an inclined contact surface provided on a container lid part of the wafer transport container and pressing the inclined contact surface in a substantially horizontal direction.
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