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1.发明公开公开(公告)号：US20230364676A1
公开(公告)日：2023-11-16
申请号：US18226642
申请日：2023-07-26
Applicant: Nichia Corporation
Inventor： Teppei KUNIMUNE , Masafumi KURAMOTO
CPC classification number: B22F3/26 , B22F7/004 , B22F7/062 , B22F7/04 , B32B15/046 , B32B15/043 , B32B9/005 , B05D3/0493 , B05D2504/00 , B05D2601/22 , B22F2007/045 , B32B2307/422 , B05D2202/00
Abstract: A method of impregnating voids of a sintered metal body having a porous structure with resin, the method comprising preparing a resin material that contains a defoamer containing hydrophilic or hydrophobic particles, defoaming the prepared resin material by reducing pressure of the resin material, applying the defoamed resin material onto a surface of the sintered metal body, impregnating the voids with the resin material by reducing pressure of the sintered metal body and the resin material applied to the surface of the sintered metal body so as to expel gas from the voids; and curing the resin material by heating.
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公开(公告)号：US20190326493A1
公开(公告)日：2019-10-24
申请号：US16451559
申请日：2019-06-25
Applicant: NICHIA CORPORATION
Inventor： Masafumi KURAMOTO , Satoru OGAWA , Katsuaki SUGANUMA , Keun-Soo KIM
Abstract: An object of the present invention is to provide a method for producing a conductive material that allows a low electric resistance to be generated, and that is obtained by using an inexpensive and stable conductive material composition containing no adhesive. The conductive material can be provided by a producing method that includes the step of sintering a first conductive material composition that contains silver particles having an average particle diameter (median diameter) of 0.1 μm to 15 μm, and a metal oxide, so as to obtain a conductive material. The conductive material can be provided also by a method that includes the step of sintering a second conductive material composition that contains silver particles having an average particle diameter (median diameter) of 0.1 μm to 15 μm in an atmosphere of oxygen or ozone, or ambient atmosphere, at a temperature in a range of 150° C. to 320° C., so as to obtain a conductive material.
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公开(公告)号：US20180182917A1
公开(公告)日：2018-06-28
申请号：US15851636
申请日：2017-12-21
Applicant: NICHIA CORPORATION
Inventor： Masafumi KURAMOTO , Daisuke IWAKURA
Abstract: A method for manufacturing a light emitting device includes placing a light emitting element on a releasable base material so that a first face of the light emitting element is in contact with the releasable base material. An entire area of the first face is a first area. A wavelength converting material is provided on the releasable base material to cover an entirety of the light emitting element. The releasable base material is removed. A first electrically conductive material covers the first electrode and the wavelength converting material. An entire area of the first electrically conductive material viewed in a height direction is a second area larger than the first area. A second electrically conductive material covers the second electrode and the wavelength converting material. An entire area of the second electrically conductive material viewed in the height direction is a third area larger than the first area.
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公开(公告)号：US20170369751A1
公开(公告)日：2017-12-28
申请号：US15630559
申请日：2017-06-22
Applicant: DAICEL CORPORATION , NICHIA CORPORATION
Inventor： Yasunobu NAKAGAWA , Takeshi YOSHIDA , Satoru OGAWA , Masafumi KURAMOTO , Masahide BANDO
IPC: C09J183/06 , H01L33/56 , C08G77/20
CPC classification number: G01N19/04 , C08G77/20 , C08G77/50 , C09J183/04 , C09J183/06 , G01N33/442 , G01N33/445 , H01L33/56 , C08K5/3477 , C08K5/5435 , C08K5/56 , C08L83/00
Abstract: Provided is a curable resin composition which can be cured to form a material (cured product) that has low tack properties and resists adhesion of garbage. The present invention provides a curable resin composition comprising polysiloxane (A) having not less than 2 alkenyl groups in the molecule and polysiloxane (B) having not less than 2 hydrosilyl groups in the molecule, wherein (T+Q)/D>0.3 and M+D+T+Q=1 are satisfied regarding all silicon atoms contained therein, the amount of the hydrosilyl groups with respect to 1 mol of aliphatic carbon-carbon double bonds present therein is 0.9 to 5.0 mol, and a cured product of the curable resin composition exhibits a separation strength of not more than 0.40 N per mm2 in separation load evaluation and/or a total separation load of not more than 0.018 N·mm per mm2.
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公开(公告)号：US20170162765A1
公开(公告)日：2017-06-08
申请号：US15435710
申请日：2017-02-17
Applicant: NICHIA CORPORATION
Inventor： Masafumi KURAMOTO , Akiko YAMASAKI , Hirofumi ICHIKAWA , Yasunori SHIMIZU , Akihiro OTA
CPC classification number: H01L33/56 , C09K11/025 , C09K11/7774 , H01L33/0095 , H01L33/50 , H01L33/501 , H01L33/502 , H01L33/508 , H01L33/54 , H01L33/62 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2224/49113 , H01L2933/0091 , H01L2924/00014 , H01L2924/00
Abstract: A light emitting device includes a base substrate having a recessed portion at a flat upper surface thereof. The recessed portion has an inner wall. A sealing member is provided in the recessed portion. The sealing member contains surface-treated particles, or particles coexisting with a dispersing agent. The particles have a particle diameter of 1 nm or more and 100 μm or less. The particles are made of an organic material or an inorganic material. The organic material and the inorganic material are free of a phosphor. The at least a part of an edge portion of the sealing member is a region located in the vicinity of an edge of the recessed portion which is a boundary between a surface of the inner wall and the flat upper surface. The at least one of the particles and aggregates of particles are unevenly distributed in the region.
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Patent Agency Ranking
公开(公告)号：US20140027780A1
公开(公告)日：2014-01-30
申请号：US14044419
申请日：2013-10-02
Applicant: NICHIA CORPORATION
Inventor： Masafumi KURAMOTO , Tomohide MIKI , Tomoya TSUKIOKA , Tomohisa KISHIMOTO
CPC classification number: H01L33/36 , C08G59/3245 , C08K3/013 , C08K5/005 , H01L33/32 , H01L33/56 , H01L33/60 , H01L2224/0603 , H01L2224/32245 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2224/73265 , H01L2924/01004 , H01L2924/01019 , H01L2924/01057 , H01L2924/01067 , H01L2924/01079 , H01L2924/00014 , H01L2924/00
Abstract: Disclosed is a light-emitting device comprising a light-emitting element (10) composed of a gallium nitride compound semiconductor having an emission peak wavelength of not less than 430 nm; a molded body (40) provided with a recessed portion having a bottom surface on which the light-emitting element (10) is mounted and a lateral surface; and a sealing member (50) containing an epoxy resin including a triazine derivative epoxy resin, or a silicon-containing resin. The molded body (40) is obtained by using a cured product of a thermosetting epoxy resin composition essentially containing an epoxy resin including a triazine derivative epoxy resin, and has a reflectance of not less than 70% at the wavelengths of not less than 430 nm.
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7.发明申请公开(公告)号：US20130193436A1
公开(公告)日：2013-08-01
申请号：US13828118
申请日：2013-03-14
Applicant: NICHIA CORPORATION
Inventor： Masafumi KURAMOTO , Tomohisa KISHIMOTO
CPC classification number: H01L33/486 , H01L24/45 , H01L24/48 , H01L24/73 , H01L33/26 , H01L33/32 , H01L33/34 , H01L33/44 , H01L33/56 , H01L33/62 , H01L33/64 , H01L33/647 , H01L2224/32245 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/01004 , H01L2924/01012 , H01L2924/0102 , H01L2924/01025 , H01L2924/01057 , H01L2924/01063 , H01L2924/01066 , H01L2924/01067 , H01L2924/01078 , H01L2924/01079 , H01L2924/01322 , H01L2924/12035 , H01L2924/12036 , H01L2924/12041 , H01L2924/12042 , H01L2924/181 , H01L2924/3025 , H01L2933/0033 , H01L2933/005 , H01L2933/0066 , H01L2924/00014 , H01L2924/00012 , H01L2924/00
Abstract: The present invention provides a surface mounted light emitting apparatus which has long service life and favorable property for mass production, and a molding used in the surface mounted light emitting apparatus.The surface mounted light emitting apparatus comprises the light emitting device 10 based on GaN which emits blue light, the first resin molding 40 which integrally molds the first lead 20 whereon the light emitting device 10 is mounted and the second lead 30 which is electrically connected to the light emitting device 10, and the second resin molding 50 which contains YAG fluorescent material and covers the light emitting device 10. The first resin molding 40 has the recess 40c comprising the bottom surface 40a and the side surface 40b formed therein, and the second resin molding 50 is placed in the recess 40c. The first resin molding 40 is formed from a thermosetting resin such as epoxy resin by the transfer molding process, and the second resin molding 50 is formed from a thermosetting resin such as silicone resin.
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公开(公告)号：US20220403232A1
公开(公告)日：2022-12-22
申请号：US17808031
申请日：2022-06-21
Applicant: NICHIA CORPORATION
Inventor： Takuma ARIKAWA , Masafumi KURAMOTO , Hiroki INOUE
IPC: C09K11/02 , C09K11/06 , C09D5/22 , C09D135/02 , H01L33/50
Abstract: Fluorescent material composite particles include translucent inorganic particles having a volume average particle diameter in a range of 30 nm or more and 500 nm or less, fluorescent nanoparticles having an average particle diameter in a range of 5 nm or more and 25 nm or less, and a first resin. At least a part of each of the translucent inorganic particles are embedded in the first resin. The translucent inorganic particles are unevenly distributed to a surface of the fluorescent material composite particles. The fluorescent material composite particles have a volume average particle diameter in a range of 0.5 μm or more and 50 μm or less.
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公开(公告)号：US20220017793A1
公开(公告)日：2022-01-20
申请号：US17488687
申请日：2021-09-29
Applicant: Nichia Corporation
Inventor： Teppei KUNIMUNE , Masafumi KURAMOTO
IPC: C09J9/02 , C08K3/08 , C09J171/02
Abstract: Disclosed is an electrically conductive adhesive containing:
(A) a polyether polymer having a backbone comprising a repeating unit of the formula: —R1—O— wherein R1 is a hydrocarbon group having 1 to 10 carbon atoms, and an end group which is a hydrolyzable silyl group, and (B) silver particles. Further disclosed is an electrically conductive material which is a hardened product of the electrically conductive adhesive.-
公开(公告)号：US20210167264A1
公开(公告)日：2021-06-03
申请号：US17171268
申请日：2021-02-09
Applicant: NICHIA CORPORATION
Inventor： Masafumi KURAMOTO , Satoru OGAWA , Katsuaki SUGANUMA , Keun-Soo KIM
Abstract: An object of the present invention is to provide a method for producing a conductive material that allows a low electric resistance to be generated, and that is obtained by using an inexpensive and stable conductive material composition containing no adhesive. The conductive material can be provided by a producing method that includes the step of sintering a first conductive material composition that contains silver particles having an average particle diameter (median diameter) of 0.1 μm to 15 μm, and a metal oxide, so as to obtain a conductive material. The conductive material can be provided also by a method that includes the step of sintering a second conductive material composition that contains silver particles having an average particle diameter (median diameter) of 0.1 μm to 15 μm in an atmosphere of oxygen or ozone, or ambient atmosphere, at a temperature in a range of 150° C. to 320° C., so as to obtain a conductive material.
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