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公开(公告)号：US20070264752A1
公开(公告)日：2007-11-15
申请号：US11634119
申请日：2006-12-06
申请人： Norio Kainuma , Hidehiko Kira , Kenji Kobae , Kimio Nakamura , Kuniko Ishikawa , Yukio Ozaki
发明人： Norio Kainuma , Hidehiko Kira , Kenji Kobae , Kimio Nakamura , Kuniko Ishikawa , Yukio Ozaki
IPC分类号： H01L21/00
CPC分类号： H01L21/563 , H01L24/29 , H01L24/81 , H01L24/83 , H01L2224/16225 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2224/81205 , H01L2224/81801 , H01L2224/83192 , H01L2924/01005 , H01L2924/01006 , H01L2924/01019 , H01L2924/01033 , H01L2924/01079 , H01L2924/01082 , H01L2924/00 , H01L2924/3512
摘要： A method of manufacturing a semiconductor device flip-chip bonds electrode terminals of a substrate and a semiconductor chip together by solid-phase diffusion and underfills a gap between the substrate and the semiconductor chip with a thermosetting resin without the bonds between the terminals breaking due to heat in an underfill hardening step. The method includes a bonding step of flip-chip bonding the electrode terminals of the substrate and the semiconductor chip by solid-phase diffusion, an underfill filling step of filling the gap between the substrate and the semiconductor chip with the underfill material, and the underfill hardening step where the underfill material is heated to the hardening temperature to harden the underfill material. During the underfill hardening step, a member with a lower coefficient of thermal expansion out of the substrate and the semiconductor chip is heated to a higher temperature than the other member.
摘要翻译： 半导体器件倒装芯片的制造方法通过固相扩散将基板和半导体芯片的电极端子连接在一起，并且用热固性树脂对基板和半导体芯片之间的间隙进行底部填充，而不会由于端子断裂而导致端子之间的结合 在底部填充硬化步骤中加热。 该方法包括通过固相扩散将基板和半导体芯片的电极端子倒装连接的接合步骤，用底部填充材料填充基板和半导体芯片之间的间隙的底部填充步骤，以及底部填充 硬化步骤，其中将底部填充材料加热至硬化温度以使底部填充材料硬化。 在底部填充硬化工序中，将从基板和半导体芯片的热膨胀系数较低的部件加热到比其他部件高的温度。
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公开(公告)号：US07833831B2
公开(公告)日：2010-11-16
申请号：US11951693
申请日：2007-12-06
申请人： Norio Kainuma , Kuniko Ishikawa , Hidehiko Kira
发明人： Norio Kainuma , Kuniko Ishikawa , Hidehiko Kira
IPC分类号： H01L21/00
CPC分类号： B23K1/06 , B23K1/0016 , B23K2101/40 , H01L21/6835 , H01L24/11 , H01L24/12 , H01L24/16 , H01L24/742 , H01L24/75 , H01L24/81 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/11003 , H01L2224/1134 , H01L2224/11822 , H01L2224/131 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/75 , H01L2224/75251 , H01L2224/75252 , H01L2224/81011 , H01L2224/81024 , H01L2224/81121 , H01L2224/81203 , H01L2224/81801 , H01L2224/83192 , H01L2924/00013 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01009 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/3025 , H05K3/3478 , H05K2201/10674 , H05K2201/10984 , H05K2203/0285 , H05K2203/0338 , H05K2203/1105 , Y10T428/12493 , H01L2224/13099 , H01L2924/00 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： An electronic component is equipped with electrode protrusions that make it possible to mount the electronic component without covering connection pads of a circuit board with solder and to dispose the connection pads of the circuit board with a narrow pitch while preventing electrical shorting of the connection electrodes during mounting. A method of manufacturing an electronic component equipped with connection electrodes, where electrode protrusions are covered with solder, includes a step of heating a solder sheet to a semi-molten state and pressing the electronic component onto the solder sheet to place the electrode protrusions in contact with the solder sheet and a step of retracting the electronic component from a position where the electrode protrusions contact the solder sheet to transfer solder onto outside surfaces of the electrode protrusions that contacted the solder sheet.
摘要翻译： 电子部件配备有电极突起，其可以安装电子部件而不用焊料覆盖电路板的连接焊盘，并且以窄的间距配置电路板的连接焊盘，同时防止连接电极的电短路 安装。 一种制造具有连接电极的电子部件的方法，其中电极突起被焊料覆盖，包括将焊料片加热至半熔融状态并将电子部件压在焊料片上以使电极突起接触的步骤 并且从电极突起与焊料片接触的位置缩回电子部件的步骤，将焊料转移到与焊料片接触的电极突起的外表面上。
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公开(公告)号：US07566586B2
公开(公告)日：2009-07-28
申请号：US11634119
申请日：2006-12-06
申请人： Norio Kainuma , Hidehiko Kira , Kenji Kobae , Kimio Nakamura , Kuniko Ishikawa , Yukio Ozaki
发明人： Norio Kainuma , Hidehiko Kira , Kenji Kobae , Kimio Nakamura , Kuniko Ishikawa , Yukio Ozaki
IPC分类号： H01L21/00
CPC分类号： H01L21/563 , H01L24/29 , H01L24/81 , H01L24/83 , H01L2224/16225 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2224/81205 , H01L2224/81801 , H01L2224/83192 , H01L2924/01005 , H01L2924/01006 , H01L2924/01019 , H01L2924/01033 , H01L2924/01079 , H01L2924/01082 , H01L2924/00 , H01L2924/3512
摘要： A method of manufacturing a semiconductor device flip-chip bonds electrode terminals of a substrate and a semiconductor chip together by solid-phase diffusion and underfills a gap between the substrate and the semiconductor chip with a thermosetting resin without the bonds between the terminals breaking due to heat in an underfill hardening step. The method includes a bonding step of flip-chip bonding the electrode terminals of the substrate and the semiconductor chip by solid-phase diffusion, an underfill filling step of filling the gap between the substrate and the semiconductor chip with the underfill material, and the underfill hardening step where the underfill material is heated to the hardening temperature to harden the underfill material. During the underfill hardening step, a member with a lower coefficient of thermal expansion out of the substrate and the semiconductor chip is heated to a higher temperature than the other member.
摘要翻译： 半导体器件倒装芯片的制造方法通过固相扩散将基板和半导体芯片的电极端子连接在一起，并且用热固性树脂对基板和半导体芯片之间的间隙进行底部填充，而不会由于端子断裂而导致端子之间的结合 在底部填充硬化步骤中加热。 该方法包括通过固相扩散将基板和半导体芯片的电极端子倒装连接的接合步骤，用底部填充材料填充基板和半导体芯片之间的间隙的底部填充步骤，以及底部填充 硬化步骤，其中将底部填充材料加热至硬化温度以使底部填充材料硬化。 在底部填充硬化工序中，将从基板和半导体芯片的热膨胀系数较低的部件加热到比其他部件高的温度。
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公开(公告)号：US20080206587A1
公开(公告)日：2008-08-28
申请号：US11951693
申请日：2007-12-06
申请人： Norio Kainuma , Kuniko Ishikawa , Hidehiko Kira
发明人： Norio Kainuma , Kuniko Ishikawa , Hidehiko Kira
CPC分类号： B23K1/06 , B23K1/0016 , B23K2101/40 , H01L21/6835 , H01L24/11 , H01L24/12 , H01L24/16 , H01L24/742 , H01L24/75 , H01L24/81 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/11003 , H01L2224/1134 , H01L2224/11822 , H01L2224/131 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/75 , H01L2224/75251 , H01L2224/75252 , H01L2224/81011 , H01L2224/81024 , H01L2224/81121 , H01L2224/81203 , H01L2224/81801 , H01L2224/83192 , H01L2924/00013 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01009 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/3025 , H05K3/3478 , H05K2201/10674 , H05K2201/10984 , H05K2203/0285 , H05K2203/0338 , H05K2203/1105 , Y10T428/12493 , H01L2224/13099 , H01L2924/00 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： An electronic component is equipped with electrode protrusions that make it possible to mount the electronic component without covering connection pads of a circuit board with solder and to dispose the connection pads of the circuit board with a narrow pitch while preventing electrical shorting of the connection electrodes during mounting. A method of manufacturing an electronic component equipped with connection electrodes, where electrode protrusions are covered with solder, includes a step of heating a solder sheet to a semi-molten state and pressing the electronic component onto the solder sheet to place the electrode protrusions in contact with the solder sheet and a step of retracting the electronic component from a position where the electrode protrusions contact the solder sheet to transfer solder onto outside surfaces of the electrode protrusions that contacted the solder sheet.
摘要翻译： 电子部件配备有电极突起，其可以安装电子部件而不用焊料覆盖电路板的连接焊盘，并且以窄的间距配置电路板的连接焊盘，同时防止连接电极的电短路 安装。 一种制造具有连接电极的电子部件的方法，其中电极突起被焊料覆盖，包括将焊料片加热至半熔融状态并将电子部件压在焊料片上以使电极突起接触的步骤 并且从电极突起与焊料片接触的位置缩回电子部件的步骤，将焊料转移到与焊料片接触的电极突起的外表面上。
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公开(公告)号：US07828193B2
公开(公告)日：2010-11-09
申请号：US12000675
申请日：2007-12-14
申请人： Kuniko Ishikawa , Norio Kainuma , Hidehiko Kira
发明人： Kuniko Ishikawa , Norio Kainuma , Hidehiko Kira
IPC分类号： B23K31/02
CPC分类号： B23K1/06 , H01L21/563 , H01L24/28 , H01L24/75 , H01L24/81 , H01L2224/03828 , H01L2224/73203 , H01L2224/75 , H01L2224/75355 , H01L2224/8101 , H01L2224/81024 , H01L2224/81075 , H01L2224/81205 , H01L2224/8121 , H01L2224/81815 , H01L2224/81906 , H01L2224/83102 , H01L2224/92125 , H01L2924/00013 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01018 , H01L2924/01033 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H05K3/3436 , H05K3/3489 , H05K2203/0285 , H05K2203/086 , H05K2203/1476 , Y02P70/613 , H01L2924/3512 , H01L2924/00 , H01L2224/8182 , H01L2224/29099
摘要： In a method of mounting an electronic component on a substrate, electrode terminals on at least one of the substrate and the electronic component are composed of solder bumps. The electrode terminals of the substrate and the electrode terminals of the electronic component are placed in contact and ultrasonic vibration is applied to at least one of the substrate and the electronic component to provisionally bond the electrode terminals together. A gap between the substrate and the electronic component is then filled with flux fill, and the electrode terminals of the substrate and the electronic component are bonded by reflowing the solder bumps.
摘要翻译： 在将电子部件安装在基板上的方法中，基板和电子部件中的至少一个上的电极端子由焊锡凸块构成。 将基板的电极端子和电子部件的电极端子接触，将超声波振动施加到基板和电子部件中的至少一个，以将电极端子临时接合在一起。 然后用焊剂填充填充衬底和电子部件之间的间隙，并且通过回流焊料凸块来接合衬底和电子部件的电极端子。
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公开(公告)号：US20080203138A1
公开(公告)日：2008-08-28
申请号：US12000675
申请日：2007-12-14
申请人： Kuniko Ishikawa , Norio Kainuma , Hidehiko Kira
发明人： Kuniko Ishikawa , Norio Kainuma , Hidehiko Kira
IPC分类号： B23K1/06
CPC分类号： B23K1/06 , H01L21/563 , H01L24/28 , H01L24/75 , H01L24/81 , H01L2224/03828 , H01L2224/73203 , H01L2224/75 , H01L2224/75355 , H01L2224/8101 , H01L2224/81024 , H01L2224/81075 , H01L2224/81205 , H01L2224/8121 , H01L2224/81815 , H01L2224/81906 , H01L2224/83102 , H01L2224/92125 , H01L2924/00013 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01018 , H01L2924/01033 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H05K3/3436 , H05K3/3489 , H05K2203/0285 , H05K2203/086 , H05K2203/1476 , Y02P70/613 , H01L2924/3512 , H01L2924/00 , H01L2224/8182 , H01L2224/29099
摘要： In a method of mounting an electronic component on a substrate, electrode terminals on at least one of the substrate and the electronic component are composed of solder bumps. The electrode terminals of the substrate and the electrode terminals of the electronic component are placed in contact and ultrasonic vibration is applied to at least one of the substrate and the electronic component to provisionally bond the electrode terminals together. A gap between the substrate and the electronic component is then filled with flux fill, and the electrode terminals of the substrate and the electronic component are bonded by reflowing the solder bumps.
摘要翻译： 在将电子部件安装在基板上的方法中，基板和电子部件中的至少一个上的电极端子由焊锡凸块构成。 将基板的电极端子和电子部件的电极端子接触，将超声波振动施加到基板和电子部件中的至少一个，以将电极端子临时接合在一起。 然后用焊剂填充填充衬底和电子部件之间的间隙，并且通过回流焊料凸块来接合衬底和电子部件的电极端子。
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公开(公告)号：US08076233B2
公开(公告)日：2011-12-13
申请号：US12561737
申请日：2009-09-17
申请人： Kuniko Ishikawa , Norio Kainuma , Kenji Kobae
发明人： Kuniko Ishikawa , Norio Kainuma , Kenji Kobae
IPC分类号： H01L21/60
CPC分类号： H01L24/11 , H01L2224/11822 , H01L2224/13099 , H01L2224/16 , H01L2924/00011 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01079 , H01L2924/01327 , H01L2924/014 , H01L2224/0401
摘要： A manufacturing method for an electrode connecting portion includes covering an electrode forming surface with a solder sheet, rolling a heating roller on the solder sheet that covers the electrode forming surface, and removing the solder sheet after the heating roller has passed over the solder sheet.
摘要翻译： 电极连接部分的制造方法包括用焊料覆盖电极形成表面，在覆盖电极形成表面的焊料片上滚动加热辊，以及在加热辊经过焊料片之后去除焊料片。
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公开(公告)号：US20100075493A1
公开(公告)日：2010-03-25
申请号：US12561737
申请日：2009-09-17
申请人： Kuniko Ishikawa , Norio Kainuma , Kenji Kobae
发明人： Kuniko Ishikawa , Norio Kainuma , Kenji Kobae
IPC分类号： H01L21/60
CPC分类号： H01L24/11 , H01L2224/11822 , H01L2224/13099 , H01L2224/16 , H01L2924/00011 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01079 , H01L2924/01327 , H01L2924/014 , H01L2224/0401
摘要： A manufacturing method for an electrode connecting portion includes covering an electrode forming surface with a solder sheet, rolling a heating roller on the solder sheet that covers the electrode forming surface, and removing the solder sheet after the heating roller has passed over the solder sheet.
摘要翻译： 电极连接部分的制造方法包括用焊料覆盖电极形成表面，在覆盖电极形成表面的焊料片上滚动加热辊，以及在加热辊经过焊料片之后去除焊料片。
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公开(公告)号：US20120248616A1
公开(公告)日：2012-10-04
申请号：US13361344
申请日：2012-01-30
CPC分类号： H05K3/3442 , B23K1/0016 , B23K1/206 , B23K35/0244 , B23K35/025 , B23K35/0255 , B23K35/262 , B23K35/302 , B23K35/3613 , B23K2101/42 , C22C13/00 , H01L2924/0002 , H05K3/284 , H05K3/3484 , H05K2201/0323 , H05K2201/10977 , H05K2203/1476 , Y02P70/613 , H01L2924/00
摘要： To provide an electronic component, containing: a wiring board containing electrode pads; a component including a plurality of electrodes, the component being mounted on the wiring board; a sealing resin covering the component; and a plurality of terminals configured to connect a wiring provided within the wiring board to an external substrate, wherein the plurality of electrodes and the electrode pads are connected with solder, and wherein a first resin layer and a second resin layer are provided between the solder and the sealing resin in this order from the side of the solder, where the first resin layer has a first Young's modulus and the second resin layer has a second Young's modulus larger than the first Young's modulus.
摘要翻译： 提供一种电子部件，其包含：包含电极焊盘的布线板; 包括多个电极的部件，所述部件安装在所述布线板上; 覆盖该部件的密封树脂; 以及多个端子，其被配置为将布线板内设置的布线与外部基板连接，其中所述多个电极和所述电极焊盘与焊料连接，并且其中在所述焊料之间设置有第一树脂层和第二树脂层 和密封树脂，其中第一树脂层具有第一杨氏模量，第二树脂层的第二杨氏模量大于第一杨氏模量。
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公开(公告)号：US20100327435A1
公开(公告)日：2010-12-30
申请号：US12822656
申请日：2010-06-24
IPC分类号： H01L23/488 , H01L21/60
CPC分类号： H01L23/49811 , H01L23/49816 , H01L24/12 , H01L24/16 , H01L24/81 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/05624 , H01L2224/1134 , H01L2224/13144 , H01L2224/16225 , H01L2224/812 , H01L2224/81801 , H01L2224/83192 , H01L2924/00013 , H01L2924/00014 , H01L2924/01078 , H01L2924/01079 , H01L2924/14 , H01L2924/15151 , H01L2924/15153 , H01L2924/19041 , H01L2924/19043 , H01L2224/13099 , H01L2924/00 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： An electronic component includes a package substrate, a plurality of conductive pads, an insulating material and a semiconductor device. The plurality of conductive pads is disposed on the package substrate. The insulating material is disposed between the plurality of conductive pads. The insulating material includes a top surface located on an identical plane to an upper surface of the plurality of conductive pads. The semiconductor device includes a conductive bump aligned on a corresponding conductive pad of the plurality of conductive pads.
摘要翻译： 电子部件包括封装基板，多个导电焊盘，绝缘材料和半导体器件。 多个导电焊盘设置在封装衬底上。 绝缘材料设置在多个导电焊盘之间。 绝缘材料包括位于与多个导电焊盘的上表面相同的平面上的顶表面。 半导体器件包括对准在多个导电焊盘的相应导电焊盘上的导电凸块。
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