公开(公告)号：US11239386B2

公开(公告)日：2022-02-01

申请号：US16851232

申请日：2020-04-17

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Karl Weidner ,  Ralph Wirth ,  Axel Kaltenbacher ,  Walter Wegleiter ,  Bernd Barchmann ,  Oliver Wutz ,  Jan Marfeld

IPC: H01L33/00 ,  H01L33/48 ,  H01L33/62 ,  H01L25/075 ,  H01L23/31 ,  H01L31/0232 ,  H01L33/60 ,  H01L31/0203 ,  H01L33/56 ,  H01L25/04 ,  H01L31/02 ,  H01L33/50 ,  H01L31/18 ,  H01L33/54

Abstract: An optoelectronic semiconductor component includes an optoelectronic semiconductor chip having a top area at a top side, a bottom area at an underside, side areas connecting the top area and the bottom area, and epitaxially produced layers; electrical n- and p-side contacts at the bottom area of the optoelectronic semiconductor chip; and an electrically insulating shaped body, wherein the shaped body surrounds the optoelectronic semiconductor chip at its side areas, and the epitaxially produced layers are free from the shaped body.

公开(公告)号：US09972759B2

公开(公告)日：2018-05-15

申请号：US14766420

申请日：2014-01-23

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Walter Wegleiter ,  Paola Altieri-Weimar ,  Juergen Moosburger ,  Stefan Stegmeier ,  Karl Weidner

IPC: H01L31/0203 ,  H01L31/02 ,  H01L31/024 ,  H01L33/48 ,  H01L33/62 ,  H01L33/64 ,  H01L23/00

CPC classification number: H01L33/62 ,  H01L24/18 ,  H01L24/24 ,  H01L31/02002 ,  H01L31/0203 ,  H01L31/024 ,  H01L33/483 ,  H01L33/647 ,  H01L2224/04105 ,  H01L2224/24137 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73267 ,  H01L2924/15153

Abstract: The invention relates to a device (1), comprising at least one optoelectronic semiconductor component (2) and a substrate (5), on which the semiconductor component is arranged, wherein an insulating layer (4) is adjacent to a lateral surface (25) that bounds the semiconductor component; a contact track (6) is arranged on a radiation passage surface of the semiconductor component and is connected to an electrically conductive manner to the semiconductor component; the contact track extends beyond the lateral surface of the semiconductor component and is arranged on the insulating layer; and the contact track is relieved with respect to a thermomechanical load occurring perpendicularly to the lateral surface.

公开(公告)号：US11749776B2

公开(公告)日：2023-09-05

申请号：US17552657

申请日：2021-12-16

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Karl Weidner ,  Ralph Wirth ,  Axel Kaltenbacher ,  Walter Wegleiter ,  Bernd Barchmann ,  Oliver Wutz ,  Jan Marfeld

IPC: H01L33/00 ,  H01L33/48 ,  H01L33/62 ,  H01L25/075 ,  H01L23/31 ,  H01L31/0232 ,  H01L33/60 ,  H01L31/0203 ,  H01L33/56 ,  H01L25/04 ,  H01L31/02 ,  H01L33/50 ,  H01L31/18 ,  H01L33/54

CPC classification number: H01L33/0093 ,  H01L23/3107 ,  H01L23/3185 ,  H01L25/042 ,  H01L25/0753 ,  H01L31/0203 ,  H01L31/02005 ,  H01L31/0232 ,  H01L31/02322 ,  H01L31/02327 ,  H01L31/1892 ,  H01L33/483 ,  H01L33/486 ,  H01L33/502 ,  H01L33/56 ,  H01L33/60 ,  H01L33/62 ,  H01L33/54 ,  H01L2924/0002 ,  H01L2933/005 ,  H01L2933/0033 ,  H01L2933/0066 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A method of producing an optoelectronic semiconductor component includes providing a carrier; arranging at least one optoelectronic semiconductor chip at a top side of the carrier, wherein the semiconductor chip includes semiconductor layers deposited on a substrate; forming a shaped body around the at least one optoelectronic semiconductor chip, wherein the shaped body surrounds all side areas of the at least one optoelectronic semiconductor chip and at least some of the layers deposited on the substrate are free of the shaped body such that these layers are not covered or completely exposed; and removing the carrier.

公开(公告)号：US20220109082A1

公开(公告)日：2022-04-07

申请号：US17552657

申请日：2021-12-16

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Karl Weidner ,  Ralph Wirth ,  Axel Kaltenbacher ,  Walter Wegleiter ,  Bernd Barchmann ,  Oliver Wutz ,  Jan Marfeld

IPC: H01L33/00 ,  H01L33/48 ,  H01L33/62 ,  H01L25/075 ,  H01L23/31 ,  H01L31/0232 ,  H01L33/60 ,  H01L31/0203 ,  H01L33/56 ,  H01L25/04 ,  H01L31/02 ,  H01L33/50 ,  H01L31/18

Abstract: A method of producing an optoelectronic semiconductor component includes providing a carrier; arranging at least one optoelectronic semiconductor chip at a top side of the carrier, wherein the semiconductor chip includes semiconductor layers deposited on a substrate; forming a shaped body around the at least one optoelectronic semiconductor chip, wherein the shaped body surrounds all side areas of the at least one optoelectronic semiconductor chip and at least some of the layers deposited on the substrate are free of the shaped body such that these layers are not covered or completely exposed; and removing the carrier.

公开(公告)号：US09653670B2

公开(公告)日：2017-05-16

申请号：US14378610

申请日：2013-01-17

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Stefan Illek ,  Walter Wegleiter ,  Karl Weidner ,  Stefan Stegmeier

IPC: H01L33/00 ,  H01L21/00 ,  H01L33/64 ,  H01L33/48 ,  H01L33/62 ,  H01L27/15 ,  H01L33/36 ,  H01L33/52 ,  H01L25/075 ,  H01L33/54

CPC classification number: H01L33/64 ,  H01L25/0753 ,  H01L27/15 ,  H01L33/005 ,  H01L33/36 ,  H01L33/486 ,  H01L33/52 ,  H01L33/54 ,  H01L33/62 ,  H01L33/647 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2933/0016 ,  H01L2933/0025 ,  H01L2933/005 ,  H01L2933/0066 ,  H01L2924/00014

Abstract: In at least one embodiment, the semiconductor component includes at least one optoelectronic semiconductor chip having a radiation exit side. The surface-mountable semiconductor component comprises a shaped body that covers side surfaces of the semiconductor chip directly and in a positively locking manner. The shaped body and the semiconductor chip do not overlap, as seen in a plan view of the radiation exit side.

公开(公告)号：US20230352617A1

公开(公告)日：2023-11-02

申请号：US18212935

申请日：2023-06-22

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Karl Weidner ,  Ralph Wirth ,  Axel Kaltenbacher ,  Walter Wegleiter ,  Bernd Barchmann ,  Oliver Wutz ,  Jan Marfeld

IPC: H01L33/00 ,  H01L33/48 ,  H01L33/62 ,  H01L25/075 ,  H01L23/31 ,  H01L31/0232 ,  H01L33/60 ,  H01L31/0203 ,  H01L33/56 ,  H01L25/04 ,  H01L31/02 ,  H01L33/50 ,  H01L31/18

CPC classification number: H01L33/0093 ,  H01L33/486 ,  H01L33/62 ,  H01L25/0753 ,  H01L23/3185 ,  H01L31/0232 ,  H01L33/60 ,  H01L31/0203 ,  H01L31/02327 ,  H01L33/483 ,  H01L33/56 ,  H01L23/3107 ,  H01L25/042 ,  H01L31/02005 ,  H01L33/502 ,  H01L31/02322 ,  H01L31/1892 ,  H01L33/54

Abstract: An optoelectronic semiconductor component includes an optoelectronic semiconductor chip having a top area at a top side, a bottom area at an underside, at least one side area connecting the top area and the bottom area; electrical contact locations at the top area or at the bottom area of the optoelectronic semiconductor chip; and a molded body, wherein the molded body surrounds the optoelectronic semiconductor chip at all side areas at least in places, the molded body is electrically insulating, and the molded body is free of any conductive element that completely penetrates the molded body.

公开(公告)号：US09484508B2

公开(公告)日：2016-11-01

申请号：US14430539

申请日：2013-09-24

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Georg Dirscherl ,  Walter Wegleiter ,  Caroline Cassignol ,  Karl Weidner

IPC: H01L33/62 ,  H01L33/56 ,  H01L33/48 ,  H01L33/50 ,  H01L33/54

CPC classification number: H01L33/56 ,  H01L33/486 ,  H01L33/505 ,  H01L33/54 ,  H01L33/62 ,  H01L2924/0002 ,  H01L2924/00

Abstract: The invention relates to an optoelectronic semiconductor component, which has a carrier element (1), on which an optoelectronic semiconductor chip (2) having at least one active layer is arranged, wherein the active layer is designed to emit or receive light during operation and wherein the semiconductor chip (2) is covered with a protective layer (3) that contains poly-para-xylenes.

Abstract translation: 本发明涉及一种具有载体元件（1）的光电子半导体元件，其上布置有具有至少一个有源层的光电子半导体芯片（2），其中该有源层被设计为在操作期间发射或接收光;以及 其中所述半导体芯片（2）被包含聚对二甲苯的保护层（3）覆盖。

公开(公告)号：US12002901B2

公开(公告)日：2024-06-04

申请号：US18212935

申请日：2023-06-22

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Karl Weidner ,  Ralph Wirth ,  Axel Kaltenbacher ,  Walter Wegleiter ,  Bernd Barchmann ,  Oliver Wutz ,  Jan Marfeld

IPC: H01L33/00 ,  H01L23/31 ,  H01L25/04 ,  H01L25/075 ,  H01L31/02 ,  H01L31/0203 ,  H01L31/0232 ,  H01L31/18 ,  H01L33/48 ,  H01L33/50 ,  H01L33/54 ,  H01L33/56 ,  H01L33/60 ,  H01L33/62

CPC classification number: H01L33/0093 ,  H01L23/3107 ,  H01L23/3185 ,  H01L25/042 ,  H01L25/0753 ,  H01L31/02005 ,  H01L31/0203 ,  H01L31/0232 ,  H01L31/02322 ,  H01L31/02327 ,  H01L31/1892 ,  H01L33/483 ,  H01L33/486 ,  H01L33/502 ,  H01L33/56 ,  H01L33/60 ,  H01L33/62 ,  H01L33/54 ,  H01L2924/0002 ,  H01L2933/0033 ,  H01L2933/005 ,  H01L2933/0066 ,  H01L2924/0002 ,  H01L2924/00

Abstract: An optoelectronic semiconductor component includes an optoelectronic semiconductor chip having a top area at a top side, a bottom area at an underside, at least one side area connecting the top area and the bottom area; electrical contact locations at the top area or at the bottom area of the optoelectronic semiconductor chip; and a molded body, wherein the molded body surrounds the optoelectronic semiconductor chip at all side areas at least in places, the molded body is electrically insulating, and the molded body is free of any conductive element that completely penetrates the molded body.

公开(公告)号：US20200251612A1

公开(公告)日：2020-08-06

申请号：US16851232

申请日：2020-04-17

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Karl Weidner ,  Ralph Wirth ,  Axel Kaltenbacher ,  Walter Wegleiter ,  Bernd Barchmann ,  Oliver Wutz ,  Jan Marfeld

IPC: H01L33/00 ,  H01L33/48 ,  H01L33/62 ,  H01L25/075 ,  H01L23/31 ,  H01L31/0232 ,  H01L33/60 ,  H01L31/0203 ,  H01L33/56 ,  H01L25/04 ,  H01L31/02 ,  H01L33/50 ,  H01L31/18

Abstract: An optoelectronic semiconductor component includes an optoelectronic semiconductor chip having a top area at a top side, a bottom area at an underside, side areas connecting the top area and the bottom area, and epitaxially produced layers; electrical n- and p-side contacts at the bottom area of the optoelectronic semiconductor chip; and an electrically insulating shaped body, wherein the shaped body surrounds the optoelectronic semiconductor chip at its side areas, and the epitaxially produced layers are free from the shaped body.

公开(公告)号：US10665747B2

公开(公告)日：2020-05-26

申请号：US15963408

申请日：2018-04-26

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Karl Weidner ,  Ralph Wirth ,  Axel Kaltenbacher ,  Walter Wegleiter ,  Bernd Barchmann ,  Oliver Wutz ,  Jan Marfeld

IPC: H01L33/00 ,  H01L33/48 ,  H01L33/62 ,  H01L25/075 ,  H01L23/31 ,  H01L31/0232 ,  H01L33/60 ,  H01L31/0203 ,  H01L33/56 ,  H01L25/04 ,  H01L33/50 ,  H01L31/18 ,  H01L33/54 ,  H01L31/02

Abstract: A method of producing an optoelectronic semiconductor component includes providing a carrier, arranging at least one optoelectronic semiconductor chip at a top side of the carrier, applying a phosphor layer at the at least one semiconductor chip, forming a shaped body around the at least one optoelectronic semiconductor chip, wherein the shaped body surrounds all side areas of the at least one optoelectronic semiconductor chip, and removing the carrier, wherein the phosphor layer is applied before forming the shaped body.