-
公开(公告)号:US12002901B2
公开(公告)日:2024-06-04
申请号:US18212935
申请日:2023-06-22
Applicant: OSRAM Opto Semiconductors GmbH
Inventor: Karl Weidner , Ralph Wirth , Axel Kaltenbacher , Walter Wegleiter , Bernd Barchmann , Oliver Wutz , Jan Marfeld
IPC: H01L33/00 , H01L23/31 , H01L25/04 , H01L25/075 , H01L31/02 , H01L31/0203 , H01L31/0232 , H01L31/18 , H01L33/48 , H01L33/50 , H01L33/54 , H01L33/56 , H01L33/60 , H01L33/62
CPC classification number: H01L33/0093 , H01L23/3107 , H01L23/3185 , H01L25/042 , H01L25/0753 , H01L31/02005 , H01L31/0203 , H01L31/0232 , H01L31/02322 , H01L31/02327 , H01L31/1892 , H01L33/483 , H01L33/486 , H01L33/502 , H01L33/56 , H01L33/60 , H01L33/62 , H01L33/54 , H01L2924/0002 , H01L2933/0033 , H01L2933/005 , H01L2933/0066 , H01L2924/0002 , H01L2924/00
Abstract: An optoelectronic semiconductor component includes an optoelectronic semiconductor chip having a top area at a top side, a bottom area at an underside, at least one side area connecting the top area and the bottom area; electrical contact locations at the top area or at the bottom area of the optoelectronic semiconductor chip; and a molded body, wherein the molded body surrounds the optoelectronic semiconductor chip at all side areas at least in places, the molded body is electrically insulating, and the molded body is free of any conductive element that completely penetrates the molded body.
-
公开(公告)号:US20200251612A1
公开(公告)日:2020-08-06
申请号:US16851232
申请日:2020-04-17
Applicant: OSRAM Opto Semiconductors GmbH
Inventor: Karl Weidner , Ralph Wirth , Axel Kaltenbacher , Walter Wegleiter , Bernd Barchmann , Oliver Wutz , Jan Marfeld
IPC: H01L33/00 , H01L33/48 , H01L33/62 , H01L25/075 , H01L23/31 , H01L31/0232 , H01L33/60 , H01L31/0203 , H01L33/56 , H01L25/04 , H01L31/02 , H01L33/50 , H01L31/18
Abstract: An optoelectronic semiconductor component includes an optoelectronic semiconductor chip having a top area at a top side, a bottom area at an underside, side areas connecting the top area and the bottom area, and epitaxially produced layers; electrical n- and p-side contacts at the bottom area of the optoelectronic semiconductor chip; and an electrically insulating shaped body, wherein the shaped body surrounds the optoelectronic semiconductor chip at its side areas, and the epitaxially produced layers are free from the shaped body.
-
公开(公告)号:US08952390B2
公开(公告)日:2015-02-10
申请号:US13750966
申请日:2013-01-25
Applicant: OSRAM Opto Semiconductors GmbH
Inventor: Ralph Wirth , Alexander Linkov
IPC: H01L33/30 , H01L25/075 , H01L33/50 , H01L33/56 , H01L33/60
CPC classification number: H01L25/0753 , H01L27/15 , H01L33/30 , H01L33/32 , H01L33/483 , H01L33/50 , H01L33/502 , H01L33/54 , H01L33/56 , H01L33/58 , H01L33/60 , H01L2924/0002 , H01L2933/0091 , H01L2924/00
Abstract: An optoelectronic component can be used for mixing electromagnetic radiation having different wavelengths, in particular in the far field. The optoelectronic component includes a carrier. A first semiconductor chip has a first radiation exit surface for emitting electromagnetic radiation in a first spectral range is provided on the carrier and a second semiconductor chip as a second radiation exit surface for emitting electromagnetic radiation in a second spectral range is provided on the carrier. A diffusing layer is provided on the radiation exit surfaces of the semiconductor chips which face away from the carrier.
Abstract translation: 光电子部件可用于混合具有不同波长的电磁辐射,特别是在远场中。 光电子部件包括载体。 第一半导体芯片具有用于在第一光谱范围内发射电磁辐射的第一辐射出射表面,并且在载体上设置第二半导体芯片作为用于在第二光谱范围内发射电磁辐射的第二辐射出射表面。 在半导体芯片的远离载体的辐射出射表面上设置漫射层。
-
公开(公告)号:US11239386B2
公开(公告)日:2022-02-01
申请号:US16851232
申请日:2020-04-17
Applicant: OSRAM Opto Semiconductors GmbH
Inventor: Karl Weidner , Ralph Wirth , Axel Kaltenbacher , Walter Wegleiter , Bernd Barchmann , Oliver Wutz , Jan Marfeld
IPC: H01L33/00 , H01L33/48 , H01L33/62 , H01L25/075 , H01L23/31 , H01L31/0232 , H01L33/60 , H01L31/0203 , H01L33/56 , H01L25/04 , H01L31/02 , H01L33/50 , H01L31/18 , H01L33/54
Abstract: An optoelectronic semiconductor component includes an optoelectronic semiconductor chip having a top area at a top side, a bottom area at an underside, side areas connecting the top area and the bottom area, and epitaxially produced layers; electrical n- and p-side contacts at the bottom area of the optoelectronic semiconductor chip; and an electrically insulating shaped body, wherein the shaped body surrounds the optoelectronic semiconductor chip at its side areas, and the epitaxially produced layers are free from the shaped body.
-
公开(公告)号:US10418530B2
公开(公告)日:2019-09-17
申请号:US15531349
申请日:2015-11-25
Applicant: OSRAM Opto Semiconductors GmbH
Inventor: Reiner Windisch , Joerg Erich Sorg , Ralph Wirth
Abstract: An optoelectronic semiconductor chip having a semiconductor body (1) that is suitable for emitting electromagnetic radiation in a first wavelength range from a radiation exit face (3) is specified. Furthermore, the semiconductor chip comprises a ceramic or monocrystalline conversion platelet (6) that is suitable for converting electromagnetic radiation in the first wavelength range into electromagnetic radiation in a second wavelength range, which is different from the first wavelength range, and a wavelength-converting joining layer (7) that connects the conversion platelet (6) to the radiation exit face (3), wherein the wavelength-converting joining layer (7) has luminescent material particles (4) that are suitable for converting radiation in the first wavelength range into radiation in a third wavelength range, which is different from the first wavelength range and the second wavelength range. The wavelength-converting joining layer (7) furthermore has a thickness of no more than 30 micrometers. A method for fabricating an optoelectronic semiconductor chip, a further semiconductor chip, conversion element and luminescent material are specified.
-
公开(公告)号:US10217909B2
公开(公告)日:2019-02-26
申请号:US15314084
申请日:2015-06-10
Applicant: OSRAM Opto Semiconductors GmbH
Inventor: Stefan Lange , Vera Stöppelkamp , Frank Jermann , Andreas Biebersdorf , Ralph Wirth
Abstract: An optoelectronic semiconductor component is disclosed. In an embodiment, the semiconductor component includes at least one optoelectronic semiconductor chip for generating primary radiation in a near-ultraviolet or in a visible spectral range, at least one phosphor for partial or complete conversion of the primary radiation into a longer-waved secondary radiation which is in the visible spectral range and at least one filter substance for partial absorption of the secondary radiation, wherein the phosphor and the filter substance are closely connected to the semiconductor chip.
-
公开(公告)号:US20170077071A1
公开(公告)日:2017-03-16
申请号:US15342261
申请日:2016-11-03
Applicant: OSRAM Opto Semiconductors GmbH
Inventor: Ralph Wirth , Alexander Linkov
CPC classification number: H01L25/0753 , H01L27/15 , H01L33/30 , H01L33/32 , H01L33/483 , H01L33/50 , H01L33/502 , H01L33/54 , H01L33/56 , H01L33/58 , H01L33/60 , H01L2924/0002 , H01L2933/0091 , H01L2924/00
Abstract: An optoelectronic component for mixing electromagnetic radiation having different wavelengths, for example, for the far field is disclosed. In an embodiment the optoelectronic component includes a carrier, at least one first semiconductor chip arranged on the carrier and having a first radiation exit surface for emitting electromagnetic radiation in a first spectral range and at least one second semiconductor chip arranged on the carrier and having a second radiation exit surface for emitting electromagnetic radiation in a second spectral range, wherein a diffusing layer is arranged on the first and second radiation exit surfaces of the semiconductor chips that face away from the carrier and wherein a reflecting layer is arranged between the first semiconductor chip and the second semiconductor chip, the first and second radiation exit surfaces being free from the reflecting layer at least in regions.
Abstract translation: 公开了用于混合具有不同波长的电磁辐射的光电子部件,例如用于远场。 在一个实施例中,光电子部件包括载体,布置在载体上的至少一个第一半导体芯片,并具有用于在第一光谱范围内发射电磁辐射的第一辐射出射表面和布置在载体上的至少一个第二半导体芯片, 用于在第二光谱范围内发射电磁辐射的第二辐射出射表面,其中散射层布置在所述半导体芯片的远离所述载体的所述第一和第二辐射出射表面上,并且其中反射层布置在所述第一半导体芯片 和所述第二半导体芯片,所述第一和第二辐射出射表面至少在区域中不含所述反射层。
-
公开(公告)号:US10665747B2
公开(公告)日:2020-05-26
申请号:US15963408
申请日:2018-04-26
Applicant: OSRAM Opto Semiconductors GmbH
Inventor: Karl Weidner , Ralph Wirth , Axel Kaltenbacher , Walter Wegleiter , Bernd Barchmann , Oliver Wutz , Jan Marfeld
IPC: H01L33/00 , H01L33/48 , H01L33/62 , H01L25/075 , H01L23/31 , H01L31/0232 , H01L33/60 , H01L31/0203 , H01L33/56 , H01L25/04 , H01L33/50 , H01L31/18 , H01L33/54 , H01L31/02
Abstract: A method of producing an optoelectronic semiconductor component includes providing a carrier, arranging at least one optoelectronic semiconductor chip at a top side of the carrier, applying a phosphor layer at the at least one semiconductor chip, forming a shaped body around the at least one optoelectronic semiconductor chip, wherein the shaped body surrounds all side areas of the at least one optoelectronic semiconductor chip, and removing the carrier, wherein the phosphor layer is applied before forming the shaped body.
-
公开(公告)号:US20180248074A1
公开(公告)日:2018-08-30
申请号:US15963408
申请日:2018-04-26
Applicant: OSRAM Opto Semiconductors GmbH
Inventor: Karl Weidner , Ralph Wirth , Axel Kaltenbacher , Walter Wegleiter , Bernd Barchmann , Oliver Wutz , Jan Marfeld
CPC classification number: H01L33/0079 , H01L23/3107 , H01L23/3185 , H01L25/042 , H01L25/0753 , H01L31/02005 , H01L31/0203 , H01L31/0232 , H01L31/02322 , H01L31/02327 , H01L31/1892 , H01L33/483 , H01L33/486 , H01L33/502 , H01L33/54 , H01L33/56 , H01L33/60 , H01L33/62 , H01L2924/0002 , H01L2933/0033 , H01L2933/005 , H01L2933/0066 , H01L2924/00
Abstract: A method of producing an optoelectronic semiconductor component includes providing a carrier, arranging at least one optoelectronic semiconductor chip at a top side of the carrier, applying a phosphor layer at the at least one semiconductor chip, forming a shaped body around the at least one optoelectronic semiconductor chip, wherein the shaped body surrounds all side areas of the at least one optoelectronic semiconductor chip, and removing the carrier, wherein the phosphor layer is applied before forming the shaped body.
-
公开(公告)号:US09985171B2
公开(公告)日:2018-05-29
申请号:US15632544
申请日:2017-06-26
Applicant: OSRAM Opto Semiconductors GmbH
Inventor: Karl Weidner , Ralph Wirth , Axel Kaltenbacher , Walter Wegleiter , Bernd Barchmann , Oliver Wutz , Jan Marfeld
IPC: H01L29/18 , H01L33/00 , H01L31/02 , H01L31/0232 , H01L31/18 , H01L33/62 , H01L33/60 , H01L33/50
CPC classification number: H01L33/0079 , H01L23/3107 , H01L23/3185 , H01L25/042 , H01L25/0753 , H01L31/02005 , H01L31/0203 , H01L31/0232 , H01L31/02322 , H01L31/02327 , H01L31/1892 , H01L33/483 , H01L33/486 , H01L33/502 , H01L33/54 , H01L33/56 , H01L33/60 , H01L33/62 , H01L2924/0002 , H01L2933/0033 , H01L2933/005 , H01L2933/0066 , H01L2924/00
Abstract: An optoelectronic semiconductor component includes an optoelectronic semiconductor chip having a top area at a top side, a bottom area at an underside, and side areas connecting the top area and the bottom area; electrical contact locations at the top area or at the bottom area of the optoelectronic semiconductor chip; and an electrically insulating shaped body, wherein the optoelectronic semiconductor chip is a flip-chip having the electrical contract locations only at one side, either the underside or the top side, the shaped body surrounds the optoelectronic semiconductor chip at its side areas, and the shaped body is free of a via that electrically connects the optoelectronic semiconductor chip.
-
-
-
-
-
-
-
-
-