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公开(公告)号：US10986115B2
公开(公告)日：2021-04-20
申请号：US16580853
申请日：2019-09-24
Inventor： Hiroshi Amano , Yosuke Tajika , Yuichi Higuchi
Abstract: An abnormality in a manufacturing system is detected without extensive modification to the existing manufacturing systems. The data analysis device includes: a receiver configured to receive a packet transmitted between a manufacture control device and a manufacturing device; an analyzer configured to obtain the type of data included in a payload of the received packet from an IP address and a port number included in a header of the packet; a selector configured to select, based on the type of the data obtained by the analyzer, a syntax or rule corresponding to the type of the data; and a determiner configured to determine that the manufacturing system has an abnormality if the data included in the payload does not follow the syntax or rule corresponding to the type of the data.
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公开(公告)号：US12045341B2
公开(公告)日：2024-07-23
申请号：US16973898
申请日：2019-06-07
Inventor： Hiroshi Amano , Narumi Atsuta , Noriaki Hamada , Yosuke Tajika , Nobutaka Kawaguchi , Yuichi Higuchi , Taichi Shimizu
IPC: G06F21/55
CPC classification number: G06F21/554 , G06F2221/034
Abstract: An unauthorized communication detection device that detects unauthorized communication in a manufacturing system that manufactures products includes: an obtainer that obtains operation information of the manufacturing system; a storage that stores element information indicating one or more target elements among a plurality of elements related to manufacturing of the products; a specifier that specifies, for each of a plurality of communications performed in the manufacturing system, an element corresponding to the communication, based on the operation information; a calculator that calculates an abnormal degree of each of one or more communications, which satisfy that the element specified by the specifier is included in the one or more target elements indicated by the element information, among the plurality of communications; and a determiner that determines that, when an abnormal degree calculated by the calculator is larger than a threshold value, a communication corresponding to the abnormal degree is the unauthorized communication.
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公开(公告)号：US10541230B2
公开(公告)日：2020-01-21
申请号：US15053868
申请日：2016-02-25
Inventor： Yuichi Higuchi , Hideyuki Arai
IPC: H01L25/065 , H01L23/00 , H01L23/48 , H01L25/18 , H01L25/11 , H01L23/34 , H01L25/10 , H01L23/532 , H01L23/522
Abstract: A semiconductor device includes a first laminated body and a second laminated body. The first laminated body includes sequentially a first element, a first wiring layer, and a first connection layer that includes a first junction electrode, on a main surface of a first substrate. The second laminated body includes sequentially a second element, a second wiring layer, and a second connection layer that includes a second junction electrode, on a main surface of a semiconductor substrate. The first laminated body and the second laminated body are bonded by directly bonding the first junction electrode and the second junction electrode with the two junction electrodes facing each other. A space region is formed at a part of a junction interface between the first laminated body and the second laminated body.
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Patent Agency Ranking
4.发明授权Semiconductor device for use in flip-chip bonding, which reduces lateral displacement 有权用于倒装芯片接合的半导体器件，其减少横向位移公开(公告)号：US09520381B2
公开(公告)日：2016-12-13
申请号：US14592576
申请日：2015-01-08
Inventor： Yuichi Higuchi
IPC: H01L25/065 , H01L23/00 , H01L23/48 , H01L21/56
CPC classification number: H01L25/0657 , H01L21/563 , H01L23/481 , H01L24/02 , H01L24/03 , H01L24/05 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/17 , H01L24/32 , H01L24/81 , H01L24/83 , H01L2224/02372 , H01L2224/0239 , H01L2224/0345 , H01L2224/03462 , H01L2224/03614 , H01L2224/03912 , H01L2224/03914 , H01L2224/0401 , H01L2224/05011 , H01L2224/05012 , H01L2224/05015 , H01L2224/05073 , H01L2224/05082 , H01L2224/05124 , H01L2224/05166 , H01L2224/05187 , H01L2224/05551 , H01L2224/05552 , H01L2224/05555 , H01L2224/05557 , H01L2224/05558 , H01L2224/05559 , H01L2224/05572 , H01L2224/05573 , H01L2224/05582 , H01L2224/05609 , H01L2224/05611 , H01L2224/05613 , H01L2224/05617 , H01L2224/05618 , H01L2224/05624 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/05657 , H01L2224/05666 , H01L2224/05684 , H01L2224/1145 , H01L2224/11462 , H01L2224/13014 , H01L2224/13017 , H01L2224/13019 , H01L2224/13022 , H01L2224/13024 , H01L2224/13025 , H01L2224/1308 , H01L2224/13082 , H01L2224/13083 , H01L2224/131 , H01L2224/13109 , H01L2224/13111 , H01L2224/13113 , H01L2224/13117 , H01L2224/13118 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/13157 , H01L2224/13166 , H01L2224/13184 , H01L2224/16014 , H01L2224/16058 , H01L2224/16148 , H01L2224/16237 , H01L2224/32145 , H01L2224/73104 , H01L2224/73204 , H01L2224/8112 , H01L2224/81121 , H01L2224/8114 , H01L2224/81141 , H01L2224/81143 , H01L2224/81193 , H01L2224/81201 , H01L2224/83862 , H01L2224/92125 , H01L2225/06513 , H01L2225/06541 , H01L2225/06548 , H01L2225/06593 , H01L2924/01032 , H01L2924/207 , H01L2924/2075 , H01L2924/20751 , H01L2924/20752 , H01L2924/20753 , H01L2924/20754 , H01L2924/20755 , H01L2924/381 , H01L2924/384 , H01L2224/16225 , H01L2224/32225 , H01L2924/00012 , H01L2924/00014 , H01L2924/04953 , H01L2924/014 , H01L2924/01022 , H01L2924/01029
Abstract: A semiconductor device includes multilayer chips in which a first semiconductor chip and a second semiconductor chip are bonded together. A first electrode pad is formed on a principal surface of the first semiconductor chip, and a first bump is formed on the first electrode pad. A second bump is formed on the principal surface of the second semiconductor chip such that the second bump is bonded to the first bump. The first electrode pad has an opening, and the opening and an entire peripheral portion of the opening form a stepped shape form a stepped shape. The first bump has a recessed shape that is recessed at a center thereof and covers the stepped shape.
Abstract translation: 半导体器件包括其中第一半导体芯片和第二半导体芯片结合在一起的多层芯片。 第一电极焊盘形成在第一半导体芯片的主表面上，并且在第一电极焊盘上形成第一突起。 在第二半导体芯片的主表面上形成第二凸起，使得第二凸块与第一凸块接合。 第一电极焊盘具有开口，并且开口和形成台阶状的开口的整个周边部分形成阶梯形状。 第一凸块具有在其中心凹陷并且覆盖阶梯形状的凹陷形状。
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公开(公告)号：US11698630B2
公开(公告)日：2023-07-11
申请号：US16973917
申请日：2019-06-07
Inventor： Hiroshi Amano , Narumi Atsuta , Noriaki Hamada , Yosuke Tajika , Nobutaka Kawaguchi , Yuichi Higuchi , Taichi Shimizu
IPC: G05B23/02 , G05B19/418
CPC classification number: G05B23/0235 , G05B19/418 , G05B23/0272 , G05B23/0281
Abstract: An abnormality analysis device including: an overall information obtainer that obtains overall information indicating an overall feature amount of a manufacturing system; an overall abnormal degree calculator that calculates an overall abnormal degree that is an abnormal degree of a whole of the manufacturing system by statistically processing the overall information; an individual information obtainer that obtains individual information indicating a feature amount of each of the plurality of constituent elements; an individual abnormal degree calculator that calculates an individual abnormal degree that is an abnormal degree of each of the plurality of constituent elements by statistically processing the individual information; and a determiner that determines whether or not the overall abnormal degree exceeds a threshold value, wherein the individual abnormal degree calculator calculates the individual abnormal degree when the determiner determines that the overall abnormal degree exceeds the threshold value.
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公开(公告)号：US11526158B2
公开(公告)日：2022-12-13
申请号：US16628928
申请日：2018-07-10
Inventor： Yuichi Higuchi , Hiroshi Amano , Yosuke Tajika , Taichi Shimizu
IPC: G05B19/418 , H05K13/08 , G06Q50/04
Abstract: A display device that displays productivity of a manufacturing facility that performs processes to manufacture products, wherein the manufacturing facility includes constituent element groups, each including constituent elements, constituent elements selected from the constituent element groups perform a corresponding one of the processes. The display device includes: an obtainer that obtains manufacturing log information from the manufacturing facility; a calculator that calculates an indicator showing productivity of each combination of a first constituent element and a second constituent element, based on the manufacturing log information; and a display that displays the indicator showing the productivity of each combination at a position of an intersection point corresponding to the combination on a productivity indicator map including a vertical axis along which first constituent elements are arranged and a horizontal axis along which second constituent elements are arranged.
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公开(公告)号：US11431173B2
公开(公告)日：2022-08-30
申请号：US16626231
申请日：2018-06-25
Inventor： Yuichi Higuchi , Hiroshi Amano , Yosuke Tajika , Taichi Shimizu
Abstract: Power demand control is performed without a decrease in productivity. A device for performing electric power demand control includes: a processor; and a storage medium including an instruction for causing the processor to obtain a sum of energy consumption of a plurality of manufacturing devices, obtain a production capacity from production information on each manufacturing device, and perform electric power demand control on a manufacturing system based on the production capacity and the sum of energy consumption. To perform electric power control includes determining that electric power demand control is necessary if the sum of energy consumption reaches a predetermined threshold and excluding one of the manufacturing devices having a smallest production capacity from a target of electric power demand control.
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8.发明授权公开(公告)号：US11307567B2
公开(公告)日：2022-04-19
申请号：US16975618
申请日：2019-02-22
Inventor： Taichi Shimizu , Yosuke Tajika , Hiroshi Amano , Yuichi Higuchi
Abstract: A management device for managing a component mounter that mounts components onto a substrate using some of constituent elements each selected from one of constituent element groups each including the constituent elements. One group is a nozzle group including nozzles. The device includes: a true displacement amount calculator that calculates, for each target component which is the component, a true amount of displacement which is a sum of (i) an amount of pickup displacement being an amount of displacement between the target component and a target nozzle being one of the nozzles and picks up the target component and (ii) an amount of correction being an amount of offset of a position of the target nozzle when picking up the target component; and a statistical processor that performs parameter estimation for a predetermined statistical model using the true amount to calculate a degree of malfunction of each constituent element.
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