公开(公告)号：US20100164079A1

公开(公告)日：2010-07-01

申请号：US11993266

申请日：2006-06-23

申请人： Ronald Dekker ,  Marc Andre De Samber ,  Wilhelmus Hendrikus De Haas ,  Theodorus Martinus Michielsen ,  Franciscus Adrianus Cornelis Maria Schoofs ,  Nicolaas Johannes Anthonius Van Veen

发明人： Ronald Dekker ,  Marc Andre De Samber ,  Wilhelmus Hendrikus De Haas ,  Theodorus Martinus Michielsen ,  Franciscus Adrianus Cornelis Maria Schoofs ,  Nicolaas Johannes Anthonius Van Veen

IPC分类号： H01L23/488 ,  H01L21/56 ,  H01L23/28

CPC分类号： H01L24/16 ,  H01L21/4846 ,  H01L21/568 ,  H01L21/6835 ,  H01L25/0652 ,  H01L25/50 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/73204 ,  H01L2224/81005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01058 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/12041 ,  H01L2924/12043 ,  H01L2924/1305 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15311 ,  H01L2924/15788 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/30105 ,  H01L2924/3011 ,  H01L2924/3025 ,  Y02P80/30 ,  H01L2924/00

摘要： The assembly (100) comprises a laterally limited semiconductor substrate region (15) in which an electrical element (20) is defined. Thereon, an interconnect structure (21) is present. This is provided, at its first side (101) with contact pads (25,26) for coupling to an electric device (30), and at its second side (102) with connections (20) to the electrical element (11). Terminals (52,53) are present at the second side (102) of the interconnect structure (21), and coupled to the interconnect structure (21) through extensions (22,23) that are laterally displaced and isolated from the semiconductor substrate region (15). An electric device (30) is assembled to the first side (101) of the interconnect structure (21), and an encapsulation (40) extending on the first side (101) of the interconnect structure (21) so as to support it and encapsulating the electric device (30) is present.

摘要翻译： 组件（100）包括横向受限的半导体衬底区域（15），其中限定了电气元件（20）。 其中存在互连结构（21）。 在其第一侧（101）处设置有用于联接到电气设备（30）的接触焊盘（25,26），并且在其第二侧（102）处提供与电气元件（11）的连接（20）。 端子（52,53）存在于互连结构（21）的第二侧（102）处，并通过横向移位并与半导体衬底区域隔离的延伸部（22,23）耦合到互连结构（21） （15）。 电气装置（30）组装到互连结构（21）的第一侧（101），以及在互连结构（21）的第一侧（101）上延伸以便支撑它的封装（40） 存在电气装置（30）的封装。

公开(公告)号：US20130149215A1

公开(公告)日：2013-06-13

申请号：US13755293

申请日：2013-01-31

申请人： Ronald Dekker ,  Remco Henricus Wilhelmus Pijnenburg ,  Nicolaas Johannes Anthonius Van Veen

发明人： Ronald Dekker ,  Remco Henricus Wilhelmus Pijnenburg ,  Nicolaas Johannes Anthonius Van Veen

IPC分类号： H01L37/00 ,  B01L3/00

CPC分类号： H01L37/00 ,  B01J2219/00783 ,  B01J2219/0095 ,  B01L3/502707 ,  B01L3/502715 ,  B01L2200/12 ,  B01L2200/14 ,  B01L2300/0645 ,  B01L2300/1827 ,  B01L2300/1883 ,  B01L2400/0415 ,  B81B2201/058 ,  B81C1/0023 ,  H01L2224/11 ,  Y10T436/11

摘要： The present invention relates to an integrated electronic-microfluidic device an integrated electronic-microfluidic device, comprising a semiconductor substrate (106) on a first (122) support, an electronic circuit (102, 104) on a first semiconductor-substrate side of the semiconductor substrate, and a signal interface structure to an external device. The signal interface structure is arranged on the first semiconductor-substrate side and configured to receive electrical signals from the electronic circuit. A microfluidic structure (126) is formed in the semiconductor substrate, and is configured to confine a fluid and to allow a flow of the fluid to and from the microfluidic structure only on a second semiconductor-substrate side that is opposite to the first semiconductor-substrate side and faces away form the first support. The electronic-microfluidic device forms a flexible platform for the formation of various System-in-Package applications. It achieves a clear separation between electrical and wet-chemical interfaces. The claimed method for fabricating the device of the invention also allows a simple formation of thermally isolated microfluidic structures.

摘要翻译： 本发明涉及一种集成电子微流体装置，集成的电子微流体装置，其包括在第一（122）支撑件上的半导体衬底（106），电子电路（102,104）的第一半导体衬底 半导体衬底和与外部设备的信号接口结构。 信号接口结构布置在第一半导体衬底侧并被配置为从电子电路接收电信号。 微流体结构（126）形成在半导体衬底中，并且被配置为限制流体并允许仅在与第一半导体衬底相反的第二半导体衬底侧上流体流过微流体结构， 衬底侧面和背面形成第一支撑件。 电子微流体装置形成用于形成各种系统级封装应用的灵活平台。 它实现了电气和湿化学界面之间的清晰分离。 所要求的制造本发明装置的方法还允许简单地形成热分离的微流体结构。

公开(公告)号：US20080150118A1

公开(公告)日：2008-06-26

申请号：US11816750

申请日：2006-02-27

申请人： Nicolaas Johannes Anthonius Van Veen ,  Ronald Dekker ,  Coen C. Tak

发明人： Nicolaas Johannes Anthonius Van Veen ,  Ronald Dekker ,  Coen C. Tak

IPC分类号： H01L23/52 ,  H01L23/48 ,  H01L21/02

CPC分类号： H01L23/5389 ,  H01L21/6835 ,  H01L24/24 ,  H01L24/82 ,  H01L24/97 ,  H01L2221/68331 ,  H01L2221/68345 ,  H01L2221/68368 ,  H01L2223/6677 ,  H01L2224/24226 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/10329 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2224/82 ,  H01L2924/00

摘要： The flexible package (100) has between a first (1) and a second side (2) a semiconductor device (20) with a thinned back substrate (10) and an interconnect structure. Contact means (31,33) for external contact and a first resin layer (52) are present at the first side (2) of the package (100), which contact means (31,33) are coupled to the interconnect structure. At the second side (2) the semiconductor device (20) is at least substantially covered with a second resin layer (12). The contact means (31,33) are present on the first resin layer (52) and are coupled to the interconnect structure with redistribution tracks (32,34) extending through the first resin layer (52). A passivation layer (55) covers the first resin layer (52) and the redistribution tracks (32,34) at least substantially.

摘要翻译： 柔性封装（100）在第一（1）和第二侧（2）之间具有带有薄的背衬基板（10）和互连结构的半导体器件（20）。 用于外部接触的接触装置（31,33）和第一树脂层（52）存在于封装（100）的第一侧（2）处，该接触装置（31,33）联接到互连结构。 在第二侧（2），半导体器件（20）至少基本被第二树脂层（12）覆盖。 接触装置（31,33）存在于第一树脂层（52）上，并且通过延伸穿过第一树脂层（52）的再分布轨道（32,34）与互连结构耦合。 钝化层（55）至少基本上覆盖第一树脂层（52）和再分布轨道（32,34）。

公开(公告)号：US08715592B2

公开(公告)日：2014-05-06

申请号：US13755293

申请日：2013-01-31

申请人： Ronald Dekker ,  Remco Henricus Wilhelmus Pijnenburg ,  Nicolaas Johannes Anthonius Van Veen

发明人： Ronald Dekker ,  Remco Henricus Wilhelmus Pijnenburg ,  Nicolaas Johannes Anthonius Van Veen

IPC分类号： G01N15/06

CPC分类号： H01L37/00 ,  B01J2219/00783 ,  B01J2219/0095 ,  B01L3/502707 ,  B01L3/502715 ,  B01L2200/12 ,  B01L2200/14 ,  B01L2300/0645 ,  B01L2300/1827 ,  B01L2300/1883 ,  B01L2400/0415 ,  B81B2201/058 ,  B81C1/0023 ,  H01L2224/11 ,  Y10T436/11

摘要： An integrated electronic-micro fluidic device an integrated electronic-micro fluidic device, comprising a semiconductor substrate on a first support, an electronic circuit on a first semiconductor-substrate side of the semiconductor substrate, and a signal interface structure to an external device. A micro fluidic structure is formed in the semiconductor substrate, and is configured to confine a fluid and to allow a flow of the fluid to and from the microfluidic structure only on a second semiconductor-substrate side that is opposite to the first semiconductor-substrate side and faces away from the first support.

摘要翻译： 一种集成电子微流体装置，包括在第一支撑件上的半导体衬底，半导体衬底的第一半导体衬底侧上的电子电路以及到外部器件的信号接口结构的集成电子微流体装置。 微流体结构形成在半导体衬底中，并且被配置为限制流体并且允许仅在与第一半导体衬底侧相反的第二半导体衬底侧上流体流过微流体结构 并远离第一支撑。

公开(公告)号：US20080290511A1

公开(公告)日：2008-11-27

申请号：US12093336

申请日：2006-11-07

申请人： Nicolaas Johannes Anthonius Van Veen ,  Ronald Dekker ,  Coenraad Cornelis Tak

发明人： Nicolaas Johannes Anthonius Van Veen ,  Ronald Dekker ,  Coenraad Cornelis Tak

IPC分类号： H01L21/50 ,  H01L23/48

CPC分类号： H01L25/0657 ,  H01L23/5389 ,  H01L24/48 ,  H01L24/73 ,  H01L25/03 ,  H01L25/105 ,  H01L2224/14181 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16265 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73204 ,  H01L2224/73207 ,  H01L2224/73253 ,  H01L2224/73257 ,  H01L2224/73265 ,  H01L2225/06517 ,  H01L2225/06524 ,  H01L2225/06555 ,  H01L2225/06586 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01076 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/07811 ,  H01L2924/10329 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19104 ,  H01L2924/19107 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/48145 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： An assembly of a first chip (100) and a second chip (200), which first chip (100) is flexible and is provided with a first and a second resin layer (12, 52) on opposite sides (1, 2) of the chip (100), which allows to keep the first chip under compressive conditions, on which first and second side (1,2) respectively first side contact pads (33) and second side contact pads (31) are present, which first side contact pads (33) are coupled to corresponding contact pads (211) of the second chip (200), and which second side contact pads (31) are designed for external connection of the assembly.

摘要翻译： 第一芯片（100）和第二芯片（200）的组件，第一芯片（100）是柔性的并且在第二芯片（100）的相对侧（1,2）上设置有第一和第二树脂层（12,52） 存在第一和第二侧（1,2）分别为第一侧接触焊盘（33）和第二侧接触焊盘（31）的第一芯片（100），其保持第一芯片处于压缩状态，第一侧 接触焊盘（33）耦合到第二芯片（200）的对应的接触焊盘（211），并且哪个第二侧接触焊盘（31）被设计用于组件的外部连接。

公开(公告)号：US08383060B2

公开(公告)日：2013-02-26

申请号：US12293284

申请日：2007-03-07

申请人： Ronald Dekker ,  Remco Henricus Wilhelmus Pijnenburg ,  Nicolaas Johannes Anthonius Van Veen

发明人： Ronald Dekker ,  Remco Henricus Wilhelmus Pijnenburg ,  Nicolaas Johannes Anthonius Van Veen

IPC分类号： G01N15/06 ,  G01N33/00 ,  G01N33/48

CPC分类号： H01L37/00 ,  B01J2219/00783 ,  B01J2219/0095 ,  B01L3/502707 ,  B01L3/502715 ,  B01L2200/12 ,  B01L2200/14 ,  B01L2300/0645 ,  B01L2300/1827 ,  B01L2300/1883 ,  B01L2400/0415 ,  B81B2201/058 ,  B81C1/0023 ,  H01L2224/11 ,  Y10T436/11

摘要： An integrated electronic-micro fluidic device an integrated electronic-micro fluidic device, comprising a semiconductor substrate on a first support, an electronic circuit on a first semiconductor-substrate side of the semiconductor substrate, and a signal interface structure to an external device. A micro fluidic structure is formed in the semiconductor substrate, and is configured to confine a fluid and to allow a flow of the fluid to and from the microfluidic structure only on a second semiconductor-substrate side that is opposite to the first semiconductor-substrate side and faces away from the first support.

摘要翻译： 一种集成电子微流体装置，包括在第一支撑件上的半导体衬底，半导体衬底的第一半导体衬底侧上的电子电路以及到外部器件的信号接口结构的集成电子微流体装置。 微流体结构形成在半导体衬底中，并且被配置为限制流体并且允许仅在与第一半导体衬底侧相反的第二半导体衬底侧上流体流过微流体结构 并远离第一支撑。

公开(公告)号：US20090072332A1

公开(公告)日：2009-03-19

申请号：US12293284

申请日：2007-03-07

申请人： Ronald Dekker ,  Remco Henricus Wilhelmus Pijnenburg ,  Nicolaas Johannes Anthonius Van Veen

发明人： Ronald Dekker ,  Remco Henricus Wilhelmus Pijnenburg ,  Nicolaas Johannes Anthonius Van Veen

IPC分类号： H01L29/00 ,  H01L21/00

CPC分类号： H01L37/00 ,  B01J2219/00783 ,  B01J2219/0095 ,  B01L3/502707 ,  B01L3/502715 ,  B01L2200/12 ,  B01L2200/14 ,  B01L2300/0645 ,  B01L2300/1827 ,  B01L2300/1883 ,  B01L2400/0415 ,  B81B2201/058 ,  B81C1/0023 ,  H01L2224/11 ,  Y10T436/11

摘要： The present invention relates to an integrated electronic-micro fluidic device an integrated electronic-micro fluidic device, comprising a semiconductor substrate (106) on a first (122) support, an electronic circuit (102, 104) on a first semiconductor-substrate side of the semiconductor substrate, and a signal interface structure to an external device. The signal interface structure is arranged on the first semiconductor-substrate side and configured to receive electrical signals from the electronic circuit. A micro fluidic structure (126) is formed in the semiconductor substrate, and is configured to confine a fluid and to allow a flow of the fluid to and from the microfluidic structure only on a second semiconductor-substrate side that is opposite to the first semiconductor-substrate side and faces away form the first support. The electronic-micro fluidic device forms a flexible platform for the formation of various System-in-Package applications. It achieves a clear separation between electrical and wet-chemical interfaces. The claimed method for fabricating the device of the invention also allows a simple formation of thermally isolated microfluidic structures.

摘要翻译： 本发明涉及集成电子微流体装置，其集成电子微流体装置包括在第一（122）支撑件上的半导体衬底（106），在第一半导体衬底侧上的电子电路（102,104） 的半导体衬底，以及到外部设备的信号接口结构。 信号接口结构布置在第一半导体衬底侧并被配置为从电子电路接收电信号。 微流体结构（126）形成在半导体衬底中，并且被配置为限制流体并且允许仅在与第一半导体相反的第二半导体衬底侧上流体流过微流体结构 底部侧面和背面形成第一支撑。 电子 - 微流体装置形成用于形成各种系统级封装应用的灵活平台。 它实现了电气和湿化学界面之间的清晰分离。 所要求的制造本发明装置的方法还允许简单地形成热分离的微流体结构。

公开(公告)号：US09072464B2

公开(公告)日：2015-07-07

申请号：US13379226

申请日：2010-07-16

申请人： Jaap Roger Haartsen ,  Ronald Dekker ,  Pascal De Graaf ,  Nicolaas Johannes Anthonius Van Veen ,  Alphonsus Tarcisius Jozef Maria Schipper

发明人： Jaap Roger Haartsen ,  Ronald Dekker ,  Pascal De Graaf ,  Nicolaas Johannes Anthonius Van Veen ,  Alphonsus Tarcisius Jozef Maria Schipper

IPC分类号： G01F1/68 ,  A61B5/11 ,  A61B5/00 ,  A61M15/00 ,  G01P5/10 ,  G01P5/12 ,  G01P13/00 ,  G08B21/04 ,  A61M5/168 ,  A61M16/00

CPC分类号： A61M11/005 ,  A61B5/1117 ,  A61B5/681 ,  A61B5/6831 ,  A61B2562/0219 ,  A61B2562/0271 ,  A61M5/16886 ,  A61M11/003 ,  A61M11/042 ,  A61M15/00 ,  A61M16/0003 ,  A61M16/104 ,  A61M16/18 ,  A61M2016/0021 ,  A61M2016/0027 ,  A61M2016/003 ,  A61M2205/332 ,  A61M2205/3334 ,  A61M2205/3368 ,  A61M2205/3375 ,  A61M2205/50 ,  A61M2205/82 ,  G01P5/10 ,  G01P5/12 ,  G01P13/006 ,  G08B21/0446 ,  Y10T29/49117 ,  Y10T29/49128

摘要： A thermal flow sensor integrated circuit for sensing flow in a channel based on temperature measurements, the integrated circuit having a temperature sensing element (30) on a front side of the integrated circuit arranged to face the channel, and a bond pad (60, 200) coupled electrically to the temperature sensing element, for making electrical contact off the integrated circuit, the bond pad being arranged to face away from the channel. By having the bond pad facing away from the channel, the space needed for the bond pad and any connections to it need not extend beyond the temperature sensing element and get in the way of the channel. Hence the temperature sensing element can be located closer to the channel or in the channel to enable measurements with better response time and sensitivity.

摘要翻译： 一种热流传感器集成电路，用于基于温度测量来感测通道中的流动，所述集成电路具有布置成面对所述通道的所述集成电路的前侧上的温度感测元件（30），以及接合焊盘（60,200 ）电耦合到所述温度感测元件，用于使所述集成电路进行电接触，所述接合焊盘被布置为面向远离所述通道。 通过使接合焊盘面向远离通道，接合焊盘所需的空间和与其连接的空间不需要延伸超过温度感测元件并妨碍通道。 因此，温度感测元件可以位于更靠近通道或通道中以使得能够以更好的响应时间和灵敏度进行测量。

公开(公告)号：US20120103085A1

公开(公告)日：2012-05-03

申请号：US13379226

申请日：2010-07-16

申请人： Jaap Roger Haartsen ,  Ronald Dekker ,  Pascal De Graaf ,  Nicolaas Johannes Anthonius Van Veen ,  Alphonsus Tarcisius Jozef Maria Schipper

发明人： Jaap Roger Haartsen ,  Ronald Dekker ,  Pascal De Graaf ,  Nicolaas Johannes Anthonius Van Veen ,  Alphonsus Tarcisius Jozef Maria Schipper

IPC分类号： G01F1/69 ,  H05K3/00 ,  H05K3/32 ,  G01F1/68

CPC分类号： A61M11/005 ,  A61B5/1117 ,  A61B5/681 ,  A61B5/6831 ,  A61B2562/0219 ,  A61B2562/0271 ,  A61M5/16886 ,  A61M11/003 ,  A61M11/042 ,  A61M15/00 ,  A61M16/0003 ,  A61M16/104 ,  A61M16/18 ,  A61M2016/0021 ,  A61M2016/0027 ,  A61M2016/003 ,  A61M2205/332 ,  A61M2205/3334 ,  A61M2205/3368 ,  A61M2205/3375 ,  A61M2205/50 ,  A61M2205/82 ,  G01P5/10 ,  G01P5/12 ,  G01P13/006 ,  G08B21/0446 ,  Y10T29/49117 ,  Y10T29/49128

摘要： A thermal flow sensor integrated circuit for sensing flow in a channel based on temperature measurements, the integrated circuit having a temperature sensing element (30) on a front side of the integrated circuit arranged to face the channel, and a bond pad (60, 200) coupled electrically to the temperature sensing element, for making electrical contact off the integrated circuit, the bond pad being arranged to face away from the channel. By having the bond pad facing away from the channel, the space needed for the bond pad and any connections to it need not extend beyond the temperature sensing element and get in the way of the channel. Hence the temperature sensing element can be located closer to the channel or in the channel to enable measurements with better response time and sensitivity.

摘要翻译： 一种热流传感器集成电路，用于基于温度测量来感测通道中的流动，所述集成电路具有布置成面对所述通道的所述集成电路的前侧上的温度感测元件（30），以及接合焊盘（60,200 ）电耦合到所述温度感测元件，用于使所述集成电路进行电接触，所述接合焊盘被布置为面向远离所述通道。 通过使接合焊盘面向远离通道，接合焊盘所需的空间和与其连接的空间不需要延伸超过温度感测元件并妨碍通道。 因此，温度感测元件可以位于更靠近通道或通道中以使得能够以更好的响应时间和灵敏度进行测量。

公开(公告)号：US07891836B2

公开(公告)日：2011-02-22

申请号：US11577367

申请日：2005-10-17

申请人： Ronald Dekker ,  Eduard Johannes Meijer ,  Eugene Timmering ,  Marc Andre De Samber

发明人： Ronald Dekker ,  Eduard Johannes Meijer ,  Eugene Timmering ,  Marc Andre De Samber

IPC分类号： F21V4/00

CPC分类号： H01L33/647 ,  H01L33/62 ,  H01L33/642 ,  H01L2224/16 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2224/0401

摘要： The present invention relates to a light-emitting device comprising a substrate, a circuitry, a LED in electrical connection with said circuitry, and a heat sink arranged to transport heat away from the LED, wherein the LED is in thermal contact with said heat sink through an opening in said substrate. The present invention also relates to methods for the manufacture of such a device.

摘要翻译： 本发明涉及一种发光装置，其包括基板，电路，与所述电路电连接的LED，以及布置成将热量从LED传送的散热器，其中所述LED与所述散热片热接触 通过所述衬底中的开口。 本发明还涉及制造这种装置的方法。