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公开(公告)号：US20160054352A1
公开(公告)日：2016-02-25
申请号：US14590994
申请日：2015-01-07
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD. , TOHOKU UNIVERSITY
Inventor： Pil Joong KANG , Je Hong KYOUNG , Masayoshi ESASHI , Jung Won LEE
CPC classification number: G01P15/123 , G01C19/5719 , G01L9/0045 , G01L9/0055 , G01L19/0092 , G01P15/18 , G01P2015/0842 , G01R33/0047 , G01R33/0052 , G01R33/0206 , G01R33/12
Abstract: There are provided a multi-axis sensor and a method for manufacturing the same. The multi-axis sensor includes: a first sensor mounted on a board and detecting inertial force; and a second sensor mounted on the board and detecting a position and a motion, wherein the first sensor and the board have a seal formed therebetween so as to prevent permeation from the outside and are electrically connected to each other.
Abstract translation: 提供了一种多轴传感器及其制造方法。 多轴传感器包括：安装在板上并检测惯性力的第一传感器; 以及安装在所述板上并检测位置和运动的第二传感器，其中所述第一传感器和所述板具有形成在其间的密封，从而防止从外部渗出并彼此电连接。
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公开(公告)号：US20190207323A1
公开(公告)日：2019-07-04
申请号：US16166494
申请日：2018-10-22
Applicant: Samsung Electro-Mechanics Co., Ltd.
Inventor： Il Kweon JOUNG , Yong Hyen PARK , Jung Won LEE
CPC classification number: H01Q21/065 , H01Q1/2283 , H01Q1/526 , H01Q9/0414
Abstract: An antenna module including two or more substrates stacked and having different flexibility, a patch antenna disposed above or within an uppermost substrate from among the two or more substrates, and an IC disposed below or within a lowermost substrate from among the two or more substrates, and electrically connected to the patch antenna through the substrates, wherein the two or more substrates comprise a first substrate and a second substrate, and wherein the second substrate is more flexible than the first substrate, and extends in a lateral direction to have an overlap region overlapping the first substrate and an extension region not overlapping the first substrate.
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公开(公告)号：US20150033860A1
公开(公告)日：2015-02-05
申请号：US14326714
申请日：2014-07-09
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Jong Woon KIM , Jung Won LEE , Seung Joo SHIN , Won Kyu JEUNG
IPC: G01P15/08
CPC classification number: G01P15/08 , B60R21/0132 , G01C19/56 , G01C19/5719 , G01P15/0802 , G01P15/135 , G01P2015/0805
Abstract: Disclosed herein is an acceleration sensor, including: a mass body part including a first mass body and a second mass body; a frame supporting the first mass body and the second mass body; first flexible parts each connecting the first mass body and the second mass body to the frame; and second flexible parts each connecting the first mass body and the second mass body to the frame, wherein the first mass body and the second mass body are each connected to the frame so as to be eccentric by the second flexible part.
Abstract translation: 这里公开了一种加速度传感器，包括：质量体部，包括第一质量体和第二质量体; 支撑第一质量体和第二质量体的框架; 第一柔性部件，每个将第一质量体和第二质量体连接到框架; 以及将所述第一质量体和所述第二质量体连接到所述框架的第二柔性部，其中，所述第一质量体和所述第二质量体各自与所述框架连接，以被所述第二柔性部偏心。
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公开(公告)号：US20230119122A1
公开(公告)日：2023-04-20
申请号：US17682023
申请日：2022-02-28
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Ji Hye HAN , Jung Min KIM , Byung Woo KANG , Hong Je CHOI , Hye Jin PARK , Sang Wook LEE , Bon Seok KOO , Jung Won LEE
Abstract: A multilayer electronic component includes a body including a dielectric layer and an internal electrode, and an external electrode disposed on the body. The external electrode includes an electrode layer connected to the internal electrode, an intermetallic compound layer disposed on the electrode layer and including a first intermetallic compound and glass, and a conductive resin layer disposed on the intermetallic compound layer and including a conductive connection portion including a second intermetallic compound and a low-melting-point metal, a plurality of metal particles, and a resin. A ratio of a length of a first direction component of a region having the first intermetallic compound, with respect to a length of a first direction component of the intermetallic compound layer, is 20% or more.
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公开(公告)号：US20210320428A1
公开(公告)日：2021-10-14
申请号：US17355365
申请日：2021-06-23
Applicant: Samsung Electro-Mechanics Co., Ltd.
Inventor： Il Kweon JOUNG , Yong Hyen PARK , Jung Won LEE
Abstract: An antenna module including two or more substrates stacked and having different flexibility, a patch antenna disposed above or within an uppermost substrate from among the two or more substrates, and an IC disposed below or within a lowermost substrate from among the two or more substrates, and electrically connected to the patch antenna through the substrates, wherein the two or more substrates comprise a first substrate and a second substrate, and wherein the second substrate is more flexible than the first substrate, and extends in a lateral direction to have an overlap region overlapping the first substrate and an extension region not overlapping the first substrate.
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Patent Agency Ranking
6.发明申请INERTIAL SENSOR MODULE HAVING HERMETIC SEAL FORMED OF METAL AND MULTI-AXIS SENSOR EMPLOYING THE SAME 审中-公开具有使用其的金属和多轴传感器形成的密封的惯性传感器模块公开(公告)号：US20150355220A1
公开(公告)日：2015-12-10
申请号：US14690839
申请日：2015-04-20
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Pil Joong KANG , Jung Won LEE , Hyun Kee LEE , Jong Hyeong SONG
IPC: G01P15/12 , G01P15/093 , G01P15/125 , G01P15/02
CPC classification number: G01P15/123 , B81B2201/0235 , B81B2201/0242 , B81C1/00269 , B81C2203/0109 , B81C2203/035 , G01C19/56 , G01P15/09 , G01P15/093 , G01P15/125 , G01P15/18 , G01P2015/0842
Abstract: There are provided an inertial sensor module having a hermetic seal formed of metal and a multi-axis sensor employing the same. The inertial sensor module includes: a sensor main body including a plurality of wirings connected to any one of a driving electrode of a sensor and a sensing electrode of the sensor and formed on a substrate for a lower cap by a wafer level package (WLP) scheme to detect an inertial force; a substrate for an upper cap bonded on the sensor main body to protect the sensor main body; and a hermetic seal formed of metal isolated from the wiring and interposed into the sensor main body and the substrate for the upper cap by performing the bonding by metal bonding.
Abstract translation: 提供了一种惯性传感器模块，其具有由金属形成的气密密封件和使用其的多轴传感器。 惯性传感器模块包括：传感器主体，包括连接到传感器的驱动电极和传感器的感测电极中的任何一个的多个布线，并且通过晶片级封装（WLP）形成在用于下盖的基板上， 检测惯性力的方案; 用于上盖的基板，其接合在所述传感器主体上以保护所述传感器主体; 以及通过金属接合进行接合而由与配线隔离并插入到传感器主体和上盖的基板中的金属形成的气密密封。
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公开(公告)号：US20150176993A1
公开(公告)日：2015-06-25
申请号：US14290337
申请日：2014-05-29
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Won Kyu JEUNG , Jung Won LEE , Jong Hyeong SONG
IPC: G01C19/5705 , G01P15/09
CPC classification number: G01C19/5783 , G01P15/123 , G01P15/18
Abstract: Embodiments of the invention provide a micro electro mechanical system (MEMS) sensor module, including a sensor, a substrate connected to the sensor, and an external board connected to the substrate by a conductive connector. The substrate is provided with a cavity so as to be opposite to the sensor.
Abstract translation: 本发明的实施例提供一种包括传感器，连接到传感器的基板和通过导电连接器连接到基板的外部板的微机电系统（MEMS）传感器模块。 基板设置有与传感器相对的空腔。
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公开(公告)号：US20160011393A1
公开(公告)日：2016-01-14
申请号：US14722773
申请日：2015-05-27
Applicant: Samsung Electro-Mechanics Co., Ltd.
Inventor： Jong Beom KIM , June Kyoo LEE , Hyung Jae PARK , Sang Jin KIM , Jung Won LEE , Hwa Sun LEE , Dong Hyun PARK
CPC classification number: H01L41/0946 , G02B7/08 , G02B7/36 , G02B26/0858 , G02B27/646 , H01L41/0825
Abstract: An actuator unit includes a driving part connecting a fixing part and a support part which are disposed to be substantially coplanar; an actuator which is configured to deform the driving part to drive the support part out of the coplanar relationship with respect to the fixing part; and a sensor which is configured to measure a displacement amount or deformation of the driving part.
Abstract translation: 致动器单元包括连接固定部和支撑部的驱动部，所述固定部和支撑部被设置为基本上共面; 致动器，其构造成使所述驱动部变形，以相对于所述固定部分驱动所述支撑部分脱离所述共面关系; 以及传感器，其构造成测量所述驱动部的位移量或变形。
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公开(公告)号：US20240222025A1
公开(公告)日：2024-07-04
申请号：US18130965
申请日：2023-04-05
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Sung Soo KIM , Jae Young NA , Jin Hyung LIM , Jung Won LEE
CPC classification number: H01G4/2325 , H01G4/30
Abstract: A multilayer electronic component according to an embodiment of the present disclosure includes a body including a dielectric layer and internal electrodes; and an external electrode including a base electrode layer connected to the internal electrode, a thin film electrode layer disposed on the base electrode layer, and a plating layer disposed on the thin film electrode layer, wherein an average thickness of the base electrode layer may be 1 μm or more and 3 μm or less, and an average thickness of the thin film electrode layer may be 300 nm or more and 800 nm or less.
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公开(公告)号：US20230215642A1
公开(公告)日：2023-07-06
申请号：US17961844
申请日：2022-10-07
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Sin Il GU , Jin Hyung LIM , Kang Ha LEE , Jung Won LEE
CPC classification number: H01G4/2325 , H01G4/30
Abstract: A multilayer electronic component includes a body including first and second surfaces opposing each other in a first direction, and third and fourth surfaces connected to the first and second surfaces and opposing each other in a second direction; a first external electrode including a first connection portion disposed on the third surface and a first band portion extending from the first connection portion to a first portion of the first surface; a second external electrode including a second connection portion disposed on the fourth surface and a second band portion extending from the second connection portion to a first portion of the first surface; an insulating layer disposed on the second surface and extending to the first and second connection portions, the insulating layer including a first glass and a first oxide including aluminum (Al).
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