GROUP III-V COMPOUND SEMICONDUCTOR PHOTO DETECTOR, METHOD OF FABRICATING GROUP III-V COMPOUND SEMICONDUCTOR PHOTO DETECTOR, PHOTO DETECTOR, AND EPITAXIAL WAFER
    4.
    发明申请
    GROUP III-V COMPOUND SEMICONDUCTOR PHOTO DETECTOR, METHOD OF FABRICATING GROUP III-V COMPOUND SEMICONDUCTOR PHOTO DETECTOR, PHOTO DETECTOR, AND EPITAXIAL WAFER 审中-公开
    III-V族化合物半导体照相检测器,III-V族化合物半导体照相检测器,照相检测器和外延波形的方法

    公开(公告)号:US20150001466A1

    公开(公告)日:2015-01-01

    申请号:US14490128

    申请日:2014-09-18

    IPC分类号: H01L31/0352 H01L31/0304

    摘要: An object of the present invention is to provide a group III-V compound semiconductor photo detector comprising an absorption layer having a group III-V compound semiconductor layer containing Sb as a group V constituent element, and an n-type InP window layer, resulting in reduced dark current. The InP layer 23 grown on the absorption layer 23 contains antimony as impurity, due to the memory effect with antimony which is supplied during the growth of a GaAsSb layer of the absorption layer 21. In the group III-V compound semiconductor photo detector 11, the InP layer 23 contains antimony as impurity and is doped with silicon as n-type dopant. Although antimony impurities in the InP layer 23 generate holes, the silicon contained in the InP layer 23 compensates for the generated carriers. As a result, the second portion 23d of the InP layer 23 has sufficient n-type conductivity.

    摘要翻译: 本发明的目的是提供一种III-V族化合物半导体光电检测器,其包括具有含有Sb作为V族构成元素的III-V族化合物半导体层和n型InP窗口层的吸收层,得到 在减少的暗电流。 由于在吸收层21的GaAsSb层生长期间提供的锑的记忆效应,在吸收层23上生长的InP层23含有锑作为杂质。在III-V族化合物半导体光电检测器11中, InP层23含有锑作为杂质,并掺杂有硅作为n型掺杂剂。 虽然InP层23中的锑杂质产生空穴,但是包含在InP层23中的硅补偿所生成的载流子。 结果,InP层23的第二部分23d具有足够的n型导电性。

    Semiconductor stacked body and light-receiving device

    公开(公告)号:US10790401B2

    公开(公告)日:2020-09-29

    申请号:US16407521

    申请日:2019-05-09

    摘要: A semiconductor stacked body includes a base layer containing a III-V group compound semiconductor, a light-receiving layer containing a III-V group compound semiconductor, a control layer containing a III-V group compound semiconductor and disposed in contact with the light-receiving layer, a diffusion blocking layer containing a III-V group compound semiconductor and a p-type impurity that generates a p-type carrier, the diffusion blocking layer having a p-type impurity concentration of 1×1016 cm−3 or less, and a contact layer containing a III-V group compound semiconductor and having p-type conductivity. These layers are stacked in this order. The concentration of an element in the control layer, the element being identical to a group V element contained in the light-receiving layer, is lower on a main surface of the control layer adjacent to the diffusion blocking layer than on a main surface of the control layer adjacent to the light-receiving layer.