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公开(公告)号：US20240370065A1
公开(公告)日：2024-11-07
申请号：US18775462
申请日：2024-07-17
Applicant: Samsung Electronics Co., Ltd.
Inventor： Jong Yoon KIM , Jung Jin KIM , Young Sun PARK , Chung Keun YOO
Abstract: An electronic device is provided. The electronic device includes two housing structures, a hinge structure, and a flexible display, the hinge structure includes a first saw-toothed spur gear, a second saw-toothed spur gear, a third saw-toothed spur gear, a fourth saw-toothed spur gear, a first guide structure fixed to the first housing structure and rotated by the gears, and a second guide structure fixed to the second housing structure and rotated in an opposite direction of the first guide structure, the first guide structure is rotated about a first axis formed from a bottom surface of the flexible display upwards, and the second guide structure is rotated about a second axis that is spaced apart from the first axis and is formed from the bottom surface of the flexible display.
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公开(公告)号：US20160126432A1
公开(公告)日：2016-05-05
申请号：US14991540
申请日：2016-01-08
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Yong Min KWON , Jung Jin KIM , Hak Hwan KIM , Sung Jun IM
CPC classification number: H01L33/56 , H01L27/153 , H01L33/0095 , H01L33/06 , H01L33/32 , H01L33/382 , H01L33/60 , H01L2933/0016 , H01L2933/0033 , H01L2933/005 , H01L2933/0058 , H01L2933/0066
Abstract: A method of manufacturing a semiconductor light emitting device package includes providing a wafer and forming, on the wafer, a semiconductor laminate comprising a plurality of light emitting devices. Electrodes are formed in respective light emitting device regions of the semiconductor laminate. A curable resin is applied to a surface of the semiconductor laminate on which the electrodes are formed. A support structure is formed for supporting the semiconductor laminate by curing the curable resin. Through holes are formed in the support structure to expose the electrodes therethrough. Connection electrodes are formed in the support structure to be connected to the exposed electrodes.
Abstract translation: 制造半导体发光器件封装的方法包括提供晶片并在晶片上形成包括多个发光器件的半导体层叠体。 电极形成在半导体层叠体的各个发光器件区域中。 将可固化树脂施加到其上形成有电极的半导体层叠体的表面上。 形成用于通过固化可固化树脂来支撑半导体层压体的支撑结构。 在支撑结构中形成通孔以使电极暴露于其中。 在支撑结构中形成连接电极以连接到暴露的电极。
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公开(公告)号：US20200371564A1
公开(公告)日：2020-11-26
申请号：US16990369
申请日：2020-08-11
Applicant: Samsung Electronics Co., Ltd.
Inventor： Jong Yoon KIM , Jung Jin KIM , Young Sun PARK , Chung Keun YOO
Abstract: An electronic device is provided. The electronic device includes two housing structures, a hinge structure, and a flexible display, the hinge structure includes a first saw-toothed spur gear, a second saw-toothed spur gear, a third saw-toothed spur gear, a fourth saw-toothed spur gear, a first guide structure fixed to the first housing structure and rotated by the gears, and a second guide structure fixed to the second housing structure and rotated in an opposite direction of the first guide structure, the first guide structure is rotated about a first axis formed from a bottom surface of the flexible display upwards, and the second guide structure is rotated about a second axis that is spaced apart from the first axis and is formed from the bottom surface of the flexible display.
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公开(公告)号：US20160308089A1
公开(公告)日：2016-10-20
申请号：US14993066
申请日：2016-01-11
Applicant: Samsung Electronics Co., Ltd.
Inventor： Hyung Kun KIM , Si Han KIM , Yu Seung KIM , Jung Jin KIM
CPC classification number: H01L33/0095 , H01L33/486 , H01L33/504 , H01L33/505 , H01L33/54 , H01L33/58 , H01L2933/0041 , H01L2933/005 , H01L2933/0058
Abstract: Method of manufacturing a semiconductor light emitting device package are described. Semiconductor light emitting device packages includes may be formed by forming a plurality of light emitting diode chips having a structure in which a first conductivity-type semiconductor layer, an active layer, and a second conductivity-type semiconductor layer are sequentially stacked on a wafer, forming a phosphor layer and an encapsulation layer on the first conductivity-type semiconductor layer, forming a texture on the encapsulation layer by removing a portion of the encapsulation layer from an upper surface thereof; and separating the plurality of light emitting diode chips from each other.
Abstract translation: 描述制造半导体发光器件封装的方法。 半导体发光器件封装可以通过形成多个具有第一导电型半导体层，有源层和第二导电类型半导体层依次层叠在晶片上的结构的发光二极管芯片形成， 在所述第一导电型半导体层上形成荧光体层和封装层，通过从其上表面去除所述封装层的一部分，在所述封装层上形成纹理; 以及将所述多个发光二极管芯片彼此分离。
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公开(公告)号：US20150357250A1
公开(公告)日：2015-12-10
申请号：US14606954
申请日：2015-01-27
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Min Ki KIM , Jung Jin KIM , Yong Min KWON
CPC classification number: H01L33/005 , G01J2001/4252 , G01J2003/466 , G01R31/2635 , H01L24/97 , H01L33/0095 , H01L33/486 , H01L33/62 , H01L2224/14 , H01L2224/16225 , H01L2933/0033 , H01L2933/0041
Abstract: A method of manufacturing a light emitting device package includes forming a plurality of light emitting devices by growing a plurality of semiconductor layers on a wafer, and measuring color characteristics of light emitted from each of the plurality of light emitting devices. For each of the plurality of light emitting devices, a type and an amount of wavelength conversion material is determined for color compensating the light emitting device based on a difference between the measured color characteristics and target color characteristics. A wavelength conversion layer is formed on at least two light emitting devices among the plurality of light emitting devices, the wavelength conversion layer having the type and the amount of wavelength conversion material determined for the at least two light emitting devices. The plurality of light emitting devices is then divided into individual light emitting device packages.
Abstract translation: 制造发光器件封装的方法包括通过在晶片上生长多个半导体层来形成多个发光器件，并测量从多个发光器件中的每一个发射的光的颜色特性。 对于多个发光器件中的每一个，基于测量的颜色特性和目标颜色特性之间的差异，确定波长转换材料的类型和量用于对发光器件进行颜色补偿。 波长转换层形成在多个发光器件中的至少两个发光器件上，波长转换层具有为至少两个发光器件确定的类型和波长转换材料的量。 然后将多个发光器件分成单独的发光器件封装。
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Patent Agency Ranking
公开(公告)号：US20220291724A1
公开(公告)日：2022-09-15
申请号：US17750919
申请日：2022-05-23
Applicant: Samsung Electronics Co., Ltd.
Inventor： Jong Yoon KIM , Jung Jin KIM , Young Sun PARK , Chung Keun YOO
Abstract: An electronic device is provided. The electronic device includes two housing structures, a hinge structure, and a flexible display, the hinge structure includes a first saw-toothed spur gear, a second saw-toothed spur gear, a third saw-toothed spur gear, a fourth saw-toothed spur gear, a first guide structure fixed to the first housing structure and rotated by the gears, and a second guide structure fixed to the second housing structure and rotated in an opposite direction of the first guide structure, the first guide structure is rotated about a first axis formed from a bottom surface of the flexible display upwards, and the second guide structure is rotated about a second axis that is spaced apart from the first axis and is formed from the bottom surface of the flexible display.
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公开(公告)号：US20190166703A1
公开(公告)日：2019-05-30
申请号：US16199743
申请日：2018-11-26
Applicant: Samsung Electronics Co., Ltd.
Inventor： Jong Yoon KIM , Jung Jin KIM , Young Sun PARK , Chung Keun YOO
Abstract: An electronic device is provided. The electronic device includes two housing structures, a hinge structure, and a flexible display, the hinge structure includes a first saw-toothed spur gear, a second saw-toothed spur gear, a third saw-toothed spur gear, a fourth saw-toothed spur gear, a first guide structure fixed to the first housing structure and rotated by the gears, and a second guide structure fixed to the second housing structure and rotated in an opposite direction of the first guide structure, the first guide structure is rotated about a first axis formed from a bottom surface of the flexible display upwards, and the second guide structure is rotated about a second axis that is spaced apart from the first axis and is formed from the bottom surface of the flexible display.
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公开(公告)号：US20140377894A1
公开(公告)日：2014-12-25
申请号：US14297199
申请日：2014-06-05
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Yong Min KWON , Jung Jin KIM , Hak Hwan KIM , Sung Jun IM
CPC classification number: H01L33/56 , H01L27/153 , H01L33/0095 , H01L33/06 , H01L33/32 , H01L33/382 , H01L33/60 , H01L2933/0016 , H01L2933/0033 , H01L2933/005 , H01L2933/0058 , H01L2933/0066
Abstract: A method of manufacturing a semiconductor light emitting device package includes providing a wafer and forming, on the wafer, a semiconductor laminate comprising a plurality of light emitting devices. Electrodes are formed in respective light emitting device regions of the semiconductor laminate. A curable resin is applied to a surface of the semiconductor laminate on which the electrodes are formed. A support structure is formed for supporting the semiconductor laminate by curing the curable resin. Through holes are formed in the support structure to expose the electrodes therethrough. Connection electrodes are formed in the support structure to be connected to the exposed electrodes.
Abstract translation: 制造半导体发光器件封装的方法包括提供晶片并在晶片上形成包括多个发光器件的半导体层叠体。 电极形成在半导体层叠体的各个发光器件区域中。 将可固化树脂施加到其上形成有电极的半导体层叠体的表面上。 形成用于通过固化可固化树脂来支撑半导体层压体的支撑结构。 在支撑结构中形成通孔以使电极暴露于其中。 在支撑结构中形成连接电极以连接到暴露的电极。
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公开(公告)号：US20230409092A1
公开(公告)日：2023-12-21
申请号：US18358480
申请日：2023-07-25
Applicant: Samsung Electronics Co., Ltd.
Inventor： Jong Yoon KIM , Jung Jin KIM , Young Sun PARK , Chung Keun YOO
CPC classification number: G06F1/1681 , G06F1/1616 , H05K5/0226 , H04M1/0268 , H04M1/022 , G06F1/1641 , G06F1/1652 , H05K5/0017
Abstract: An electronic device is provided. The electronic device includes two housing structures, a hinge structure, and a flexible display, the hinge structure includes a first saw-toothed spur gear, a second saw-toothed spur gear, a third saw-toothed spur gear, a fourth saw-toothed spur gear, a first guide structure fixed to the first housing structure and rotated by the gears, and a second guide structure fixed to the second housing structure and rotated in an opposite direction of the first guide structure, the first guide structure is rotated about a first axis formed from a bottom surface of the flexible display upwards, and the second guide structure is rotated about a second axis that is spaced apart from the first axis and is formed from the bottom surface of the flexible display.
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公开(公告)号：US20210255672A1
公开(公告)日：2021-08-19
申请号：US17313399
申请日：2021-05-06
Applicant: Samsung Electronics Co., Ltd.
Inventor： Jong Yoon KIM , Jung Jin KIM , Young Sun PARK , Chung Keun YOO
Abstract: An electronic device is provided. The electronic device includes two housing structures, a hinge structure, and a flexible display, the hinge structure includes a first saw-toothed spur gear, a second saw-toothed spur gear, a third saw-toothed spur gear, a fourth saw-toothed spur gear, a first guide structure fixed to the first housing structure and rotated by the gears, and a second guide structure fixed to the second housing structure and rotated in an opposite direction of the first guide structure, the first guide structure is rotated about a first axis formed from a bottom surface of the flexible display upwards, and the second guide structure is rotated about a second axis that is spaced apart from the first axis and is formed from the bottom surface of the flexible display.
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