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    Semiconductor package including a redistribution line
    1.
    发明授权
    Semiconductor package including a redistribution line 有权

    公开(公告)号：US10651224B2

    公开(公告)日：2020-05-12

    申请号：US16058451

    申请日：2018-08-08

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Ji Hwang Kim ,  Chajea Jo ,  Hyoeun Kim ,  Jongbo Shim ,  Sang-uk Han

    IPC: H01L31/00 ,  H01L27/146 ,  H01L23/00

    Abstract: A semiconductor package includes a first semiconductor chip. A second semiconductor chip is below the first semiconductor chip. A third semiconductor chip is below the second semiconductor chip. The second semiconductor chip includes a first surface in direct contact with the first semiconductor chip, and a second surface facing the third semiconductor chip. A first redistribution pattern is on the second surface of the second semiconductor chip and is electrically connected to the third semiconductor chip. The third semiconductor chip includes a third surface facing the second semiconductor chip. A conductive pad is on the third surface.

    Image sensor package
    2.
    发明授权
    Image sensor package 有权

    公开(公告)号：US11637140B2

    公开(公告)日：2023-04-25

    申请号：US17202702

    申请日：2021-03-16

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Ji-hwang Kim ,  Jong-bo Shim ,  Sang-uk Han ,  Cha-jea Jo ,  Won-il Lee

    IPC: H01L27/146

    Abstract: An image sensor package includes an image sensor chip on a package substrate, a logic chip on the package substrate and perpendicularly overlapping the image sensor chip, and a memory chip on the package substrate and perpendicularly overlapping the image sensor chip and logic chip. The logic chip processes a pixel signal output from the image sensor chip. The memory chip is electrically connected to the image sensor chip through a conductive wire and stores at least one of the pixel signal from the image sensor chip or a pixel signal processed by the logic chip. The memory chip receives the pixel signal output from the image sensor chip through the conductive wire and receives the pixel signal processed by the logic chip through the image sensor chip and the conductive wire.

    Semiconductor package and method of manufacturing the same
    4.
    发明授权
    Semiconductor package and method of manufacturing the same 有权

    公开(公告)号：US10026724B2

    公开(公告)日：2018-07-17

    申请号：US15444277

    申请日：2017-02-27

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Ji-hwang Kim ,  Jong-bo Shim ,  Sang-uk Han ,  Cha-jea Jo ,  Gun-ho Chang

    IPC: H01L25/00 ,  H01L23/00 ,  H01L23/31 ,  H01L25/065

    Abstract: A method of manufacturing a semiconductor package includes forming at least two partial package chip stacks, each partial package chip stack including at least two semiconductor chips each including a plurality of through substrate vias (TSVs), and including a first mold layer surrounding side surfaces of the at least two semiconductor chips, and sequentially mounting the at least two partial package chip stacks on a package substrate in a direction vertical to a top surface of the package substrate, such that the at least two partial package chip stacks include a first partial package chip stack and a second partial package chip stack directly connected to the first partial package chip stack.

    Image sensor package
    6.
    发明授权
    Image sensor package 有权

    公开(公告)号：US12113087B2

    公开(公告)日：2024-10-08

    申请号：US18127110

    申请日：2023-03-28

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Ji-hwang Kim ,  Jong-bo Shim ,  Sang-uk Han ,  Cha-jea Jo ,  Won-il Lee

    IPC: H01L27/146

    CPC classification number: H01L27/14634 ,  H01L27/1462 ,  H01L27/14636 ,  H01L27/14638

    Abstract: An image sensor package includes an image sensor chip on a package substrate, a logic chip on the package substrate and perpendicularly overlapping the image sensor chip, and a memory chip on the package substrate and perpendicularly overlapping the image sensor chip and logic chip. The logic chip processes a pixel signal output from the image sensor chip. The memory chip is electrically connected to the image sensor chip through a conductive wire and stores at least one of the pixel signal from the image sensor chip or a pixel signal processed by the logic chip. The memory chip receives the pixel signal output from the image sensor chip through the conductive wire and receives the pixel signal processed by the logic chip through the image sensor chip and the conductive wire.

    Image sensor package
    7.
    发明授权
    Image sensor package 有权

    公开(公告)号：US10971535B2

    公开(公告)日：2021-04-06

    申请号：US15636801

    申请日：2017-06-29

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Ji-hwang Kim ,  Jong-bo Shim ,  Sang-uk Han ,  Cha-jea Jo ,  Won-il Lee

    IPC: H01L27/00 ,  H01L27/146

    Abstract: An image sensor package includes an image sensor chip on a package substrate, a logic chip on the package substrate and perpendicularly overlapping the image sensor chip, and a memory chip on the package substrate and perpendicularly overlapping the image sensor chip and logic chip. The logic chip processes a pixel signal output from the image sensor chip. The memory chip is electrically connected to the image sensor chip through a conductive wire and stores at least one of the pixel signal from the image sensor chip or a pixel signal processed by the logic chip. The memory chip receives the pixel signal output from the image sensor chip through the conductive wire and receives the pixel signal processed by the logic chip through the image sensor chip and the conductive wire.

    Printed circuit board including through region and semiconductor package formed by using the same
    8.
    发明授权
    Printed circuit board including through region and semiconductor package formed by using the same 有权
    印刷电路板包括通过使用其形成的通过区域和半导体封装

    公开(公告)号：US09431272B2

    公开(公告)日：2016-08-30

    申请号：US14223240

    申请日：2014-03-24

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Chae-hun Im ,  Sang-uk Han

    IPC: H05K7/10 ,  H01L21/56 ,  H01L23/31

    CPC classification number: H01L21/561 ,  H01L21/565 ,  H01L23/3128 ,  H01L2224/16225 ,  H01L2924/15311

    Abstract: Provided is a printed circuit board (PCB). The PCB includes a board body that includes a first surface and a second surface opposite the first surface, a semiconductor chip mounting region that is disposed on the first surface of the board body, and includes a plurality of semiconductor chip mounting parts on which a semiconductor chip may be mounted, a through region that is disposed at a peripheral portion of the semiconductor chip mounting region, and includes a plurality of through holes passing through the board body, and an external terminal forming region that is disposed on the second surface of the board body, wherein a plurality of external terminal forming parts are disposed at the external terminal forming region in correspondence with the respective semiconductor chip mounting parts.

    Abstract translation: 提供了印刷电路板（PCB）。 PCB包括：板体，其包括第一表面和与第一表面相对的第二表面;半导体芯片安装区域，设置在板体的第一表面上，并且包括多个半导体芯片安装部件，半导体芯片安装部件上具有半导体 可以安装芯片，贯穿区域，其设置在半导体芯片安装区域的周边部分，并且包括穿过板体的多个通孔，以及设置在该半导体芯片安装区域的第二表面上的外部端子形成区域 板体，其中多个外部端子形成部件对应于各个半导体芯片安装部分设置在外部端子形成区域。

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