公开(公告)号：US20080297691A1

公开(公告)日：2008-12-04

申请号：US12103113

申请日：2008-04-15

申请人： Shawn Kim ,  Sang-uk Kim ,  Mu-kyung Jeon ,  Jin-woo Park ,  Youn-bum Lee ,  Tae-soo Kim

发明人： Shawn Kim ,  Sang-uk Kim ,  Mu-kyung Jeon ,  Jin-woo Park ,  Youn-bum Lee ,  Tae-soo Kim

IPC分类号： G02F1/13357

CPC分类号： G02F1/133615 ,  G02B6/005 ,  G02B6/0055

摘要： A back light unit for a liquid crystal display panel including a light source, a light guide plate for receiving light from the light source, a lower surface of the light guide plate coated with a reflection sheet, wherein the reflection sheet may be metal, a diffuser for diffusing the light from the light guide plate, and an optical sheet for providing the light from the diffuser to the liquid crystal display panel.

摘要翻译： 一种用于液晶显示面板的背光单元，包括光源，用于接收来自光源的光的导光板，涂覆有反射片的导光板的下表面，其中反射片可以是金属， 用于使来自导光板的光漫射的漫射器，以及用于将来自扩散器的光提供给液晶显示面板的光学片。

公开(公告)号：US20110291294A1

公开(公告)日：2011-12-01

申请号：US13049377

申请日：2011-03-16

申请人： Sang-Uk Kim ,  Jin-woo Park ,  Dae-Young Choi ,  Mi-Yeon Kim ,  Sun-Hye Lee

发明人： Sang-Uk Kim ,  Jin-woo Park ,  Dae-Young Choi ,  Mi-Yeon Kim ,  Sun-Hye Lee

IPC分类号： H01L23/52

CPC分类号： H01L23/147 ,  H01L23/13 ,  H01L23/49827 ,  H01L23/5385 ,  H01L24/45 ,  H01L24/48 ,  H01L25/105 ,  H01L25/16 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/00014 ,  H01L2924/00012

摘要： A multi-chip package may include a first semiconductor package, a second semiconductor package and an interposer chip. The second semiconductor package may be arranged over the first semiconductor package. The interposer chip may be interposed between the first semiconductor package and the second semiconductor package. The interposer chip may have a receiving groove configured to receive the first semiconductor package. Thus, electrical connection reliability between the first semiconductor package and the second semiconductor package may be improved under a condition that the connecting terminals may have small sizes.

摘要翻译： 多芯片封装可以包括第一半导体封装，第二半导体封装和插入器芯片。 第二半导体封装可以布置在第一半导体封装之上。 插入器芯片可以插入在第一半导体封装和第二半导体封装之间。 插入器芯片可以具有被配置为接收第一半导体封装的接收槽。 因此，在连接端子可以具有小尺寸的条件下，可以提高第一半导体封装和第二半导体封装之间的电连接可靠性。

公开(公告)号：US20150200186A1

公开(公告)日：2015-07-16

申请号：US14568113

申请日：2014-12-12

申请人： Jin-woo Park

发明人： Jin-woo Park

IPC分类号： H01L25/065 ,  H01L23/00 ,  H01L23/31 ,  H01L23/48

CPC分类号： H01L25/0657 ,  H01L23/3107 ,  H01L23/481 ,  H01L23/562 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49113 ,  H01L2224/73207 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06558 ,  H01L2225/06562 ,  H01L2225/06565 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A semiconductor package includes a substrate; a first semiconductor chip disposed on a first surface of the substrate, the first semiconductor chip either the only semiconductor chip disposed on the first surface of the substrate or a bottom-most semiconductor chip formed on the first surface of the substrate; a plurality of external connection terminals disposed on a second surface of the substrate that is opposite to the first surface of the substrate; a stress buffer layer formed on the first surface of the substrate to vertically overlap at least one of the plurality of external connection members, wherein the stress buffer layer is formed on an edge part of the substrate and does not contact or vertically overlap the first semiconductor chip; and a sealing member covering the first chip and the stress buffer layer.

摘要翻译： 半导体封装包括基板; 设置在所述基板的第一表面上的第一半导体芯片，所述第一半导体芯片是设置在所述基板的第一表面上的唯一的半导体芯片或形成在所述基板的所述第一表面上的最底部的半导体芯片; 多个外部连接端子，设置在与基板的第一表面相对的基板的第二表面上; 应力缓冲层，形成在所述基板的所述第一表面上，以垂直重叠所述多个外部连接构件中的至少一个，其中所述应力缓冲层形成在所述基板的边缘部分上，并且不与所述第一半导体 芯片; 以及覆盖所述第一芯片和所述应力缓冲层的密封构件。

公开(公告)号：US20080224978A1

公开(公告)日：2008-09-18

申请号：US12035631

申请日：2008-02-22

申请人： Jin-woo Park

发明人： Jin-woo Park

IPC分类号： G09G3/36

CPC分类号： G09G3/3614 ,  G09G3/3659 ,  G09G2330/021

摘要： A liquid crystal display is capable of minimizing power consumption and providing an excellent image quality by having a varying array wire structure of the liquid crystal display so that the liquid crystal display can employ a low driving voltage and obtain advantages of a dot inversion drive system. Also, a driving method thereof is disclosed.

摘要翻译： 液晶显示器能够通过具有液晶显示器的变化的阵列线结构来最小化功耗并且提供优异的图像质量，使得液晶显示器可以采用低驱动电压并获得点反转驱动系统的优点。 此外，还公开了其驱动方法。

公开(公告)号：US06144149A

公开(公告)日：2000-11-07

申请号：US208993

申请日：1998-12-11

申请人： Hae-su Youn ,  Jin-woo Park

发明人： Hae-su Youn ,  Jin-woo Park

IPC分类号： H01J29/02 ,  H01J29/07

CPC分类号： H01J29/073 ,  H01J2229/0722 ,  H01J2229/0772

摘要： In a cathode ray tube, a shadow mask has a hole portion where a plurality of electron beam passing holes are formed and a skirt portion extending from the edge of the hole portion. A frame has a support portion to which the skirt portion of the shadow mask is fixed for supporting the shadow mask and a flange portion extending from the support portion. The support portion and the flange portion have a plurality of holes formed therein. An inner shield is supported by the frame.

摘要翻译： 在阴极射线管中，荫罩具有形成多个电子束通过孔的孔部分和从孔部分的边缘延伸的裙部。 框架具有支撑部分，荫罩的裙部固定到支撑部分，以及从支撑部分延伸的凸缘部分。 支撑部分和凸缘部分在其中形成有多个孔。 内框由框架支撑。

公开(公告)号：US09929022B2

公开(公告)日：2018-03-27

申请号：US15231880

申请日：2016-08-09

申请人： Seok-hyun Lee ,  Yun-seok Choi ,  Tae-je Cho ,  Jin-woo Park

发明人： Seok-hyun Lee ,  Yun-seok Choi ,  Tae-je Cho ,  Jin-woo Park

IPC分类号： H01L21/768 ,  H01L21/311 ,  H01L21/56 ,  H01L23/00 ,  H01L23/31 ,  H01L23/522 ,  H01L23/498 ,  H01L21/48 ,  H01L23/538

CPC分类号： H01L21/31144 ,  H01L21/4853 ,  H01L21/486 ,  H01L21/561 ,  H01L21/568 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/20 ,  H01L24/96 ,  H01L24/97 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/73267 ,  H01L2224/92244 ,  H01L2224/97 ,  H01L2225/1035 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/1815 ,  H01L2224/83

摘要： A method of manufacturing a semiconductor package includes: providing a package substrate having a first surface and a second surface opposite the first surface; providing a first semiconductor chip on the package substrate, the first semiconductor chip having a first surface facing the second surface of the package substrate, a second surface opposite the first surface of the first semiconductor chip, and lateral surfaces extending from the first surface of the first semiconductor chip to the second surface of the first semiconductor chip; providing a molding layer covering the lateral surfaces of the first semiconductor chip and covering the second surface of the package substrate; and providing a plurality of through-molding conductive vias outside the lateral surfaces of the first semiconductor chip. The through-molding conductive vias may be formed before forming the molding layer and may pass through the molding layer. The through-molding conductive vias may extend beyond a first surface of the molding layer.

公开(公告)号：US20170069532A1

公开(公告)日：2017-03-09

申请号：US15231880

申请日：2016-08-09

申请人： Seok-hyun Lee ,  Yun-seok Choi ,  Tae-je Cho ,  Jin-woo Park

发明人： Seok-hyun Lee ,  Yun-seok Choi ,  Tae-je Cho ,  Jin-woo Park

IPC分类号： H01L21/768 ,  H01L21/56 ,  H01L23/31 ,  H01L21/311 ,  H01L23/00 ,  H01L23/522

CPC分类号： H01L21/31144 ,  H01L21/4853 ,  H01L21/486 ,  H01L21/561 ,  H01L21/568 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/20 ,  H01L24/96 ,  H01L24/97 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/73267 ,  H01L2224/92244 ,  H01L2224/97 ,  H01L2225/1035 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/1815 ,  H01L2224/83

摘要： A method of manufacturing a semiconductor package includes: providing a package substrate having a first surface and a second surface opposite the first surface; providing a first semiconductor chip on the package substrate, the first semiconductor chip having a first surface facing the second surface of the package substrate, a second surface opposite the first surface of the first semiconductor chip, and lateral surfaces extending from the first surface of the first semiconductor chip to the second surface of the first semiconductor chip; providing a molding layer covering the lateral surfaces of the first semiconductor chip and covering the second surface of the package substrate; and providing a plurality of through-molding conductive vias outside the lateral surfaces of the first semiconductor chip. The through-molding conductive vias may be formed before forming the molding layer and may pass through the molding layer. The through-molding conductive vias may extend beyond a first surface of the molding layer.

摘要翻译： 制造半导体封装的方法包括：提供具有第一表面和与第一表面相对的第二表面的封装衬底; 在所述封装衬底上提供第一半导体芯片，所述第一半导体芯片具有面向所述封装衬底的第二表面的第一表面，与所述第一半导体芯片的第一表面相对的第二表面，以及从所述第一半导体芯片的第一表面延伸的侧表面 第一半导体芯片到第一半导体芯片的第二表面; 提供覆盖所述第一半导体芯片的侧表面并覆盖所述封装衬底的所述第二表面的成型层; 以及在所述第一半导体芯片的侧表面之外提供多个贯穿模制导电通孔。 可以在形成模制层之前形成贯穿模制导电通孔并且可以穿过模制层。 贯穿模制导电通孔可以延伸超过模制层的第一表面。

公开(公告)号：US07990487B2

公开(公告)日：2011-08-02

申请号：US11488238

申请日：2006-07-18

申请人： Taek-young Kim ,  Jin-woo Park

发明人： Taek-young Kim ,  Jin-woo Park

IPC分类号： G02F1/1333

CPC分类号： G02F1/133308 ,  G02F2001/133317

摘要： A liquid crystal display (“LCD”) having a maximum effective display area is provided by improving an assembling structure of the LCD. The LCD includes a liquid crystal display (LCD) panel assembly including a liquid crystal display (LCD) panel, a data driver transmitting a data driving signal to the LCD panel, and a gate driver transmitting a gate driving signal to the LCD panel, a mold frame having sidewalls and receiving the LCD panel assembly therein, the mold frame including a protruding portion protruding on top of at least one of the sidewalls, the protruding portion formed to be higher than the LCD panel assembly, and a front cover positioned outside the mold frame, a first bent portion of the front cover surrounding the protruding portion, and a distal end of the first bent portion contacting the LCD panel.

摘要翻译： 通过提高LCD的组装结构，提供具有最大有效显示面积的液晶显示器（“LCD”）。 LCD包括液晶显示器（LCD）面板组件，其包括液晶显示器（LCD）面板，向LCD面板发送数据驱动信号的数据驱动器和向LCD面板传送门驱动信号的栅极驱动器， 模具框架具有侧壁并且在其中接收LCD面板组件，所述模具框架包括突出部分，所述突出部分突出于至少一个侧壁的顶部，所述突出部分形成为高于所述LCD面板组件;以及前盖， 模具框架，前盖的围绕突出部分的第一弯曲部分和第一弯曲部分的远端接触LCD面板。

公开(公告)号：US20110018121A1

公开(公告)日：2011-01-27

申请号：US12805131

申请日：2010-07-14

申请人： Jinho Lee ,  Choongbin Yim ,  Jin-woo Park ,  Dae-young Choi ,  Mi-yeon Kim

发明人： Jinho Lee ,  Choongbin Yim ,  Jin-woo Park ,  Dae-young Choi ,  Mi-yeon Kim

IPC分类号： H01L23/52 ,  H01L23/48

CPC分类号： H01L21/76898 ,  H01L23/13 ,  H01L23/481 ,  H01L23/49822 ,  H01L23/49838 ,  H01L24/05 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0657 ,  H01L25/18 ,  H01L2224/02372 ,  H01L2224/0401 ,  H01L2224/05548 ,  H01L2224/0557 ,  H01L2224/13025 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/32014 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06527 ,  H01L2225/06541 ,  H01L2225/06572 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/01033 ,  H01L2924/014 ,  H01L2924/078 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/1515 ,  H01L2924/15153 ,  H01L2924/15159 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05552 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor package may include a substrate having first and second surfaces, the second surface including a recessed portion, a first semiconductor chip mounted on the first surface, a first ball land outside the recessed portion, a connection pad inside the recessed portion, a second chip in the recessed portion, the second semiconductor chip including a through via electrically connected to the connection pad, and a second ball land electrically connected to the through via. A semiconductor package may include a substrate having first and second surfaces, the second surface including a recessed portion, a first semiconductor chip mounted on the first surface, a first ball land outside the recessed portion, a connection pad inside the recessed portion, a second semiconductor chip in the recessed portion, the second chip including a through via electrically connected to the connection pad, and a second ball land electrically connected to the through via.

摘要翻译： 半导体封装可以包括具有第一表面和第二表面的基板，第二表面包括凹部，安装在第一表面上的第一半导体芯片，凹部外侧的第一球台面，凹部内的连接垫，第二表面 所述第二半导体芯片包括电连接到所述连接焊盘的通孔，以及电连接到所述通孔的第二焊盘。 半导体封装可以包括具有第一表面和第二表面的基板，第二表面包括凹部，安装在第一表面上的第一半导体芯片，凹部外侧的第一球台面，凹部内的连接垫，第二表面 半导体芯片，所述第二芯片包括电连接到所述连接焊盘的通孔，以及电连接到所述通孔的第二焊盘。

公开(公告)号：US20080258288A1

公开(公告)日：2008-10-23

申请号：US12148404

申请日：2008-04-18

申请人： Jin-woo Park ,  Cha-je Jo ,  Eun-chul Ahn ,  Tae-joo Hwang ,  Hae-jung Yu ,  Chan Park

发明人： Jin-woo Park ,  Cha-je Jo ,  Eun-chul Ahn ,  Tae-joo Hwang ,  Hae-jung Yu ,  Chan Park

IPC分类号： H01L23/48 ,  H01L21/50

CPC分类号： H01L24/73 ,  H01L24/12 ,  H01L24/16 ,  H01L24/32 ,  H01L25/0652 ,  H01L2224/0401 ,  H01L2224/0554 ,  H01L2224/05573 ,  H01L2224/056 ,  H01L2224/06134 ,  H01L2224/06136 ,  H01L2224/13025 ,  H01L2224/13099 ,  H01L2224/16227 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/73203 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/83194 ,  H01L2225/06517 ,  H01L2924/00014 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： In a semiconductor device stack package and a method of forming the same, the package comprises: a substrate; a plurality of lower chips stacked on the substrate and having an active surface oriented in a direction toward the substrate; and at least one upper chip disposed on the lower chips and connected to the substrate via a bump disposed between the lower chips. As no wire loops are formed, there is no increase in the height of the stack package, and the electrical path is shortened, thereby improving the electric performance of the stack package. Also, the semiconductor device stack package has a flip chip structure, and thus a plurality of semiconductor chips can be stacked in various manners.

摘要翻译： 在半导体器件堆叠封装及其形成方法中，封装包括：衬底; 堆叠在所述基板上并具有朝向所述基板的方向取向的有源面的多个下部芯片; 以及设置在下芯片上的至少一个上芯片，并且经由设置在下芯片之间的凸块连接到基板。 由于没有形成线环，堆叠封装的高度没有增加，并且电路被缩短，从而提高了堆叠封装的电性能。 此外，半导体器件堆叠封装具有倒装芯片结构，因此可以以各种方式堆叠多个半导体芯片。