公开(公告)号：US20160008930A1

公开(公告)日：2016-01-14

申请号：US14862607

申请日：2015-09-23

Applicant: TDK CORPORATION

Inventor： Tsutomu YASUI ,  Hisayuki ABE ,  Kenichi KAWABATA ,  Tomoko KITAMURA

IPC: B23K35/26 ,  B23K35/30 ,  B23K35/02 ,  C22C13/00 ,  C22C19/03

CPC classification number: H05K3/3463 ,  B23K35/0227 ,  B23K35/0244 ,  B23K35/025 ,  B23K35/262 ,  B23K35/3033 ,  C22C13/00 ,  C22C19/03 ,  H01L2224/16225 ,  H01L2924/19105 ,  H05K3/3484

Abstract: First solder is lead-free solder that contains no lead (Pb). The first solder includes a first metal that contains at least Sn; and a second metal that contains at least a Ni—Fe alloy.

Abstract translation: 第一焊料是不含铅（Pb）的无铅焊料。 第一焊料包括至少含有Sn的第一金属; 以及含有至少Ni-Fe合金的第二金属。

公开(公告)号：US20240008183A1

公开(公告)日：2024-01-04

申请号：US18037130

申请日：2021-11-15

Applicant: TDK CORPORATION

Inventor： Kiryu IKEBE ,  Tomohisa MITOSE ,  Akiko SEKI ,  Susumu TANIGUCHI ,  Hisayuki ABE

IPC: H05K1/14 ,  H05K3/34

CPC classification number: H05K1/144 ,  H05K3/3447 ,  H05K2201/10189 ,  H05K2201/042

Abstract: A mounting board includes: an electronic component including at least a pair of first terminals; and a circuit board including at least a pair of second terminals. The first terminals and the second terminals are electrically joined by a joining material containing a metal element, the electronic component and the joining material are disposed within a wall made of an insulator, a lower surface of the electronic component is lower than an upper surface of the wall, and when long sides of a region surrounded by the wall have a dimension d1 and long sides of the electronic component have a dimension d2, a value of (dimension d1−dimension d2) is 10 μm or less.

公开(公告)号：US20210087692A1

公开(公告)日：2021-03-25

申请号：US17111040

申请日：2020-12-03

Applicant: TDK CORPORATION

Inventor： Makoto ORIKASA ,  Yuhei HORIKAWA ,  Yoshihiro KANBAYASHI ,  Hisayuki ABE

IPC: C23C18/16 ,  C23C18/32 ,  C23C18/38 ,  B32B27/08 ,  B32B27/36 ,  B32B15/09 ,  B32B15/20 ,  B32B3/30 ,  H01L23/52 ,  H01L27/15 ,  B32B27/18 ,  C23C18/30

Abstract: A sheet material includes a resin layer containing a binder and catalyst particles, an electroless plating film on the side of one main surface of the resin layer and including first electroless plating films and a second electroless plating film, and a base material on the side of the other main surface of the resin layer.

公开(公告)号：US20190032221A1

公开(公告)日：2019-01-31

申请号：US16046422

申请日：2018-07-26

Applicant: TDK CORPORATION ,  ACHILLES CORPORATION

Inventor： Makoto ORIKASA ,  Yuhei HORIKAWA ,  Yoshihiro KANBAYASHI ,  Hisayuki ABE ,  Hiroki ASHIZAWA ,  Miho MORI ,  Misaki TAMURA

IPC: C23C18/31 ,  H05K3/18 ,  H05K3/06 ,  H05K1/03 ,  C23C18/16

Abstract: A sheet material includes a resin layer containing a binder and polypyrrole particles, an electroless plating film provided on the side of one main surface of the resin layer and including first electroless plating films and a second electroless plating film, and a transparent base material provided on the side of the other main surface of the resin layer.

公开(公告)号：US20140054770A1

公开(公告)日：2014-02-27

申请号：US13960330

申请日：2013-08-06

Applicant: TDK CORPORATION

Inventor： Kenichi YOSHIDA ,  Makoto ORIKASA ,  Hideyuki SEIKE ,  Yuhei HORIKAWA ,  Hisayuki ABE

IPC: H01L23/00

CPC classification number: H01L24/13 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L2224/03462 ,  H01L2224/0347 ,  H01L2224/0401 ,  H01L2224/05022 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05571 ,  H01L2224/05655 ,  H01L2224/11462 ,  H01L2224/11464 ,  H01L2224/1147 ,  H01L2224/11849 ,  H01L2224/13006 ,  H01L2224/13017 ,  H01L2224/13022 ,  H01L2224/13076 ,  H01L2224/13111 ,  H01L2924/00014 ,  H01L2224/05572 ,  H01L2924/00015 ,  H01L2924/00012 ,  H01L2224/05552

Abstract: A preferred terminal structure comprises a base material; an electrode formed on the base material; an insulating covering layer formed on the base material and on the electrode and having an opening exposing at least part of the electrode; an under bump metal layer containing Ni, formed in a region in the opening on the electrode so that an upper surface of the metal layer is at a position lower than an upper surface of the insulating covering layer in a peripheral edge portion of the opening; and a dome-shaped bump containing Sn and Ti, formed in a region in the opening on the under bump metal layer, wherein an end portion of a boundary between the under bump metal layer and the bump is in contact with an inner wall of the opening portion in the insulating covering layer.

Abstract translation: 优选的端子结构包括基材; 形成在基材上的电极; 绝缘覆盖层，形成在所述基底材料上和所述电极上，并且具有暴露所述电极的至少一部分的开口; 在所述电极的开口部的区域形成含有Ni的下凸块金属层，使得所述金属层的上表面位于比所述开口的周缘部的所述绝缘覆盖层的上表面低的位置; 以及形成在下凸块金属层的开口部的区域中的包含Sn和Ti的圆顶状的凸部，其中，下凸块状金属层与凸块之间的边界的端部与内凸块 绝缘覆盖层的开口部。

公开(公告)号：US20140054767A1

公开(公告)日：2014-02-27

申请号：US13960173

申请日：2013-08-06

Applicant: TDK CORPORATION

Inventor： Kenichi YOSHIDA ,  Makoto ORIKASA ,  Hideyuki SEIKE ,  Yuhei HORIKAWA ,  Hisayuki ABE

IPC: H01L23/00

CPC classification number: H01L24/13 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L2224/0345 ,  H01L2224/03462 ,  H01L2224/03464 ,  H01L2224/0347 ,  H01L2224/0401 ,  H01L2224/05022 ,  H01L2224/05572 ,  H01L2224/05655 ,  H01L2224/11464 ,  H01L2224/1147 ,  H01L2224/11849 ,  H01L2224/13005 ,  H01L2224/13006 ,  H01L2224/13023 ,  H01L2224/13111 ,  H01L2924/00014 ,  H01L2224/05552

Abstract: The present invention relates to a terminal structure comprising; a base material 10; an external electrode 20 formed on the base material; an insulating coating layer 30 formed on the base material and on the electrode and having an opening exposing at least part of the electrode; an under-bump metal layer 70 filling the opening and covering part of the insulating coating layer; and a dome-shaped bump 85 covering the under-bump metal layer, wherein in a cross section along a lamination direction, the under-bump metal layer has a convex shape toward the bump, and the thickness Tu0 of the under-bump metal layer at a center of the opening is equal to or greater than the thickness Tu1 of the under-bump metal layer at an end portion of the opening.

Abstract translation: 本发明涉及一种终端结构，包括： 基材10; 形成在基材上的外部电极20; 绝缘涂层30，形成在基材和电极上，并具有露出电极的至少一部分的开口; 填充绝缘涂层的开口和覆盖部分的凸块下金属层70; 以及覆盖凸块下金属层的圆顶状凸起85，其中沿着层叠方向的截面中，凸块下金属层朝向凸块呈凸形，凸块下金属层的厚度Tu0 在开口的中心处等于或大于开口端部处的凸块下金属层的厚度Tu1。

公开(公告)号：US20210265256A1

公开(公告)日：2021-08-26

申请号：US17314187

申请日：2021-05-07

Applicant: TDK CORPORATION

Inventor： Takashi DAITOKU ,  Susumu TANIGUCHI ,  Akiko SEKI ,  Atsushi SATO ,  Yuhei HORIKAWA ,  Makoto ORIKASA ,  Hisayuki ABE

IPC: H01L23/498 ,  H01L33/62 ,  H05K1/09 ,  H01L21/48 ,  H05K3/40 ,  G06F3/044

Abstract: An electroconductive substrate, including: a base material; a foundation layer disposed on the base material; a trench formation layer disposed on the foundation layer, and an electroconductive pattern layer including metal plating. A trench including a bottom surface to which the foundation layer is exposed, is formed. The trench is filled with the electroconductive pattern layer. The foundation layer includes a mixed region which is formed from a surface of the foundation layer on the electroconductive pattern layer side towards the inside thereof, and contains metal particles which contain a metal configuring the electroconductive pattern layer, and enter the foundation layer.

公开(公告)号：US20190043736A1

公开(公告)日：2019-02-07

申请号：US16038711

申请日：2018-07-18

Applicant: TDK CORPORATION

Inventor： Takashi DAITOKU ,  Susumu TANIGUCHI ,  Akiko SEKI ,  Atsushi SATO ,  Yuhei HORIKAWA ,  Makoto ORIKASA ,  Hisayuki ABE

IPC: H01L21/48 ,  H01L33/62 ,  H01L25/075

Abstract: A method of producing an electroconductive substrate including a base material, and an electroconductive pattern disposed on one main surface side of the base material includes: a step of forming a trench including a bottom surface to which a foundation layer is exposed, and a lateral surface which includes a surface of a trench formation layer, according to an imprint method; and a step of forming an electroconductive pattern layer by growing metal plating from the foundation layer which is exposed to the bottom surface of the trench.

公开(公告)号：US20180114759A1

公开(公告)日：2018-04-26

申请号：US15791888

申请日：2017-10-24

Applicant: TDK Corporation

Inventor： Makoto ORIKASA ,  Yuhei HORIKAWA ,  Hisayuki ABE ,  Yoshihiro KANBAYASHI

IPC: H01L23/552 ,  H01L23/31 ,  H01L21/56 ,  H01L21/3205

CPC classification number: H01L23/552 ,  H01L21/288 ,  H01L21/32051 ,  H01L21/565 ,  H01L23/3121 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48106 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2224/45099 ,  H01L2924/00012 ,  H01L2224/29099 ,  H01L2924/00

Abstract: Disclosed herein is an electronic component module that includes, an electronic component, a mold resin that seals the electronic component, a conductive film that covers the mold resin, and a protective film that covers the conductive film. The protective film includes a protective layer and a low reflective layer, and the low reflective layer is free from contacting the conductive film.

公开(公告)号：US20170130337A1

公开(公告)日：2017-05-11

申请号：US15415493

申请日：2017-01-25

Applicant: TDK CORPORATION

Inventor： Kenichi YOSHIDA ,  Yuhei HORIKAWA ,  Atsushi SATO ,  Hisayuki ABE

IPC: C23C18/16 ,  H01L23/00 ,  C23C18/54 ,  C23C28/02 ,  C23C18/42

CPC classification number: C23C18/1655 ,  C23C18/1637 ,  C23C18/1651 ,  C23C18/32 ,  C23C18/42 ,  C23C18/54 ,  C23C28/02 ,  H01L24/03 ,  H01L24/05 ,  H01L2224/03464 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05083 ,  H01L2224/05139 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05164 ,  H01L2224/05644 ,  H01L2924/01015 ,  H01L2924/14 ,  H01L2924/00

Abstract: A method of providing a coating on a conductor. The coating has a first layer containing palladium and a second layer containing gold from the conductor side. The first layer has an inner layer on the conductor side and an outer layer arranged nearer to the second layer than the inner layer, and the outer layer has a higher phosphorus concentration than the inner layer.