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1.发明授权
公开(公告)号：US5301078A
公开(公告)日：1994-04-05
申请号：US713994
申请日：1991-06-12
申请人： Toshiaki Makino , Marutomo Goto , Hideyuki Kimura , Takashi Yamaguchi , Hiromu Hirai , Takashi Kono , Ryoji Okada , Toshihiro Yamada , Yasuhiro Yoshimura , Hideaki Amano , Akio Takatsuka , Toshio Matsushita , Satoru Yamaura , Yuichi Koizumi
发明人： Toshiaki Makino , Marutomo Goto , Hideyuki Kimura , Takashi Yamaguchi , Hiromu Hirai , Takashi Kono , Ryoji Okada , Toshihiro Yamada , Yasuhiro Yoshimura , Hideaki Amano , Akio Takatsuka , Toshio Matsushita , Satoru Yamaura , Yuichi Koizumi
CPC分类号： G11B5/4813
摘要： A magnetic disk unit comprising a one-piece carriage structure having a small thermal off-tracking amount, with the carriage structure including a rotary shaft; guide arms integrally supported on a guide-arm retainer at their proximal ends and extending independently and parallely; bearing retainers formed on both ends of the guide-arm retainer; and bearings fixed on the bearing retainers rotatably connecting the guide-arm retainer to the rotary shaft. A center line in a direction of thickness of the outermost guide arm is located outside of that of the bearing in a direction of height thereof, and a concave portion is continuously formed on the bearing retainer. Thermal coefficients of expansion of the guide arms and the guide-arm retainer are substantially equal, with the carriage structure being fashioned of an alloy mainly containing Al and Si, eutectic crystal Si particles in the guide arm and/or the guide-arm retainer. The average value of the longest eutectic crystal Si particles therein is 1.6 .mu.m or less or the number of the eutectic crystal Si particles if 5.0 or more per 100 .mu.m.sup.2. In the carriage of manufacturing the carriage of the carriage structure is heated for five to fifteen hours at a temperature of 300.degree. to 500.degree. C. after die casting.
摘要翻译： 一种磁盘单元，包括具有小的热跟踪量小的单件托架结构，其中托架结构包括旋转轴; 引导臂在其近端处一体地支撑在引导臂保持器上并且独立且平行地延伸; 形成在引导臂保持器的两端的轴承保持器; 和固定在轴承保持器上的轴承，其将导向臂保持件可旋转地连接到旋转轴。 最外侧引导臂的厚度方向的中心线位于轴承的高度方向的外侧，在轴承保持架上连续地形成有凹部。 引导臂和引导臂保持器的热膨胀系数基本相等，托架结构由主要包含Al和Si的合金，共晶晶体Si颗粒在引导臂和/或引导臂保持器中形成。 其中最长的共晶晶体Si颗粒的平均值为1.6（my）m或更小，如果每100（m 2）m 2为5.0或更多，则共晶晶体Si颗粒的数量。 在制造的托架中，在铸造后，在300度至500度的温度下加热托架结构的托架5至15小时。
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公开(公告)号：US20130172750A1
公开(公告)日：2013-07-04
申请号：US13817541
申请日：2011-08-19
申请人： Yasuhiro Yoshimura , Tatsuya Nagata , Akifumi Sako
发明人： Yasuhiro Yoshimura , Tatsuya Nagata , Akifumi Sako
CPC分类号： A61B8/4494 , A61B8/0883 , A61B8/0891 , A61B8/14 , A61B8/4444 , B06B1/0292 , G01N29/2456 , G10K11/002
摘要： In order to obtain a high-resolution ultrasound diagnostic image while reducing the back side reflection of a ultrasound irradiated to the side opposite to the ultrasound transmission direction of an ultrasound transmission/reception device, disclosed is an ultrasound probe, wherein a substrate is provided thereon with a cavity, insulation layers having the cavity therebetween, and an upper layer electrode and a lower layer electrode having the cavity and the insulation layers therebetween, so as to form an ultrasound vibration element, the substrate is held by a backing with a low-modulus member therebetween, and a direct voltage and a alternating voltage are applied between the electrodes to vibrate the ultrasound vibration element, and wherein a mechanical impedance by the substrate and the low-modulus member has a substantially equal value as an acoustic impedance of the backing.
摘要翻译： 为了获得高分辨率超声波诊断图像，同时减少了照射到与超声波发送/接收装置的超声波发送方向相反的一侧的超声波的背面反射，公开了一种超声波探头，其中在其上设置有基板 具有空腔，其间具有空腔的绝缘层，以及具有所述空腔和所述绝缘层之间的上层电极和下层电极，以形成超声波振动元件，所述基板由背衬保持， 模数构件之间，并且在电极之间施加直流电压和交流电压以振动超声波振动元件，并且其中由衬底和低模量构件的机械阻抗具有与背衬的声阻抗基本相等的值 。
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公开(公告)号：US07291929B2
公开(公告)日：2007-11-06
申请号：US11329600
申请日：2006-01-10
IPC分类号： H01L23/48
CPC分类号： H01L25/0657 , H01L23/481 , H01L24/05 , H01L24/13 , H01L24/16 , H01L24/81 , H01L24/97 , H01L2224/16145 , H01L2224/16237 , H01L2224/81191 , H01L2224/81385 , H01L2224/81898 , H01L2224/97 , H01L2225/06513 , H01L2225/06527 , H01L2225/06541 , H01L2225/06572 , H01L2225/06593 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01079 , H01L2924/12041 , H01L2924/14 , H01L2924/15311 , H01L2924/18161 , H01L2924/19041 , H01L2924/30105 , H01L2924/30107 , H01L2924/3011 , H01L2224/81
摘要： A connection method is disclosed for a high-performance semiconductor system. The connection method enables high-speed operation with low noise, so as to obtain reliable and excellent connection in a short TAT at low costs. Semiconductor chips and the interposer chips are polished by grinding at their rear surfaces, holes are formed at rear surface positions corresponding to external electrode parts on the device side (front surface side) so that the holes extend to front surface electrodes, and metal plating films are applied to the side walls of the holes and rear surface side. Metal bumps of another semiconductor chip laminated at an upper stage being press-fitted into the holes applied with the metal plating films through deformation and being geometrically calked in the through holes formed in the semiconductor chip so as to electrically connected thereto.
摘要翻译： 公开了一种用于高性能半导体系统的连接方法。 连接方式能够实现低噪音的高速运行，从而在短时间内以低成本获得可靠且良好的连接。 半导体芯片和内插器芯片在其后表面被研磨抛光，在与设备侧（前表面侧）上的外部电极部分对应的后表面位置处形成孔，使得孔延伸到前表面电极，并且金属镀膜 被施加到孔的侧壁和后表面侧。 在上层层叠的另一半导体芯片的金属凸块通过变形被压配合到施加有金属镀膜的孔中，并且几何地被卡在形成在半导体芯片中的通孔中以与其电连接。
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4.发明授权公开(公告)号：US07268326B2
公开(公告)日：2007-09-11
申请号：US11254835
申请日：2005-10-21
CPC分类号： G03G15/2003 , H05B6/145
摘要： An electromagnetic induction heating apparatus capable of uniformize a temperature distribution in a longitudinal direction of an induction heating member includes: an exciting coil (magnetic flux generation means); a fixation roller (induction heating member) for generating heat by electromagnetic induction heating by action of magnetic flux generated by the exciting coil the induction heating member heating a material to be heated through heat generation thereof by introducing the material to be heated into a heating portion and conveying the material to be heated in contact with the fixation roller; and magnetic flux shielding plate (magnetic flux adjusting means) for changing a distribution of a density of an effective magnetic flux which is the magnetic flux generated by the exciting coil and actable on the fixation roller, in a longitudinal direction of the heating portion perpendicular to a conveyance direction of the material to be heated. The magnetic flux shielding plate adjusts the effective magnetic flux so that the effective magnetic flux at a central portion of the fixation roller in the longitudinal direction of the heating portion is less than that at an end portion of the induction heating member in the longitudinal direction.
摘要翻译： 能够使感应加热部件的长度方向的温度分布均匀化的电磁感应加热装置具备：励磁线圈（磁通产生装置）; 用于通过由励磁线圈产生的磁通量的作用的电磁感应加热产生热量的定影辊（感应加热部件），感应加热部件通过将待加热材料引入加热部分而通过其发热加热被加热材料 并输送与定影辊接触的待加热材料; 和磁通屏蔽板（磁通量调节装置），用于改变作为激励线圈产生的磁通的有效磁通密度的分布，并且能够在垂直于加热部分的加热部分的纵向方向上对定影辊施加作用 待加热材料的输送方向。 磁通屏蔽板调节有效磁通，使得定影辊在加热部分的纵向上的中心部分处的有效磁通量小于感应加热部件在纵向方向上的端部处的有效磁通量。
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公开(公告)号：US20060086724A1
公开(公告)日：2006-04-27
申请号：US11254835
申请日：2005-10-21
IPC分类号： H05B6/14
CPC分类号： G03G15/2003 , H05B6/145
摘要： An electromagnetic induction heating apparatus capable of uniformize a temperature distribution in a longitudinal direction of an induction heating member includes: an exciting coil (magnetic flux generation means); a fixation roller (induction heating member) for generating heat by electromagnetic induction heating by action of magnetic flux generated by the exciting coil the induction heating member heating a material to be heated through heat generation thereof by introducing the material to be heated into a heating portion and conveying the material to be heated in contact with the fixation roller; and magnetic flux shielding plate (magnetic flux adjusting means) for changing a distribution of a density of an effective magnetic flux which is the magnetic flux generated by the exciting coil and actable on the fixation roller, in a longitudinal direction of the heating portion perpendicular to a conveyance direction of the material to be heated. The magnetic flux shielding plate adjusts the effective magnetic flux so that the effective magnetic flux at a central portion of the fixation roller in the longitudinal direction of the heating portion is less than that at an end portion of the induction heating member in the longitudinal direction.
摘要翻译： 能够使感应加热部件的长度方向的温度分布均匀化的电磁感应加热装置具备：励磁线圈（磁通产生装置）; 用于通过由励磁线圈产生的磁通量的作用的电磁感应加热产生热量的定影辊（感应加热部件），感应加热部件通过将待加热材料引入加热部分而通过其发热加热被加热材料 并输送与定影辊接触的待加热材料; 和磁通屏蔽板（磁通量调节装置），用于改变作为激励线圈产生的磁通的有效磁通密度的分布，并且能够在垂直于加热部分的加热部分的纵向方向上对定影辊施加作用 待加热材料的输送方向。 磁通屏蔽板调节有效磁通，使得定影辊在加热部分的纵向上的中心部分处的有效磁通量小于感应加热部件在纵向方向上的端部处的有效磁通量。
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公开(公告)号：US06197255B1
公开(公告)日：2001-03-06
申请号：US09398046
申请日：1999-09-17
申请人： Ryo Miyake , Yoshihiro Nagaoka , Akira Koide , Naruo Watanabe , Yasuhiko Sasaki , Hajime Kato , Takao Terayama , Hiroshi Mitsumaki , Hiroyasu Uchida , Takeshi Shibuya , Yasuhiro Yoshimura
发明人： Ryo Miyake , Yoshihiro Nagaoka , Akira Koide , Naruo Watanabe , Yasuhiko Sasaki , Hajime Kato , Takao Terayama , Hiroshi Mitsumaki , Hiroyasu Uchida , Takeshi Shibuya , Yasuhiro Yoshimura
IPC分类号： G01N3502
CPC分类号： G01N35/00663 , B01F11/0283 , G01N35/025 , G01N2035/00673 , Y10T436/11 , Y10T436/113332 , Y10T436/114998 , Y10T436/119163 , Y10T436/2575
摘要： A chemical analyzing apparatus comprises a reaction cell holder which holds a plurality of reaction cells that are supplied with samples and reagents at a predetermined position, a measurer for measuring characteristics of the sample, a plurality of reagent containers, a liquid deliverer provided below each of the plurality of reagent containers, one or more sound wave generators provided outside the reaction cells, and storage containers for storing cleansing liquid with different contamination states. The cleansing liquid with different contamination states is reused according to the contamination levels of the reaction cells.
摘要翻译： 化学分析装置包括：反应池保持器，其保持在预定位置处供给样品和试剂的多个反应池，用于测量样品特性的测量器，多个试剂容器，下方设置的液体输送器 多个试剂容器，设置在反应室外的一个或多个声波发生器和用于存储具有不同污染状态的清洁液的储存容器。 具有不同污染状态的清洁液体根据反应池的污染水平重新使用。
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公开(公告)号：US09402598B2
公开(公告)日：2016-08-02
申请号：US13817541
申请日：2011-08-19
申请人： Yasuhiro Yoshimura , Tatsuya Nagata , Akifumi Sako
发明人： Yasuhiro Yoshimura , Tatsuya Nagata , Akifumi Sako
CPC分类号： A61B8/4494 , A61B8/0883 , A61B8/0891 , A61B8/14 , A61B8/4444 , B06B1/0292 , G01N29/2456 , G10K11/002
摘要： In order to obtain a high-resolution ultrasound diagnostic image while reducing the back side reflection of a ultrasound irradiated to the side opposite to the ultrasound transmission direction of an ultrasound transmission/reception device, disclosed is an ultrasound probe, wherein a substrate is provided thereon with a cavity, insulation layers having the cavity therebetween, and an upper layer electrode and a lower layer electrode having the cavity and the insulation layers therebetween, so as to form an ultrasound vibration element, the substrate is held by a backing with a low-modulus member therebetween, and a direct voltage and a alternating voltage are applied between the electrodes to vibrate the ultrasound vibration element, and wherein a mechanical impedance by the substrate and the low-modulus member has a substantially equal value as an acoustic impedance of the backing.
摘要翻译： 为了获得高分辨率超声波诊断图像，同时减少了照射到与超声波发送/接收装置的超声波发送方向相反的一侧的超声波的背面反射，公开了一种超声波探头，其中在其上设置有基板 具有空腔，其间具有空腔的绝缘层，以及具有所述空腔和所述绝缘层之间的上层电极和下层电极，以形成超声波振动元件，所述基板由背衬保持， 模数构件之间，并且在电极之间施加直流电压和交流电压以振动超声波振动元件，并且其中由衬底和低模量构件的机械阻抗具有与背衬的声阻抗基本相等的值 。
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公开(公告)号：US08979146B2
公开(公告)日：2015-03-17
申请号：US14365552
申请日：2012-07-05
CPC分类号： B60R19/18 , B60R19/03 , B60R19/24 , B60R19/30 , B60R2019/1813 , B60R2019/1833 , B60R2019/1873
摘要： A vehicle bumper beam including: a resin beam having an elongate body extending along a vehicle-width direction, two tubular shock-absorbing portions disposed at the beam body's opposite longitudinal end portions extending in front-rear direction, the beam body and shock-absorbing portions being formed with each other; a metal beam disposed outside the resin beam in the front-rear direction, fixedly fitted to the resin beam. Further, flat attachment portions, formed with inner end portions of the shock-absorbing portions in front-rear direction; bent portions bent in a crank extending from attachment portions outward in front-rear direction, the beam body being to attachment portions via bent portions, the metal beam fixedly fitted to an outer surface of the beam body's intermediate portion; metal beam's opposite end portions extending beyond bent portions covering the right and left sides, fixedly fitted to distal end portions; each space defined by shock-absorbing portion, metal beam and bent portion.
摘要翻译： 一种车辆保险杠梁，包括：具有沿着车宽方向延伸的细长主体的树脂梁，设置在梁主体相对的沿前后方向延伸的纵向端部的两个管状缓冲部分，梁体和减震 彼此形成的部分; 设置在树脂梁的前后方向外侧的金属梁，固定地配合到树脂梁上。 此外，在前后方向上形成有减震部的内端部的平坦的安装部， 弯曲部弯曲在从安装部向前后方向外侧延伸的曲柄中，梁主体通过弯曲部固定在安装部上，金属梁固定地配合到梁主体的中间部分的外表面; 金属梁的相对端部延伸超过覆盖左右侧的弯曲部分，固定地配合到远端部分; 每个空间由减震部分，金属梁和弯曲部分限定。
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公开(公告)号：US08106518B2
公开(公告)日：2012-01-31
申请号：US12640766
申请日：2009-12-17
IPC分类号： H01L23/48 , H01L23/52 , H01L29/40 , H01L21/4763
CPC分类号： H01L25/0657 , H01L21/6835 , H01L21/76898 , H01L23/481 , H01L23/5226 , H01L23/528 , H01L23/5386 , H01L24/11 , H01L24/12 , H01L24/13 , H01L24/16 , H01L24/27 , H01L24/81 , H01L24/94 , H01L25/074 , H01L25/50 , H01L2221/68372 , H01L2224/0401 , H01L2224/05557 , H01L2224/0557 , H01L2224/05572 , H01L2224/06181 , H01L2224/1147 , H01L2224/11472 , H01L2224/13009 , H01L2224/13012 , H01L2224/13013 , H01L2224/13014 , H01L2224/13021 , H01L2224/13022 , H01L2224/13025 , H01L2224/13099 , H01L2224/16058 , H01L2224/16112 , H01L2224/16146 , H01L2224/274 , H01L2224/81136 , H01L2224/81345 , H01L2224/81365 , H01L2224/81801 , H01L2224/81898 , H01L2225/06513 , H01L2225/06517 , H01L2225/06541 , H01L2924/00014 , H01L2924/0002 , H01L2924/01002 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01018 , H01L2924/01022 , H01L2924/01024 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/10253 , H01L2924/1205 , H01L2924/1306 , H01L2924/14 , H01L2924/1451 , H01L2924/19041 , H01L2924/30107 , H01L2924/35121 , H01L2924/00 , H01L2224/05552 , H01L2924/00012
摘要： In a semiconductor device in which a plurality of semiconductor chips are stacked, performance is enhanced without deteriorating productivity. The semiconductor device has a plurality of elements, an interlayer insulating film, a pad, and a bump electrode electrically connected with the pad sequentially formed on a main surface of a silicon substrate and has a back-surface electrode formed on a back surface of the silicon substrate and electrically connected with the bump electrode. The bump electrode has a protruding portion penetrating through the pad and protruding toward the silicon substrate side. The back-surface electrode is formed so as to reach the protruding portion of the bump electrode from the back surface side of the silicon substrate toward the main surface side and to cover the inside of a back-surface-electrode hole portion which does not reach the pad, so that the back-surface electrode is electrically connected with the bump electrode.
摘要翻译： 在层叠多个半导体芯片的半导体装置中，不会降低生产率而提高性能。 半导体器件具有多个元件，层间绝缘膜，焊盘和与依次形成在硅基板的主表面上的焊盘电连接的凸块电极，并且具有形成在硅衬底的背面上的背面电极 硅基板并与凸块电极电连接。 凸块电极具有贯穿焊盘并朝向硅衬底侧突出的突出部分。 背面电极形成为从硅衬底的背面侧朝向主面侧到达突起电极的突出部，并覆盖未到达的背面电极孔部的内部 垫，使得背面电极与凸块电极电连接。
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公开(公告)号：US20090014843A1
公开(公告)日：2009-01-15
申请号：US12133828
申请日：2008-06-05
IPC分类号： H01L23/52 , H01L21/60 , H01L21/4763
CPC分类号： H01L21/76898 , H01L21/6835 , H01L24/05 , H01L24/90 , H01L25/0657 , H01L25/50 , H01L2221/68372 , H01L2224/0401 , H01L2224/05025 , H01L2224/05553 , H01L2224/0557 , H01L2224/05572 , H01L2224/1134 , H01L2224/13025 , H01L2224/13099 , H01L2224/16147 , H01L2224/16237 , H01L2224/81141 , H01L2224/81191 , H01L2224/90 , H01L2225/06513 , H01L2225/06517 , H01L2225/06541 , H01L2924/00013 , H01L2924/0002 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01018 , H01L2924/01019 , H01L2924/01022 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/04941 , H01L2924/05042 , H01L2924/1306 , H01L2924/14 , H01L2924/30107 , H01L2924/00014 , H01L2924/00 , H01L2224/05552
摘要： A through silicon via reaching a pad from a second surface of a semiconductor substrate is formed. A penetration space in the through silicon via is formed of a first hole and a second hole with a diameter smaller than that of the first hole. The first hole is formed from the second surface of the semiconductor substrate to the middle of the interlayer insulating film. Further, the second hole reaching the pad from the bottom of the first hole is formed. Then, the interlayer insulating film formed on the first surface of the semiconductor substrate has a step shape reflecting a step difference between the bottom surface of the first hole and the first surface of the semiconductor substrate. More specifically, the thickness of the interlayer insulating film between the bottom surface of the first hole and the pad is smaller than that in other portions.
摘要翻译： 形成从半导体衬底的第二表面到达焊盘的通硅。 贯穿硅通孔中的穿透空间由直径小于第一孔直径的第一孔和第二孔形成。 第一孔由半导体衬底的第二表面到层间绝缘膜的中间形成。 此外，形成从第一孔的底部到达垫的第二孔。 然后，形成在半导体衬底的第一表面上的层间绝缘膜具有反映第一孔的底表面和半导体衬底的第一表面之间的台阶差的台阶形状。 更具体地说，第一孔的底表面和垫之间的层间绝缘膜的厚度小于其它部分的厚度。
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