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    Optical-electro circuit board
    1.
    发明授权
    Optical-electro circuit board 有权
    光电电路板

    公开(公告)号：US09581774B2

    公开(公告)日：2017-02-28

    申请号：US15164878

    申请日：2016-05-26

    Applicant: Unimicron Technology Corp.

    Inventor： Yin-Ju Chen ,  Cheng-Po Yu ,  Pei-Chang Huang

    IPC: G02B6/43 ,  G02B6/42 ,  H01L31/0232 ,  G02B6/12 ,  G02B6/32

    CPC classification number: G02B6/428 ,  G02B6/12004 ,  G02B6/32 ,  G02B6/4206 ,  G02B6/4244 ,  G02B6/4245 ,  G02B6/4274 ,  G02B6/43 ,  H01L31/0232 ,  H01L31/02327 ,  H01L31/167

    Abstract: An optical component including a multi-layer substrate, an optical waveguide element, and two optical-electro assemblies is provided. The multi-layer substrate includes a dielectric layer, two circuit layers, and two through holes passing through the dielectric layer. The optical waveguide element is located on the multi-layer substrate and between the through holes. The optical-electro assemblies are respectively inserted into the corresponding through holes and correspondingly located at two opposite ends of the optical waveguide element. One of the optical-electro assemblies transforms an electrical signal into a light beam and provides the light beam to the optical waveguide element, and the other one of the optical-electro assemblies receives the light beam transmitted from the optical waveguide element and transforms the light beam into another electrical signal. A manufacturing method of the optical component and an optical-electro circuit board having the optical component are also provided.

    Abstract translation: 提供了包括多层基板，光波导元件和两个光电组件的光学部件。 多层基板包括电介质层，两个电路层和穿过电介质层的两个通孔。 光波导元件位于多层基板上并且位于通孔之间。 光电组件分别插入对应的通孔中并相应地位于光波导元件的两个相对端。 光电组件中的一个将电信号转换成光束并将光束提供给光波导元件，另一个光电组件接收从光波导元件传输的光束并转换光 射入另一个电信号。 还提供了具有光学部件的光学部件的制造方法和光电路板。

    Vehicle door opening warning system and vehicle door opening warning method
    2.
    发明授权
    Vehicle door opening warning system and vehicle door opening warning method 有权
    车门开启警示系统及车门开启警示方式

    公开(公告)号：US09514629B2

    公开(公告)日：2016-12-06

    申请号：US14680075

    申请日：2015-04-07

    Applicant: Unimicron Technology Corp.

    Inventor： Yin-Ju Chen ,  Cheng-Po Yu

    IPC: B60Q1/26 ,  G08B21/24 ,  B60Q9/00 ,  G08G1/16

    CPC classification number: G08B21/24 ,  B60Q9/008 ,  G08G1/166

    Abstract: A vehicle door opening warning system including a control unit, a projection unit and a detection unit is provided. The control unit is disposed at a door of a vehicle. The projection unit is disposed at the door and is electrically coupled to the control unit. The detection unit is disposed outside of the vehicle and is electrically coupled to the control unit. When the detection unit detects a moving object existing within 5 to 30 meters of the vehicle, the detection unit produces a signal. The control unit receives the signal and controls the projection unit to project a warning message according to the signal. A vehicle door opening warning method is also provided.

    Abstract translation: 提供了包括控制单元，投影单元和检测单元的车门打开警告系统。 控制单元设置在车辆的门上。 投影单元设置在门上并且电耦合到控制单元。 检测单元设置在车辆外部并且电耦合到控制单元。 当检测单元检测到存在于车辆5至30米范围内的运动物体时，检测单元产生信号。 控制单元接收信号并根据信号控制投影单元投射警告消息。 还提供车门打开警告方法。

    CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF AND ELECTRO-OPTIC APPARATUS HAVING THE CIRCUIT BOARD
    4.
    发明申请
    CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF AND ELECTRO-OPTIC APPARATUS HAVING THE CIRCUIT BOARD 有权
    电路板及其制造方法及具有电路板的电光设备

    公开(公告)号：US20140119688A1

    公开(公告)日：2014-05-01

    申请号：US13776737

    申请日：2013-02-26

    Applicant: UNIMICRON TECHNOLOGY CORP.

    Inventor： Pei-Chang Huang ,  Wen-Fang Liu ,  Cheng-Po Yu

    IPC: G02B6/12 ,  H05K3/46

    CPC classification number: G02B6/12 ,  G02B6/4214 ,  G02B6/423 ,  G02B6/4232 ,  H05K1/0274 ,  H05K1/0298 ,  H05K3/4626 ,  H05K2201/0187 ,  H05K2201/10121 ,  Y10T29/49126

    Abstract: A circuit board, a manufacturing method thereof, and an electro-optic apparatus having the circuit board are provided. The circuit board includes a substrate including a first dielectric layer and a first circuit layer disposed thereon, a waveguide layer disposed on a portion of the substrate, a second dielectric layer, a convex structure and a second circuit layer. The second dielectric layer is disposed on the substrate and the waveguide layer. The second dielectric layer has an opening exposing the sidewall of the waveguide layer and a portion of the first circuit layer. The convex structure is disposed on the sidewall of the waveguide layer. The convex structure and the waveguide layer respectively have refractive index n1 and n2, and |n1-n21|n1

    Abstract translation: 提供一种电路板及其制造方法以及具有该电路板的电光装置。 电路板包括：基板，包括第一介电层和设置在其上的第一电路层;布置在基板的一部分上的波导层，第二介电层，凸结构和第二电路层。 第二介电层设置在基板和波导层上。 第二电介质层具有暴露波导层的侧壁和第一电路层的一部分的开口。 凸形结构设置在波导层的侧壁上。 凸形结构和波导层分别具有折射率n1和n2，| n1-n21 | n1 <1％。 凸结构的表面粗糙度小于波导层的侧壁的表面粗糙度。 第二电路层设置在第二电介质层上。

    Manufacturing method of circuit structure
    5.
    发明授权
    Manufacturing method of circuit structure 有权

    公开(公告)号：US10314179B2

    公开(公告)日：2019-06-04

    申请号：US16013956

    申请日：2018-06-21

    Applicant: Unimicron Technology Corp.

    Inventor： Hung-Lin Chang ,  Ming-Hao Wu ,  Syun-Siao Chang ,  Cheng-Po Yu ,  Chi-Min Chang

    IPC: H05K3/46

    Abstract: A manufacturing method of a circuit board structure is described as follows. An inner circuit structure including a core layer having an upper and an opposite lower surface, a first patterned circuit layer disposed on the upper surface and a second patterned circuit layer disposed on the lower surface is provided. An insulating material layer is formed on a portion of the first patterned circuit layer. A laser resisting layer is formed on at least a portion of the insulating material layer. A release layer is adhered to the laser resisting layer. A build-up process is performed so as to laminate a first and a second build-up circuit structures on the first and the second patterned circuit layers, respectively. A laser ablation process is performed on the first build-up circuit structure so as to form a cavity at least exposing a portion of the upper surface of the core layer.

    MANUFACTURING METHOD OF CIRCUIT STRUCTURE
    6.
    发明申请
    MANUFACTURING METHOD OF CIRCUIT STRUCTURE 审中-公开

    公开(公告)号：US20180302992A1

    公开(公告)日：2018-10-18

    申请号：US16013956

    申请日：2018-06-21

    Applicant: Unimicron Technology Corp.

    Inventor： Hung-Lin Chang ,  Ming-Hao Wu ,  Syun-Siao Chang ,  Cheng-Po Yu ,  Chi-Min Chang

    IPC: H05K3/46

    CPC classification number: H05K3/4697 ,  H05K3/4644

    Abstract: A manufacturing method of a circuit board structure is described as follows. An inner circuit structure including a core layer having an upper and an opposite lower surface, a first patterned circuit layer disposed on the upper surface and a second patterned circuit layer disposed on the lower surface is provided. An insulating material layer is formed on a portion of the first patterned circuit layer. A laser resisting layer is formed on at least a portion of the insulating material layer. A release layer is adhered to the laser resisting layer. A build-up process is performed so as to laminate a first and a second build-up circuit structures on the first and the second patterned circuit layers, respectively. A laser ablation process is performed on the first build-up circuit structure so as to form a cavity at least exposing a portion of the upper surface of the core layer.

    Circuit structure and manufacturing method thereof
    7.
    发明授权
    Circuit structure and manufacturing method thereof 有权

    公开(公告)号：US10051748B2

    公开(公告)日：2018-08-14

    申请号：US14997583

    申请日：2016-01-18

    Applicant: Unimicron Technology Corp.

    Inventor： Hung-Lin Chang ,  Ming-Hao Wu ,  Syun-Siao Chang ,  Cheng-Po Yu ,  Chi-Min Chang

    IPC: H05K1/09 ,  H05K3/46

    Abstract: A manufacturing method of a circuit board structure is described as follows. An inner circuit structure including a core layer having an upper and an opposite lower surface, a first patterned circuit layer disposed on the upper surface and a second patterned circuit layer disposed on the lower surface is provided. An insulating material layer is formed on a portion of the first patterned circuit layer. A laser resisting layer is formed on at least a portion of the insulating material layer. A release layer is adhered to the laser resisting layer. A build-up process is performed so as to laminate a first and a second build-up circuit structures on the first and the second patterned circuit layers, respectively. A laser ablation process is performed on the first build-up circuit structure so as to form a cavity at least exposing a portion of the upper surface of the core layer.

    Manufacturing method of optical component
    8.
    发明授权
    Manufacturing method of optical component 有权

    公开(公告)号：US09739963B2

    公开(公告)日：2017-08-22

    申请号：US15152569

    申请日：2016-05-12

    Applicant: Unimicron Technology Corp.

    Inventor： Yin-Ju Chen ,  Cheng-Po Yu ,  Pei-Chang Huang

    IPC: G02B6/43 ,  G02B6/42 ,  H01L31/0232 ,  G02B6/12 ,  G02B6/32

    CPC classification number: G02B6/428 ,  G02B6/12004 ,  G02B6/32 ,  G02B6/4206 ,  G02B6/4244 ,  G02B6/4245 ,  G02B6/4274 ,  G02B6/43 ,  H01L31/0232 ,  H01L31/02327 ,  H01L31/167

    Abstract: An optical component including a multi-layer substrate, an optical waveguide element, and two optical-electro assemblies is provided. The multi-layer substrate includes a dielectric layer, two circuit layers, and two through holes passing through the dielectric layer. The optical waveguide element is located on the multi-layer substrate and between the through holes. The optical-electro assemblies are respectively inserted into the corresponding through holes and correspondingly located at two opposite ends of the optical waveguide element. One of the optical-electro assemblies transforms an electrical signal into a light beam and provides the light beam to the optical waveguide element, and the other one of the optical-electro assemblies receives the light beam transmitted from the optical waveguide element and transforms the light beam into another electrical signal. A manufacturing method of the optical component and an optical-electro circuit board having the optical component are also provided.

    Circuit board and manufacturing method thereof and electro-optic apparatus having the circuit board
    10.
    发明授权
    Circuit board and manufacturing method thereof and electro-optic apparatus having the circuit board 有权
    电路板及其制造方法以及具有该电路板的电光装置

    公开(公告)号：US08979372B2

    公开(公告)日：2015-03-17

    申请号：US13776737

    申请日：2013-02-26

    Applicant: Unimicron Technology Corp.

    Inventor： Pei-Chang Huang ,  Wen-Fang Liu ,  Cheng-Po Yu

    IPC: G02B6/12 ,  H05K3/46

    CPC classification number: G02B6/12 ,  G02B6/4214 ,  G02B6/423 ,  G02B6/4232 ,  H05K1/0274 ,  H05K1/0298 ,  H05K3/4626 ,  H05K2201/0187 ,  H05K2201/10121 ,  Y10T29/49126

    Abstract: A circuit board, a manufacturing method thereof, and an electro-optic apparatus having the circuit board are provided. The circuit board includes a substrate including a first dielectric layer and a first circuit layer disposed thereon, a waveguide layer disposed on a portion of the substrate, a second dielectric layer, a convex structure and a second circuit layer. The second dielectric layer is disposed on the substrate and the waveguide layer. The second dielectric layer has an opening exposing the sidewall of the waveguide layer and a portion of the first circuit layer. The convex structure is disposed on the sidewall of the waveguide layer. The convex structure and the waveguide layer respectively have refractive index n1 and n2, and |n1−n2|/n1

    Abstract translation: 提供一种电路板及其制造方法以及具有该电路板的电光装置。 电路板包括：基板，包括第一介电层和设置在其上的第一电路层;布置在基板的一部分上的波导层，第二介电层，凸结构和第二电路层。 第二介电层设置在基板和波导层上。 第二电介质层具有暴露波导层的侧壁和第一电路层的一部分的开口。 凸形结构设置在波导层的侧壁上。 凸结构和波导层分别具有折射率n1和n2，| n1-n2 | / n1 <1％。 凸结构的表面粗糙度小于波导层的侧壁的表面粗糙度。 第二电路层设置在第二电介质层上。

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