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    Resistor component
    1.
    发明授权
    Resistor component 有权
    电阻元件

    公开(公告)号：US09373430B2

    公开(公告)日：2016-06-21

    申请号：US13893423

    申请日：2013-05-14

    Applicant: Viking Tech Corporation

    Inventor： Shih-Long Wei ,  Shen-Li Hsiao ,  Chien-Hung Ho

    IPC: H01C1/012 ,  H01C1/028 ,  H01C1/04 ,  H01C1/148 ,  H01C7/00

    CPC classification number: H01C1/028 ,  H01C1/04 ,  H01C1/148 ,  H01C7/003

    Abstract: A resistor component is provided, including a ceramic bar having a film applied thereon, a protection layer formed on the film in a middle portion of the ceramic bar, an end plating layer formed on the film at two ends of the ceramic bar, an insulation layer formed on the protection layer, and a color coded marking formed on the insulation layer that indicates the resistance of the resistor component. The end plating layer is formed by a barrel plating method and includes copper, tin, nickel and a combination thereof. The resistor component thus has a low cost and is manufactured by a simple process, simultaneously avoids the occurrence of pores or incompletely sealed join that may be caused by the prior method. Therefore the resistor component has high reliability.

    Abstract translation: 提供一种电阻器部件，包括其上涂覆有膜的陶瓷棒，在陶瓷棒的中间部分中形成在膜上的保护层，在陶瓷棒的两端形成在膜上的端电镀层，绝缘体 形成在保护层上的层，以及形成在绝缘层上的指示电阻器部件的电阻的颜色编码标记。 端镀层通过滚镀法形成，包括铜，锡，镍及其组合。 因此，电阻器部件成本低并且通过简单的工艺制造，同时避免了由现有方法引起的孔或不完全密封的连接的发生。 因此，电阻器组件具有高可靠性。

    Carrier and Package Having the Carrier
    2.
    发明申请
    Carrier and Package Having the Carrier 有权
    承运人和包裹承运人

    公开(公告)号：US20150305201A1

    公开(公告)日：2015-10-22

    申请号：US14461808

    申请日：2014-08-18

    Applicant: Viking Tech Corporation

    Inventor： Chien-Hung Ho ,  Chiu-Min Lee ,  Chen-Shen Kuo

    IPC: H05K7/20 ,  H01L23/34 ,  H01L23/14

    CPC classification number: H01L23/34 ,  H01L23/3677 ,  H01L23/3735 ,  H01L2924/0002 ,  H05K1/0204 ,  H05K1/0206 ,  H05K1/0306 ,  H01L2924/00

    Abstract: A carrier is disclosed, including: a main body having a first surface and a second surface opposing the first surface; a conductive part formed on the first surface of the main body; and a plurality of heat conductors that are not in contact with the conductive part and penetrate the main body to connect the first surface with the second surface. Therefore, heat generated by electronic elements can be effectively dissipated outside to improve the functionality and lifetime of electronic elements.

    Abstract translation: 公开了一种载体，包括：具有与第一表面相对的第一表面和第二表面的主体; 形成在主体的第一表面上的导电部分; 以及与导电部不接触并穿透主体以将第一表面与第二表面连接的多个热导体。 因此，电子元件产生的热可以有效地消散在外部，以改善电子元件的功能和寿命。

    Method of electroplating and depositing metal
    3.
    发明授权
    Method of electroplating and depositing metal 有权
    电镀和沉积金属的方法

    公开(公告)号：US09204555B2

    公开(公告)日：2015-12-01

    申请号：US13623480

    申请日：2012-09-20

    Applicant: Viking Tech Corporation

    Inventor： Shih-Long Wei ,  Shen-Li Hsiao ,  Chien-Hung Ho

    IPC: C25D5/02 ,  H05K3/10 ,  H05K3/24 ,  H05K3/40 ,  H05K3/42

    CPC classification number: H05K3/02 ,  H05K3/108 ,  H05K3/242 ,  H05K3/4053 ,  H05K3/42 ,  H05K2201/0338 ,  H05K2201/0347

    Abstract: A method of electroplating and depositing metal includes: providing an insulation substrate formed with conductive through holes; forming a first conductive layer on a first surface of the insulation substrate and forming a resist layer on a first portion of the first conductive layer, leaving a second portion of the first conductive layer uncovered by the resist layer as a to-be-plated area; disposing the insulation substrate in a first electroplating solution and depositing a first metal layer on the to-be-plated area; removing the resist layer and the portion of the first conductive layer; forming a second conductive layer on a second surface of the insulation substrate; forming a mask layer on the second conductive layer; disposing the insulation substrate in a second electroplating solution and depositing a second metal layer on the first metal layer of the to-be-plated area; and removing the mask layer and the second conductive layer.

    Abstract translation: 一种电镀和沉积金属的方法包括：提供形成有导电通孔的绝缘基板; 在所述绝缘基板的第一表面上形成第一导电层，并在所述第一导电层的第一部分上形成抗蚀剂层，留下未被所述抗蚀剂层覆盖的所述第一导电层的第二部分作为被镀覆区域 ; 将所述绝缘基板设置在第一电镀溶液中并在所述被镀区域上沉积第一金属层; 去除所述抗蚀剂层和所述第一导电层的所述部分; 在所述绝缘基板的第二表面上形成第二导电层; 在所述第二导电层上形成掩模层; 将所述绝缘基板设置在第二电镀液中，并在所述被镀区域的所述第一金属层上沉积第二金属层; 以及去除掩模层和第二导电层。

    Ceramic Substrate and Semiconductor Package Having the Same
    7.
    发明申请
    Ceramic Substrate and Semiconductor Package Having the Same 有权
    陶瓷基板和半导体封装相同

    公开(公告)号：US20150303362A1

    公开(公告)日：2015-10-22

    申请号：US14517781

    申请日：2014-10-17

    Applicant: Viking Tech Corporation

    Inventor： Chien-Hung Ho ,  Chiu-Min Lee ,  Chen-Shen Kuo

    IPC: H01L33/64 ,  H05K1/03 ,  H05K1/11 ,  H01L33/62

    CPC classification number: H01L33/642 ,  H01L24/73 ,  H01L33/641 ,  H01L33/647 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48237 ,  H01L2224/73257 ,  H01L2224/73265 ,  H05K1/0206 ,  H05K1/0306 ,  H05K1/113 ,  H05K2201/10106 ,  H01L2924/00014

    Abstract: A ceramic substrate is provided, including: a board having a first surface and a second surface opposing the first surface; first electrical contact pads disposed on the first surface; second electrical contact pads disposed on the second surface; conductive pillars disposed in the board and connecting the first surface and the second surface to electrically connect the electrical contact pad and the second electrical contact pad; a first heat conductive pad disposed on the first surface; a second heat conductive pad disposed on the second surface; and a heat conductive pillar disposed in the board and connecting the first surface and the second surface to contact and be coupled with the first heat conductive pad and the second heat conductive pad, wherein the heat conductive pillar has a width greater than or equal to widths of the conductive pillars and greater than or equal to 300 micrometers.

    Abstract translation: 提供一种陶瓷基板，包括：板，其具有与第一表面相对的第一表面和第二表面; 设置在第一表面上的第一电接触焊盘; 设置在第二表面上的第二电接触焊盘; 导电柱设置在所述板中并且连接所述第一表面和所述第二表面以电连接所述电接触焊盘和所述第二电接触焊盘; 设置在所述第一表面上的第一导热焊盘; 设置在所述第二表面上的第二导热焊盘; 以及设置在所述板中并且连接所述第一表面和所述第二表面以与所述第一导热焊盘和所述第二导热焊盘接触并耦合的导热柱，其中所述导热柱具有大于或等于宽度的宽度 的导电柱并且大于或等于300微米。

    Method of Forming Substrate
    8.
    发明申请
    Method of Forming Substrate 审中-公开
    基材成型方法

    公开(公告)号：US20140170848A1

    公开(公告)日：2014-06-19

    申请号：US14105344

    申请日：2013-12-13

    Applicant: Viking Tech Corporation

    Inventor： Shih-Long Wei ,  Shen-Li Hsiao ,  Chien-Hung Ho

    IPC: H01L33/62

    CPC classification number: H01L33/62 ,  H05K1/0203 ,  H05K2201/10106

    Abstract: A method of forming a substrate is provided, which includes steps of providing a metal plate having a first surface and a second surface; forming a plurality of recesses on the first surface of the metal plate by using laser cutting technique; filling the plurality of recesses with an insulating material; removing a part of the metal plate in a direction of from the second surface to the first surface, so that two ends of the insulating material are exposed, and a substrate body is formed by a conductor portion formed by the remaining part of the metal plate and an insulating portion formed by the insulating material; and forming a circuit layer on a first surface of the substrate body and a circuit layer on a second surface of the substrate body is provided. Thus, the two circuit layers are electrically connected by the conductor portion that also provides a heat dissipation path and are separated by the insulating portion.

    Abstract translation: 提供一种形成基板的方法，其包括提供具有第一表面和第二表面的金属板的步骤; 通过使用激光切割技术在金属板的第一表面上形成多个凹槽; 用绝缘材料填充多个凹部; 从金属板的第二表面到第一表面的方向去除金属板的一部分，使绝缘材料的两端露出，并且由金属板的剩余部分形成的导体部分形成基板主体 以及由绝缘材料形成的绝缘部分; 并且在所述基板主体的第一表面上形成电路层，并且在所述基板主体的第二表面上形成电路层。 因此，两个电路层通过也提供散热路径并由绝缘部分分隔的导体部分电连接。

    Resistor Component
    9.
    发明申请
    Resistor Component 有权
    电阻元件

    公开(公告)号：US20140167911A1

    公开(公告)日：2014-06-19

    申请号：US13893423

    申请日：2013-05-14

    Applicant: VIKING TECH CORPORATION

    Inventor： Shih-Long Wei ,  Shen-Li Hsiao ,  Chien-Hung Ho

    IPC: H01C7/00

    CPC classification number: H01C1/028 ,  H01C1/04 ,  H01C1/148 ,  H01C7/003

    Abstract: A resistor component is provided, including a ceramic bar having a film applied thereon, a protection layer formed on the film in a middle portion of the ceramic bar, an end plating layer formed on the film at two ends of the ceramic bar, an insulation layer formed on the protection layer, and a color coded marking formed on the insulation layer that indicates the resistance of the resistor component. The end plating layer is formed by a barrel plating method and includes copper, tin, nickel and a combination thereof. The resistor component thus has a low cost and is manufactured by a simple process, simultaneously avoids the occurrence of pores or incompletely sealed join that may be caused by the prior method. Therefore the resistor component has high reliability.

    Abstract translation: 提供一种电阻器部件，包括其上涂覆有膜的陶瓷棒，在陶瓷棒的中间部分中形成在膜上的保护层，在陶瓷棒的两端形成在膜上的端电镀层，绝缘体 形成在保护层上的层，以及形成在绝缘层上的指示电阻器部件的电阻的颜色编码标记。 端镀层通过滚镀法形成，包括铜，锡，镍及其组合。 因此，电阻器部件成本低并且通过简单的工艺制造，同时避免了由现有方法引起的孔或不完全密封的连接的发生。 因此，电阻器组件具有高可靠性。

    Method of Fabricating a Light Emitting Diode Packaging Structure
    10.
    发明申请
    Method of Fabricating a Light Emitting Diode Packaging Structure 审中-公开
    制造发光二极管封装结构的方法

    公开(公告)号：US20140027051A1

    公开(公告)日：2014-01-30

    申请号：US14045889

    申请日：2013-10-04

    Applicant: Viking Tech Corporation

    Inventor： Shih-Long Wei ,  Shen-Li Hsiao ,  Chien-Hung Ho

    IPC: H01L33/00

    CPC classification number: H01L33/005 ,  H01L33/486 ,  H01L33/60 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/01322 ,  H01L2933/0033 ,  Y10T156/10 ,  Y10T156/1056 ,  Y10T156/1064 ,  H01L2924/00014 ,  H01L2924/00

    Abstract: A method of fabricating a light emitting diode packaging structure provides a metallized ceramic heat dissipation substrate and a reflector layer, and a metallized ceramic heat dissipation substrate which is bonded with the reflector layer through an adhesive. The reflector layer has an opening for a surface of the metallized ceramic heat dissipation substrate to be exposed therefrom. The reflector layer may be formed with ceramic or polymer plastic material, to enhance the refractory property and the reliability of the package structure. In addition, the packaging structure may make use of existing packaging machine for subsequent electronic component packaging, without increasing the fabrication cost.

    Abstract translation: 制造发光二极管封装结构的方法提供金属化陶瓷散热基板和反射层，以及金属化陶瓷散热基板，其通过粘合剂与反射层接合。 反射层具有用于使金属化陶瓷散热基板的表面露出的开口。 反射层可以由陶瓷或聚合物塑料材料形成，以提高耐火性能和封装结构的可靠性。 此外，包装结构可以利用现有的包装机用于随后的电子部件包装，而不增加制造成本。

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