公开(公告)号：US07074704B2

公开(公告)日：2006-07-11

申请号：US10860536

申请日：2004-06-02

Applicant: Yong-hwan Kwon ,  Sa-yoon Kang

Inventor： Yong-hwan Kwon ,  Sa-yoon Kang

IPC: H01L21/44 ,  H01L23/52

CPC classification number: H01L24/10 ,  H01L24/13 ,  H01L2224/05155 ,  H01L2224/05567 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/05644 ,  H01L2224/10126 ,  H01L2224/13 ,  H01L2224/13016 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/13144 ,  H01L2224/13155 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/81903 ,  H01L2224/83192 ,  H01L2224/83851 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/19042 ,  H01L2924/00014 ,  H01L2224/29099 ,  H01L2924/00

Abstract: A bump of a semiconductor chip comprises a plurality of bond pads formed on a semiconductor chip, a conductive bump formed on the bond pads; and a sidewall insulating layer formed on sidewalls of the conductive bump. It is possible for the semiconductor chip to prevent electrical shorts and improve productivity even though a pitch of bond pad is decreased.

公开(公告)号：US07902647B2

公开(公告)日：2011-03-08

申请号：US12627361

申请日：2009-11-30

Applicant: Ye-chung Chung ,  Sa-yoon Kang

Inventor： Ye-chung Chung ,  Sa-yoon Kang

IPC: H01L23/495

CPC classification number: H01L23/4985 ,  G02F1/13452 ,  H01L23/3157 ,  H01L24/48 ,  H01L2224/16 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/73204 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/15151 ,  H01L2924/181 ,  H05K3/281 ,  H05K3/361 ,  H05K2201/09154 ,  H05K2201/09727 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00012 ,  H01L2224/0401

Abstract: A device is provided in which a glass panel having beveled edge is flexibly connected to a TAB package. The outer lead portions of the TAB package include an end portion of first width connected to a connection pattern on the glass panel, a terminal portion having a second width greater than the first width, and a transition portion having a width that varies between the first and second widths. When the TAB package is connected the transition portion of the respective outer lead portions are disposed over the beveled edge of the glass panel.

Abstract translation: 提供了一种装置，其中具有斜边的玻璃面板与TAB封装灵活地连接。 TAB封装的外引线部分包括连接到玻璃面板上的连接图案的第一宽度的端部，具有大于第一宽度的第二宽度的端子部分和具有在第一宽度之间变化的宽度的过渡部分 和第二宽度。 当连接TAB封装时，相应的外引线部分的过渡部分设置在玻璃面板的斜边上。

公开(公告)号：US07999341B2

公开(公告)日：2011-08-16

申请号：US12706888

申请日：2010-02-17

Applicant: Ye-chung Chung ,  Sa-yoon Kang

Inventor： Ye-chung Chung ,  Sa-yoon Kang

IPC: H01L31/0232 ,  H01L23/48

CPC classification number: G02F1/13452 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/00014 ,  H01L2924/15192 ,  H01L2924/00 ,  H01L2224/05599

Abstract: A rectangular display driver integrated circuit device adapted for use with a flat panel display (FPD) device is disclosed and comprises, a plurality of input pads arranged in a central portion of the display driver integrated circuit device, and a plurality of output pads arranged along edges of all four sides of the display driver integrated circuit device. An associated film, film package, and flat panel display (FPD) module adapted to receive the display driver integrated circuit device are also disclosed.

Abstract translation: 公开了一种适用于平板显示器（FPD）器件的矩形显示驱动器集成电路器件，包括：布置在显示驱动器集成电路器件的中心部分的多个输入焊盘和沿着 显示驱动器集成电路器件四面的边缘。 还公开了适用于接收显示驱动器集成电路器件的相关的胶片，胶片包装和平板显示器（FPD）模块。

公开(公告)号：US20110143625A1

公开(公告)日：2011-06-16

申请号：US13033307

申请日：2011-02-23

Applicant: Kyoung-sei Choi ,  Byung-seo Kim ,  Young-jae Joo ,  Ye-chung Chung ,  Kyong-soon Cho ,  Sang-heui Lee ,  Si-hoon Lee ,  Sa-yoon Kang ,  Dae-woo Son ,  Sang-gui Jo ,  Jeong-kyu Ha ,  Young-sang Cho

Inventor： Kyoung-sei Choi ,  Byung-seo Kim ,  Young-jae Joo ,  Ye-chung Chung ,  Kyong-soon Cho ,  Sang-heui Lee ,  Si-hoon Lee ,  Sa-yoon Kang ,  Dae-woo Son ,  Sang-gui Jo ,  Jeong-kyu Ha ,  Young-sang Cho

IPC: H01J9/00

CPC classification number: H01L23/49838 ,  H01L23/4985 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/01079 ,  H05K1/0203 ,  H05K1/189 ,  H05K2201/09109 ,  H05K2201/1028 ,  H05K2201/10674 ,  H05K2203/1581 ,  H01L2924/00

Abstract: Disclosed is a chip-on-film (COF) type semiconductor package and a device using the same. The COF type semiconductor package may include an insulation substrate including a top surface and bottom surface, a semiconductor device on the top surface of the insulation substrate, a heat dissipating component on the bottom surface of the insulation substrate, and at least one space between the bottom surface of the insulation substrate and a top surface of the heat dissipating component.

Abstract translation: 公开了一种片上胶片（COF）型半导体封装以及使用其的器件。 COF型半导体封装可以包括包括顶表面和底表面的绝缘衬底，绝缘衬底的顶表面上的半导体器件，绝缘衬底的底表面上的散热部件，以及绝缘衬底的至少一个空间 绝缘基板的底表面和散热部件的顶表面。

公开(公告)号：US07915727B2

公开(公告)日：2011-03-29

申请号：US12385731

申请日：2009-04-17

Applicant: Kyoung-sei Choi ,  Byung-seo Kim ,  Young-jae Joo ,  Ye-chung Chung ,  Kyong-soon Cho ,  Sang-heui Lee ,  Si-hoon Lee ,  Sa-yoon Kang ,  Dae-woo Son ,  Sang-gui Jo ,  Jeong-kyu Ha ,  Young-sang Cho

Inventor： Kyoung-sei Choi ,  Byung-seo Kim ,  Young-jae Joo ,  Ye-chung Chung ,  Kyong-soon Cho ,  Sang-heui Lee ,  Si-hoon Lee ,  Sa-yoon Kang ,  Dae-woo Son ,  Sang-gui Jo ,  Jeong-kyu Ha ,  Young-sang Cho

IPC: H01L23/498 ,  H01L23/36

CPC classification number: H01L23/49838 ,  H01L23/4985 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/01079 ,  H05K1/0203 ,  H05K1/189 ,  H05K2201/09109 ,  H05K2201/1028 ,  H05K2201/10674 ,  H05K2203/1581 ,  H01L2924/00

Abstract: Disclosed is a chip-on-film (COF) type semiconductor package and a device using the same. The COF type semiconductor package may include an insulation substrate including a top surface and bottom surface, a semiconductor device on the top surface of the insulation substrate, a heat dissipating component on the bottom surface of the insulation substrate, and at least one space between the bottom surface of the insulation substrate and a top surface of the heat dissipating component.

Abstract translation: 公开了一种片上胶片（COF）型半导体封装以及使用其的器件。 COF型半导体封装可以包括包括顶表面和底表面的绝缘衬底，绝缘衬底的顶表面上的半导体器件，绝缘衬底的底表面上的散热部件，以及绝缘衬底的至少一个空间 绝缘基板的底表面和散热部件的顶表面。

公开(公告)号：US20100072607A1

公开(公告)日：2010-03-25

申请号：US12627361

申请日：2009-11-30

Applicant: Ye-chung Chung ,  Sa-yoon Kang

Inventor： Ye-chung Chung ,  Sa-yoon Kang

IPC: H01L23/498

CPC classification number: H01L23/4985 ,  G02F1/13452 ,  H01L23/3157 ,  H01L24/48 ,  H01L2224/16 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/73204 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/15151 ,  H01L2924/181 ,  H05K3/281 ,  H05K3/361 ,  H05K2201/09154 ,  H05K2201/09727 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00012 ,  H01L2224/0401

Abstract: A device is provided in which a glass panel having beveled edge is flexibly connected to a TAB package. The outer lead portions of the TAB package include an end portion of first width connected to a connection pattern on the glass panel, a terminal portion having a second width greater than the first width, and a transition portion having a width that varies between the first and second widths. When the TAB package is connected the transition portion of the respective outer lead portions are disposed over the beveled edge of the glass panel.

Abstract translation: 提供了一种装置，其中具有斜边的玻璃面板与TAB封装灵活地连接。 TAB封装的外引线部分包括连接到玻璃面板上的连接图案的第一宽度的端部，具有大于第一宽度的第二宽度的端子部分和具有在第一宽度之间变化的宽度的过渡部分 和第二宽度。 当连接TAB封装时，相应的外引线部分的过渡部分设置在玻璃面板的斜边上。

公开(公告)号：US08222089B2

公开(公告)日：2012-07-17

申请号：US13033307

申请日：2011-02-23

Applicant: Kyoung-sei Choi ,  Byung-seo Kim ,  Young-jae Joo ,  Ye-chung Chung ,  Kyong-soon Cho ,  Sang-heui Lee ,  Si-hoon Lee ,  Sa-yoon Kang ,  Dae-woo Son ,  Sang-gui Jo ,  Jeong-kyu Ha ,  Young-sang Cho

Inventor： Kyoung-sei Choi ,  Byung-seo Kim ,  Young-jae Joo ,  Ye-chung Chung ,  Kyong-soon Cho ,  Sang-heui Lee ,  Si-hoon Lee ,  Sa-yoon Kang ,  Dae-woo Son ,  Sang-gui Jo ,  Jeong-kyu Ha ,  Young-sang Cho

IPC: H01J9/00

CPC classification number: H01L23/49838 ,  H01L23/4985 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/01079 ,  H05K1/0203 ,  H05K1/189 ,  H05K2201/09109 ,  H05K2201/1028 ,  H05K2201/10674 ,  H05K2203/1581 ,  H01L2924/00

Abstract: Disclosed is a chip-on-film (COF) type semiconductor package and a device using the same. The COF type semiconductor package may include an insulation substrate including a top surface and bottom surface, a semiconductor device on the top surface of the insulation substrate, a heat dissipating component on the bottom surface of the insulation substrate, and at least one space between the bottom surface of the insulation substrate and a top surface of the heat dissipating component.

Abstract translation: 公开了一种片上胶片（COF）型半导体封装以及使用其的器件。 COF型半导体封装可以包括包括顶表面和底表面的绝缘衬底，绝缘衬底的顶表面上的半导体器件，绝缘衬底的底表面上的散热部件，以及绝缘衬底的至少一个空间 绝缘基板的底表面和散热部件的顶表面。

公开(公告)号：US07683476B2

公开(公告)日：2010-03-23

申请号：US11517253

申请日：2006-09-08

Applicant: Si-hoon Lee ,  Jae-cheon Doh ,  Sa-yoon Kang

Inventor： Si-hoon Lee ,  Jae-cheon Doh ,  Sa-yoon Kang

IPC: H01L23/34

CPC classification number: H01L23/49833 ,  G02F1/13452 ,  H01L23/4985 ,  H01L24/86 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01082 ,  H01L2924/014

Abstract: Semiconductor package films and a display module comprising a packaged semiconductor device punched from a semiconductor package film are provided. In one embodiment, the invention provides a semiconductor package film comprising a base film comprising a plurality of semiconductor device regions, an intermediate region disposed on a first surface of the base film and disposed between two semiconductor device regions, and a reinforcing member attached to a second surface of the base film opposite the first surface of the base film and attached opposite the intermediate region. Each semiconductor device region comprises a semiconductor mounting region adapted to receive a semiconductor chip, and first and second metal line regions.

Abstract translation: 提供半导体封装膜和包括从半导体封装膜冲压的封装半导体器件的显示模块。 在一个实施例中，本发明提供了一种半导体封装膜，其包括基膜，所述基膜包括多个半导体器件区域，设置在所述基膜的第一表面上并设置在两个半导体器件区域之间的中间区域， 基膜的与基膜的第一表面相对的第二表面并且与中间区域相对地安装。 每个半导体器件区域包括适于接收半导体芯片的半导体安装区域以及第一和第二金属线区域。

公开(公告)号：US07683471B2

公开(公告)日：2010-03-23

申请号：US11488011

申请日：2006-07-18

Applicant: Ye-chung Chung ,  Sa-yoon Kang

Inventor： Ye-chung Chung ,  Sa-yoon Kang

IPC: H01L23/48 ,  H01L23/14

CPC classification number: G02F1/13452 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/00014 ,  H01L2924/15192 ,  H01L2924/00 ,  H01L2224/05599

Abstract: A rectangular display driver integrated circuit device adapted for use with a flat panel display (FPD) device is disclosed and comprises, a plurality of input pads arranged in a central portion of the display driver integrated circuit device, and a plurality of output pads arranged along edges of all four sides of the display driver integrated circuit device. An associated film, film package, and flat panel display (FPD) module adapted to receive the display driver integrated circuit device are also disclosed.

Abstract translation: 公开了一种适用于平板显示器（FPD）器件的矩形显示驱动器集成电路器件，包括：布置在显示驱动器集成电路器件的中心部分的多个输入焊盘和沿着 显示驱动器集成电路器件四面的边缘。 还公开了适用于接收显示驱动器集成电路器件的相关的胶片，胶片包装和平板显示器（FPD）模块。

公开(公告)号：US20070057360A1

公开(公告)日：2007-03-15

申请号：US11517253

申请日：2006-09-08

Applicant: Si-hoon Lee ,  Jae-cheon Doh ,  Sa-yoon Kang

Inventor： Si-hoon Lee ,  Jae-cheon Doh ,  Sa-yoon Kang

IPC: H01L23/48 ,  G02F1/1345

CPC classification number: H01L23/49833 ,  G02F1/13452 ,  H01L23/4985 ,  H01L24/86 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01082 ,  H01L2924/014

Abstract: Semiconductor package films and a display module comprising a packaged semiconductor device punched from a semiconductor package film are provided. In one embodiment, the invention provides a semiconductor package film comprising a base film comprising a plurality of semiconductor device regions, an intermediate region disposed on a first surface of the base film and disposed between two semiconductor device regions, and a reinforcing member attached to a second surface of the base film opposite the first surface of the base film and attached opposite the intermediate region. Each semiconductor device region comprises a semiconductor mounting region adapted to receive a semiconductor chip, and first and second metal line regions.

Abstract translation: 提供半导体封装膜和包括从半导体封装膜冲压的封装半导体器件的显示模块。 在一个实施例中，本发明提供了一种半导体封装膜，其包括基膜，所述基膜包括多个半导体器件区域，设置在所述基膜的第一表面上并设置在两个半导体器件区域之间的中间区域， 基膜的与基膜的第一表面相对的第二表面并且与中间区域相对地安装。 每个半导体器件区域包括适于接收半导体芯片的半导体安装区域以及第一和第二金属线区域。