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公开(公告)号：US20130181347A1
公开(公告)日：2013-07-18
申请号：US13786045
申请日：2013-03-05
发明人： Hao-Yi Tsai , Hsien-Wei Chen , Yu-Wen Liu , Ying-Ju Chen , Hsiu-Ping Wei
IPC分类号： H01L23/48 , H01L21/768
CPC分类号： H01L24/05 , H01L21/768 , H01L21/76877 , H01L23/48 , H01L23/481 , H01L24/03 , H01L24/13 , H01L2224/0401 , H01L2224/05012 , H01L2224/0509 , H01L2224/05092 , H01L2224/05094 , H01L2224/05095 , H01L2224/05096 , H01L2224/05124 , H01L2224/05147 , H01L2224/05552 , H01L2224/05569 , H01L2224/05572 , H01L2224/05599 , H01L2224/131 , H01L2924/00013 , H01L2924/00014 , H01L2924/01002 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01075 , H01L2924/01078 , H01L2924/014 , H01L2224/13099 , H01L2224/13599 , H01L2224/05099 , H01L2224/29099 , H01L2224/29599 , H01L2924/00012
摘要： An embodiment is a bump bond pad structure that comprises a substrate comprising a top layer, a reinforcement pad disposed on the top layer, an intermediate layer above the top layer, an intermediate connection pad disposed on the intermediate layer, an outer layer above the intermediate layer, and an under bump metal (UBM) connected to the intermediate connection pad through an opening in the outer layer. Further embodiments may comprise a via mechanically coupling the intermediate connection pad to the reinforcement pad. The via may comprise a feature selected from the group consisting of a solid via, a substantially ring-shaped via, or a five by five array of vias. Yet, a further embodiment may comprise a secondary reinforcement pad, and a second via mechanically coupling the reinforcement pad to the secondary reinforcement pad.
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公开(公告)号：US20150031200A1
公开(公告)日：2015-01-29
申请号：US14512895
申请日：2014-10-13
发明人： Hao-Yi Tsai , Hsien-Wei Chen , Yu-Wen Liu , Ying-Ju Chen , Hsiu-Ping Wei
IPC分类号： H01L23/00 , H01L21/768
CPC分类号： H01L24/05 , H01L21/768 , H01L21/76877 , H01L23/48 , H01L23/481 , H01L24/03 , H01L24/13 , H01L2224/0401 , H01L2224/05012 , H01L2224/0509 , H01L2224/05092 , H01L2224/05094 , H01L2224/05095 , H01L2224/05096 , H01L2224/05124 , H01L2224/05147 , H01L2224/05552 , H01L2224/05569 , H01L2224/05572 , H01L2224/05599 , H01L2224/131 , H01L2924/00013 , H01L2924/00014 , H01L2924/01002 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01075 , H01L2924/01078 , H01L2924/014 , H01L2224/13099 , H01L2224/13599 , H01L2224/05099 , H01L2224/29099 , H01L2224/29599 , H01L2924/00012
摘要： An embodiment is a bump bond pad structure that comprises a substrate comprising a top layer, a reinforcement pad disposed on the top layer, an intermediate layer above the top layer, an intermediate connection pad disposed on the intermediate layer, an outer layer above the intermediate layer, and an under bump metal (UBM) connected to the intermediate connection pad through an opening in the outer layer. Further embodiments may comprise a via mechanically coupling the intermediate connection pad to the reinforcement pad. The via may comprise a feature selected from the group consisting of a solid via, a substantially ring-shaped via, or a five by five array of vias. Yet, a further embodiment may comprise a secondary reinforcement pad, and a second via mechanically coupling the reinforcement pad to the secondary reinforcement pad.
摘要翻译： 一个实施例是一种凸块接合焊盘结构，其包括基板，该基板包括顶层，设置在顶层上的加强垫，顶层上的中间层，设置在中间层上的中间连接垫，中间层上方的外层 层和通过外层中的开口连接到中间连接焊盘的凸块下金属（UBM）。 另外的实施例可以包括将中间连接垫机械连接到加强垫的通孔。 通孔可以包括选自由固体通孔，基本上环形的通孔或五个五孔的通孔组成的组的特征。 然而，另一实施例可以包括辅助加强垫，以及将加强垫机械连接到辅助加强垫的第二通孔。
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公开(公告)号：US08405211B2
公开(公告)日：2013-03-26
申请号：US12726449
申请日：2010-03-18
申请人： Hao-Yi Tsai , Hsien-Wei Chen , Yu-Wen Liu , Ying-Ju Chen , Hsiu-Ping Wei
发明人： Hao-Yi Tsai , Hsien-Wei Chen , Yu-Wen Liu , Ying-Ju Chen , Hsiu-Ping Wei
IPC分类号： H01L23/485
CPC分类号： H01L24/05 , H01L21/768 , H01L21/76877 , H01L23/48 , H01L23/481 , H01L24/03 , H01L24/13 , H01L2224/0401 , H01L2224/05012 , H01L2224/0509 , H01L2224/05092 , H01L2224/05094 , H01L2224/05095 , H01L2224/05096 , H01L2224/05124 , H01L2224/05147 , H01L2224/05552 , H01L2224/05569 , H01L2224/05572 , H01L2224/05599 , H01L2224/131 , H01L2924/00013 , H01L2924/00014 , H01L2924/01002 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01075 , H01L2924/01078 , H01L2924/014 , H01L2224/13099 , H01L2224/13599 , H01L2224/05099 , H01L2224/29099 , H01L2224/29599 , H01L2924/00012
摘要： An embodiment is a bump bond pad structure that comprises a substrate comprising a top layer, a reinforcement pad disposed on the top layer, an intermediate layer above the top layer, an intermediate connection pad disposed on the intermediate layer, an outer layer above the intermediate layer, and an under bump metal (UBM) connected to the intermediate connection pad through an opening in the outer layer. Further embodiments may comprise a via mechanically coupling the intermediate connection pad to the reinforcement pad. The via may comprise a feature selected from the group consisting of a solid via, a substantially ring-shaped via, or a five by five array of vias. Yet, a further embodiment may comprise a secondary reinforcement pad, and a second via mechanically coupling the reinforcement pad to the secondary reinforcement pad.
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公开(公告)号：US11804460B2
公开(公告)日：2023-10-31
申请号：US17676602
申请日：2022-02-21
发明人： Jiro Yota , Dogan Gunes
CPC分类号： H01L24/11 , H01L23/10 , H01L23/3192 , H01L24/03 , H01L24/05 , H01L24/13 , H01L24/29 , H01L23/3114 , H01L24/16 , H01L24/32 , H01L24/94 , H01L2224/0215 , H01L2224/02125 , H01L2224/0391 , H01L2224/0401 , H01L2224/04026 , H01L2224/05005 , H01L2224/0508 , H01L2224/0509 , H01L2224/05011 , H01L2224/05012 , H01L2224/05018 , H01L2224/05022 , H01L2224/05078 , H01L2224/05083 , H01L2224/05084 , H01L2224/05088 , H01L2224/05093 , H01L2224/05096 , H01L2224/05098 , H01L2224/05558 , H01L2224/11 , H01L2224/131 , H01L2224/13022 , H01L2224/13082 , H01L2224/16227 , H01L2224/291 , H01L2224/29011 , H01L2224/29022 , H01L2224/29082 , H01L2224/32225 , H01L2224/81191 , H01L2224/81193 , H01L2224/94 , H01L2924/12 , H01L2924/1421 , H01L2924/1461 , H01L2924/163 , H01L2924/35121 , H01L2224/05558 , H01L2924/00014 , H01L2224/131 , H01L2924/014 , H01L2224/05005 , H01L2924/00012 , H01L2224/05018 , H01L2924/00012 , H01L2224/05098 , H01L2924/06 , H01L2224/02125 , H01L2924/00012 , H01L2224/0215 , H01L2924/06 , H01L2224/05012 , H01L2924/00012 , H01L2224/05093 , H01L2924/00012 , H01L2224/0509 , H01L2924/00012 , H01L2224/291 , H01L2924/014 , H01L2224/94 , H01L2224/11 , H01L2224/94 , H01L2224/03 , H01L2224/94 , H01L2224/83
摘要： Structures, methods and devices are disclosed, related to improved stack structures in electronic devices. In some embodiments, a stack structure includes a pad implemented on a substrate, the pad including a polymer layer having a side that forms an interface with another layer of the pad, the pad further including an upper metal layer over the interface, the upper metal layer having an upper surface. In some embodiments, the stack structure also includes a passivation layer implemented over the upper metal layer, the passivation layer including a pattern configured to provide a compressive force on the upper metal layer to thereby reduce the likelihood of delamination at the interface, the pattern defining a plurality of openings to expose the upper surface of the upper metal layer.
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公开(公告)号：US09536847B2
公开(公告)日：2017-01-03
申请号：US14884438
申请日：2015-10-15
发明人： Hsiu-Ping Wei , Hsien-Wei Chen , Hao-Yi Tsai , Ying-Ju Chen , Yu-Wen Liu
IPC分类号： H01L23/00 , H01L21/768 , H01L23/48
CPC分类号： H01L24/05 , H01L21/768 , H01L21/76877 , H01L23/48 , H01L23/481 , H01L24/03 , H01L24/13 , H01L2224/0401 , H01L2224/05012 , H01L2224/0509 , H01L2224/05092 , H01L2224/05094 , H01L2224/05095 , H01L2224/05096 , H01L2224/05124 , H01L2224/05147 , H01L2224/05552 , H01L2224/05569 , H01L2224/05572 , H01L2224/05599 , H01L2224/131 , H01L2924/00013 , H01L2924/00014 , H01L2924/01002 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01075 , H01L2924/01078 , H01L2924/014 , H01L2224/13099 , H01L2224/13599 , H01L2224/05099 , H01L2224/29099 , H01L2224/29599 , H01L2924/00012
摘要： An embodiment is a bump bond pad structure that comprises a substrate comprising a top layer, a reinforcement pad disposed on the top layer, an intermediate layer above the top layer, an intermediate connection pad disposed on the intermediate layer, an outer layer above the intermediate layer, and an under bump metal (UBM) connected to the intermediate connection pad through an opening in the outer layer. Further embodiments may comprise a via mechanically coupling the intermediate connection pad to the reinforcement pad. The via may comprise a feature selected from the group consisting of a solid via, a substantially ring-shaped via, or a five by five array of vias. Yet, a further embodiment may comprise a secondary reinforcement pad, and a second via mechanically coupling the reinforcement pad to the secondary reinforcement pad.
摘要翻译： 一个实施例是一种凸块接合焊盘结构，其包括基板，该基板包括顶层，设置在顶层上的加强垫，顶层上的中间层，设置在中间层上的中间连接垫，中间层上方的外层 层和通过外层中的开口连接到中间连接焊盘的凸块下金属（UBM）。 另外的实施例可以包括将中间连接垫机械连接到加强垫的通孔。 通孔可以包括选自由固体通孔，基本上环形的通孔或五个五孔的通孔组成的组的特征。 然而，另一实施例可以包括辅助加强垫，以及将加强垫机械连接到辅助加强垫的第二通孔。
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公开(公告)号：US20130320522A1
公开(公告)日：2013-12-05
申请号：US13483999
申请日：2012-05-30
申请人： Feng-Liang Lai , Kai-Yuan Yang , Chia-Jen Leu , Sheng Chiang Hung
发明人： Feng-Liang Lai , Kai-Yuan Yang , Chia-Jen Leu , Sheng Chiang Hung
IPC分类号： H01L23/498 , H01L21/768 , H01L23/48
CPC分类号： H01L23/5226 , H01L23/291 , H01L23/293 , H01L23/3192 , H01L23/562 , H01L24/03 , H01L24/05 , H01L24/13 , H01L2224/02166 , H01L2224/0401 , H01L2224/04042 , H01L2224/05008 , H01L2224/05022 , H01L2224/0509 , H01L2224/0554 , H01L2224/05552 , H01L2224/05572 , H01L2224/05624 , H01L2224/05644 , H01L2224/05647 , H01L2224/05666 , H01L2224/05684 , H01L2224/1134 , H01L2224/13006 , H01L2224/13111 , H01L2224/13147 , H01L2224/48463 , H01L2924/00012 , H01L2924/00014 , H01L2924/00
摘要： An embodiment is a semiconductor device comprising a contact pad over a substrate, wherein the contact pad is disposed over an integrated circuit on the substrate and a first passivation layer over the contact pad. A first via in the first passivation layer, wherein the first via has more than four sides, and wherein the first via extends to the contact pad.
摘要翻译： 一个实施例是一种半导体器件，其包括在衬底上的接触焊盘，其中接触焊盘设置在衬底上的集成电路上，以及在接触焊盘上方的第一钝化层。 第一钝化层中的第一通孔，其中第一通孔具有多于四个边，并且其中第一通孔延伸到接触焊盘。
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公开(公告)号：US20100283148A1
公开(公告)日：2010-11-11
申请号：US12726449
申请日：2010-03-18
申请人： Hao-Yi Tsai , Hsien-Wei Chen , Yu-Wen Liu , Ying-Ju Chen , Hsiu-Ping Wei
发明人： Hao-Yi Tsai , Hsien-Wei Chen , Yu-Wen Liu , Ying-Ju Chen , Hsiu-Ping Wei
IPC分类号： H01L23/485 , H01L21/60
CPC分类号： H01L24/05 , H01L21/768 , H01L21/76877 , H01L23/48 , H01L23/481 , H01L24/03 , H01L24/13 , H01L2224/0401 , H01L2224/05012 , H01L2224/0509 , H01L2224/05092 , H01L2224/05094 , H01L2224/05095 , H01L2224/05096 , H01L2224/05124 , H01L2224/05147 , H01L2224/05552 , H01L2224/05569 , H01L2224/05572 , H01L2224/05599 , H01L2224/131 , H01L2924/00013 , H01L2924/00014 , H01L2924/01002 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01075 , H01L2924/01078 , H01L2924/014 , H01L2224/13099 , H01L2224/13599 , H01L2224/05099 , H01L2224/29099 , H01L2224/29599 , H01L2924/00012
摘要： An embodiment is a bump bond pad structure that comprises a substrate comprising a top layer, a reinforcement pad disposed on the top layer, an intermediate layer above the top layer, an intermediate connection pad disposed on the intermediate layer, an outer layer above the intermediate layer, and an under bump metal (UBM) connected to the intermediate connection pad through an opening in the outer layer. Further embodiments may comprise a via mechanically coupling the intermediate connection pad to the reinforcement pad. The via may comprise a feature selected from the group consisting of a solid via, a substantially ring-shaped via, or a five by five array of vias. Yet, a further embodiment may comprise a secondary reinforcement pad, and a second via mechanically coupling the reinforcement pad to the secondary reinforcement pad.
摘要翻译： 一个实施例是一种凸块接合焊盘结构，其包括基板，该基板包括顶层，设置在顶层上的加强垫，顶层上的中间层，设置在中间层上的中间连接垫，中间层上方的外层 层和通过外层中的开口连接到中间连接焊盘的凸块下金属（UBM）。 另外的实施例可以包括将中间连接垫机械连接到加强垫的通孔。 通孔可以包括选自由固体通孔，基本上环形的通孔或五个五孔的通孔组成的组的特征。 然而，另一实施例可以包括辅助加强垫，以及将加强垫机械连接到辅助加强垫的第二通孔。
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公开(公告)号：US20160035684A1
公开(公告)日：2016-02-04
申请号：US14884438
申请日：2015-10-15
发明人： Hsiu-Ping Wei , Hsien-Wei Chen , Hao-Yi Tsai , Ying-Ju Chen , Yu-Wen Liu
IPC分类号： H01L23/00 , H01L23/48 , H01L21/768
CPC分类号： H01L24/05 , H01L21/768 , H01L21/76877 , H01L23/48 , H01L23/481 , H01L24/03 , H01L24/13 , H01L2224/0401 , H01L2224/05012 , H01L2224/0509 , H01L2224/05092 , H01L2224/05094 , H01L2224/05095 , H01L2224/05096 , H01L2224/05124 , H01L2224/05147 , H01L2224/05552 , H01L2224/05569 , H01L2224/05572 , H01L2224/05599 , H01L2224/131 , H01L2924/00013 , H01L2924/00014 , H01L2924/01002 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01075 , H01L2924/01078 , H01L2924/014 , H01L2224/13099 , H01L2224/13599 , H01L2224/05099 , H01L2224/29099 , H01L2224/29599 , H01L2924/00012
摘要： An embodiment is a bump bond pad structure that comprises a substrate comprising a top layer, a reinforcement pad disposed on the top layer, an intermediate layer above the top layer, an intermediate connection pad disposed on the intermediate layer, an outer layer above the intermediate layer, and an under bump metal (UBM) connected to the intermediate connection pad through an opening in the outer layer. Further embodiments may comprise a via mechanically coupling the intermediate connection pad to the reinforcement pad. The via may comprise a feature selected from the group consisting of a solid via, a substantially ring-shaped via, or a five by five array of vias. Yet, a further embodiment may comprise a secondary reinforcement pad, and a second via mechanically coupling the reinforcement pad to the secondary reinforcement pad.
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公开(公告)号：US09171811B2
公开(公告)日：2015-10-27
申请号：US14512895
申请日：2014-10-13
发明人： Hao-Yi Tsai , Hsien-Wei Chen , Yu-Wen Liu , Ying-Ju Chen , Hsiu-Ping Wei
IPC分类号： H01L23/00 , H01L21/768 , H01L23/48
CPC分类号： H01L24/05 , H01L21/768 , H01L21/76877 , H01L23/48 , H01L23/481 , H01L24/03 , H01L24/13 , H01L2224/0401 , H01L2224/05012 , H01L2224/0509 , H01L2224/05092 , H01L2224/05094 , H01L2224/05095 , H01L2224/05096 , H01L2224/05124 , H01L2224/05147 , H01L2224/05552 , H01L2224/05569 , H01L2224/05572 , H01L2224/05599 , H01L2224/131 , H01L2924/00013 , H01L2924/00014 , H01L2924/01002 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01075 , H01L2924/01078 , H01L2924/014 , H01L2224/13099 , H01L2224/13599 , H01L2224/05099 , H01L2224/29099 , H01L2224/29599 , H01L2924/00012
摘要： An embodiment is a bump bond pad structure that comprises a substrate comprising a top layer, a reinforcement pad disposed on the top layer, an intermediate layer above the top layer, an intermediate connection pad disposed on the intermediate layer, an outer layer above the intermediate layer, and an under bump metal (UBM) connected to the intermediate connection pad through an opening in the outer layer. Further embodiments may comprise a via mechanically coupling the intermediate connection pad to the reinforcement pad. The via may comprise a feature selected from the group consisting of a solid via, a substantially ring-shaped via, or a five by five array of vias. Yet, a further embodiment may comprise a secondary reinforcement pad, and a second via mechanically coupling the reinforcement pad to the secondary reinforcement pad.
摘要翻译： 一个实施例是一种凸块接合焊盘结构，其包括基板，该基板包括顶层，设置在顶层上的加强垫，顶层上的中间层，设置在中间层上的中间连接垫，中间层上方的外层 层和通过外层中的开口连接到中间连接焊盘的凸块下金属（UBM）。 另外的实施例可以包括将中间连接垫机械连接到加强垫的通孔。 通孔可以包括选自由固体通孔，基本上环形的通孔或五个五孔的通孔组成的组的特征。 然而，另一实施例可以包括辅助加强垫，以及将加强垫机械连接到辅助加强垫的第二通孔。
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公开(公告)号：US08907478B2
公开(公告)日：2014-12-09
申请号：US13786045
申请日：2013-03-05
发明人： Hao-Yi Tsai , Hsien-Wei Chen , Yu-Wen Liu , Ying-Ju Chen , Hsiu-Ping Wei
IPC分类号： H01L23/48 , H01L23/00 , H01L21/768
CPC分类号： H01L24/05 , H01L21/768 , H01L21/76877 , H01L23/48 , H01L23/481 , H01L24/03 , H01L24/13 , H01L2224/0401 , H01L2224/05012 , H01L2224/0509 , H01L2224/05092 , H01L2224/05094 , H01L2224/05095 , H01L2224/05096 , H01L2224/05124 , H01L2224/05147 , H01L2224/05552 , H01L2224/05569 , H01L2224/05572 , H01L2224/05599 , H01L2224/131 , H01L2924/00013 , H01L2924/00014 , H01L2924/01002 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01075 , H01L2924/01078 , H01L2924/014 , H01L2224/13099 , H01L2224/13599 , H01L2224/05099 , H01L2224/29099 , H01L2224/29599 , H01L2924/00012
摘要： An embodiment is a bump bond pad structure that comprises a substrate comprising a top layer, a reinforcement pad disposed on the top layer, an intermediate layer above the top layer, an intermediate connection pad disposed on the intermediate layer, an outer layer above the intermediate layer, and an under bump metal (UBM) connected to the intermediate connection pad through an opening in the outer layer. Further embodiments may comprise a via mechanically coupling the intermediate connection pad to the reinforcement pad. The via may comprise a feature selected from the group consisting of a solid via, a substantially ring-shaped via, or a five by five array of vias. Yet, a further embodiment may comprise a secondary reinforcement pad, and a second via mechanically coupling the reinforcement pad to the secondary reinforcement pad.
摘要翻译： 一个实施例是一种凸块接合焊盘结构，其包括基板，该基板包括顶层，设置在顶层上的加强垫，顶层上的中间层，设置在中间层上的中间连接垫，中间层上方的外层 层和通过外层中的开口连接到中间连接焊盘的凸块下金属（UBM）。 另外的实施例可以包括将中间连接垫机械连接到加强垫的通孔。 通孔可以包括选自由固体通孔，基本上环形的通孔或五个五孔的通孔组成的组的特征。 然而，另一实施例可以包括辅助加强垫，以及将加强垫机械连接到辅助加强垫的第二通孔。
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