公开(公告)号：US20120001544A1

公开(公告)日：2012-01-05

申请号：US12904512

申请日：2010-10-14

Applicant: Tae Hoon KIM ,  Sang Hyun SHIN ,  Cheol Ho HEO ,  Young Ki LEE ,  Ji Hyun PARK ,  Ki Ho SEO

Inventor： Tae Hoon KIM ,  Sang Hyun SHIN ,  Cheol Ho HEO ,  Young Ki LEE ,  Ji Hyun PARK ,  Ki Ho SEO

IPC: H01J7/44 ,  H01J9/00

CPC classification number: H01L25/167 ,  H01L27/3276 ,  H01L27/3288 ,  H01L33/641 ,  H01L51/529 ,  H01L2924/0002 ,  H05K1/0203 ,  H05K3/445 ,  H05K2201/10106 ,  H05K2201/10128 ,  H05K2203/0315 ,  H01L2924/00

Abstract: Disclosed are a light emitting module and a method of manufacturing the light emitting module. The light emitting module includes: a heat radiating substrate which includes a metal substrate with through holes, an internal insulating layer formed along inner walls of the through holes, and an external insulating layer covering all outer surfaces of the metal substrate; a light emitting component unit disposed on a top surface of the heat radiating substrate; a driving circuit unit which is electrically connected to the light emitting component unit, and is mounted on the heat radiating substrate to apply a driving signal to the light emitting component unit; a passive component which is mounted on the heat radiating substrate and is electrically connected to the driving circuit unit; and circuit wiring layers which are disposed on a top and a bottom of the heat radiating substrate, respectively, and are interconnected therebetween through vias formed on the through holes with the internal insulating layer of the heat radiating substrate, and play a role of electrical interconnection of the driving circuit unit and the light emitting component unit, or the driving circuit unit and the passive component.

Abstract translation: 公开了发光模块和制造发光模块的方法。 发光模块包括：散热基板，其包括具有通孔的金属基板，沿着通孔的内壁形成的内部绝缘层，以及覆盖金属基板的所有外表面的外部绝缘层; 设置在散热基板的上表面上的发光部件单元; 驱动电路单元，其电连接到所述发光部件单元，并且安装在所述散热基板上以向所述发光部件单元施加驱动信号; 无源部件，其被安装在散热基板上并电连接到驱动电路单元; 以及电路布线层，其分别设置在散热基板的顶部和底部，并且通过形成在通孔上的通孔与散热基板的内部绝缘层相互连接，并且起到电互连的作用 驱动电路单元和发光部件单元，或者驱动电路单元和无源部件。

公开(公告)号：US20110260198A1

公开(公告)日：2011-10-27

申请号：US13177276

申请日：2011-07-06

Applicant: Young Ki Lee ,  Seog Moon Choi ,  Sang Hyun Shin

Inventor： Young Ki Lee ,  Seog Moon Choi ,  Sang Hyun Shin

IPC: H01L33/60

CPC classification number: H01L33/486 ,  H01L33/60 ,  H01L33/62 ,  H05K3/28 ,  H05K2203/0315 ,  H05K2203/0542

Abstract: An insulation structure for high temperature conditions and a manufacturing method thereof. In the insulation structure, a substrate has a conductive pattern formed on at least one surface thereof for electrical connection of a device.A metal oxide layer pattern is formed on a predetermined portion of the conductive pattern by anodization, the metal oxide layer pattern made of one selected from a group consisting of Al, Ti and Mg.

Abstract translation: 一种用于高温条件的绝缘结构及其制造方法。 在绝缘结构中，衬底具有形成在其至少一个表面上的用于电连接器件的导电图案。 通过阳极氧化在导电图案的预定部分上形成金属氧化物层图案，金属氧化物层图案由选自Al，Ti和Mg的一种形成。

公开(公告)号：US20110181729A1

公开(公告)日：2011-07-28

申请号：US12832371

申请日：2010-07-08

Applicant: Young-ki LEE

Inventor： Young-ki LEE

IPC: H04N7/18

CPC classification number: H04N7/181 ,  H04N5/232 ,  H04N5/23206 ,  H04N7/185

Abstract: A system for operating network cameras, a method for operating network cameras, and a network camera having a storage function are provided so that the system does not have to include a network video recorder.

Abstract translation: 提供了用于操作网络摄像机的系统，用于操作网络摄像机的方法和具有存储功能的网络摄像机，使得系统不必包括网络录像机。

公开(公告)号：US20110164391A1

公开(公告)日：2011-07-07

申请号：US12775341

申请日：2010-05-06

Applicant: Yee Na SHIN ,  Tae Sung JEONG ,  Young Ki LEE ,  Seung Eun LEE

Inventor： Yee Na SHIN ,  Tae Sung JEONG ,  Young Ki LEE ,  Seung Eun LEE

IPC: H05K1/18 ,  H05K3/00

CPC classification number: H05K3/445 ,  H01L23/13 ,  H01L23/49827 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/82 ,  H01L2224/04105 ,  H01L2224/24227 ,  H01L2224/73267 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/3011 ,  H01L2924/3511 ,  H05K1/185 ,  H05K3/4641 ,  H05K2201/09745 ,  H05K2201/09772 ,  H05K2201/10674 ,  H05K2203/0191 ,  H05K2203/0315 ,  H01L2924/00

Abstract: Disclosed herein is an electronic component-embedded printed circuit board, including: a metal substrate including an anodic oxide film formed over the entire surface thereof; two electronic components disposed in a cavity formed in the metal substrate in two stages; an insulation layer formed on both sides of the metal substrate to bury the electronic components disposed in the cavity; and circuit layers including vias connected with connecting terminals of the electronic components and formed on the exposed surfaces of the insulation layer. The electronic component-embedded printed circuit board is advantageous in that its radiation performance of radiating the heat generated from an electronic component can be improved, and its production cost can be reduced, because a metal substrate is used instead of a conventional insulating material.

Abstract translation: 这里公开了一种电子部件嵌入式印刷电路板，包括：金属基板，包括在其整个表面上形成的阳极氧化膜; 设置在形成在金属基板中的空腔中的两个电子部件分两级; 形成在所述金属基板的两侧的绝缘层，以埋置设置在所述空腔中的电子部件; 以及电路层，包括与电子部件的连接端子连接并形成在绝缘层的暴露表面上的通孔。 电子元件嵌入式印刷电路板的优点在于，由于使用金属基板代替传统的绝缘材料，因此可以提高其辐射电子元件产生的热量的辐射性能，并且可以降低其制造成本。

公开(公告)号：US20110140144A1

公开(公告)日：2011-06-16

申请号：US12721539

申请日：2010-03-10

Applicant: Chang Hyun Lim ,  Seog Moon Choi ,  Sang Hyun Shin ,  Sung Keun Park ,  Young Ki Lee

Inventor： Chang Hyun Lim ,  Seog Moon Choi ,  Sang Hyun Shin ,  Sung Keun Park ,  Young Ki Lee

IPC: H01L33/00 ,  H01L31/00

CPC classification number: H01L33/54 ,  H01L33/505 ,  H01L33/62 ,  H01L2224/32225 ,  H01L2224/73265 ,  H01L2224/48091 ,  H01L2924/00014

Abstract: Disclosed is a package substrate for an optical element, which includes a base substrate, a first circuit layer formed on the base substrate and including a mounting portion, an optical element mounted on the mounting portion, one or more trenches formed into a predetermined pattern around the mounting portion by removing portions of the first circuit layer so that the first circuit layer and the optical element are electrically connected to each other, and a fluorescent resin material applied on an area defined by the trenches so as to cover the optical element, and in which such trenches are formed on the first circuit layer so that the optical element and the first circuit layer are electrically connected to each other, thus maintaining the shape of the fluorescent resin material and obviating the need to form a via under the optical element. A method of manufacturing the package substrate for an optical element is also provided.

Abstract translation: 公开了一种用于光学元件的封装基板，其包括基底基板，形成在基底基板上并包括安装部分的第一电路层，安装在安装部分上的光学元件，形成为预定图案的一个或多个沟槽 通过去除第一电路层的部分使得第一电路层和光学元件彼此电连接的安装部分和施加在由沟槽限定的区域以覆盖光学元件的荧光树脂材料，以及 其中这种沟槽形成在第一电路层上，使得光学元件和第一电路层彼此电连接，从而保持荧光树脂材料的形状，并且消除了在光学元件下形成通孔的需要。 还提供了一种制造用于光学元件的封装衬底的方法。

公开(公告)号：US07960806B2

公开(公告)日：2011-06-14

申请号：US12285324

申请日：2008-10-01

Applicant: Young-Ki Lee ,  Seog-Moon Choi ,  Hyung-Jin Jeon ,  Sang-Hyun Shin

Inventor： Young-Ki Lee ,  Seog-Moon Choi ,  Hyung-Jin Jeon ,  Sang-Hyun Shin

IPC: H01L27/14

CPC classification number: H01L25/0753 ,  F21K9/00 ,  H01L33/486 ,  H01L33/62 ,  H01L33/641 ,  H01L33/647 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A sub-mount, a light emitting diode package, and a method of manufacturing thereof are disclosed. A sub-mount, on which multiple light emitting diodes are mounted, can include a multiple number of metal bodies on which the light emitting diodes are respectively mounted, and an oxide wall interposed between the metal bodies such that the adjacent metal bodies are supported by each other but electrically disconnected from each other. By utilizing certain embodiments of the invention, a high heat releasing effect may be obtained, and manufacturing costs may be reduced.

Abstract translation: 公开了一种子安装，发光二极管封装及其制造方法。 其上安装有多个发光二极管的子座可以包括多个金属体，其上分别安装有发光二极管，金属体之间插入氧化物壁，使得相邻的金属体被 彼此相互电气断开。 通过利用本发明的某些实施例，可以获得高的散热效果，并且可以降低制造成本。

公开(公告)号：US20110101392A1

公开(公告)日：2011-05-05

申请号：US12642326

申请日：2009-12-18

Applicant: Sung Keun Park ,  Seog Moon Choi ,  Young Ki Lee ,  Chang Hyun Lim

Inventor： Sung Keun Park ,  Seog Moon Choi ,  Young Ki Lee ,  Chang Hyun Lim

IPC: H01L33/00 ,  H01L21/56

CPC classification number: H01L33/50 ,  H01L33/486 ,  H01L33/64 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/8592 ,  H01L2924/01322 ,  H01L2924/181 ,  H01L2933/0041 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: Disclosed is a package substrate for an optical element, which includes a metal core having a hole formed therein, an insulating layer formed on the surface of the metal core, a first metal layer formed to a predetermined thickness on the surface of the insulating layer so as to include therein the metal core insulated by the insulating layer, an optical element mounted on the first metal layer, and a fluorescent resin material applied on the optical element in order to protect the optical element, thereby simplifying a package substrate process and improving light uniformity, light reflectivity and heat dissipating properties compared to a conventional configuration. A method of manufacturing the package substrate is also provided.

Abstract translation: 公开了一种用于光学元件的封装基板，其包括其中形成有孔的金属芯，形成在金属芯的表面上的绝缘层，在绝缘层的表面上形成为预定厚度的第一金属层， 在其中包括由绝缘层绝缘的金属芯，安装在第一金属层上的光学元件和施加在光学元件上的荧光树脂材料，以保护光学元件，从而简化了封装衬底处理和改善光 均匀性，光反射率和散热特性。 还提供了制造封装基板的方法。

公开(公告)号：US20110061901A1

公开(公告)日：2011-03-17

申请号：US12614407

申请日：2009-11-07

Applicant: Chang Hyun LIM ,  Seog Moon CHOI ,  Sang Hyun SHIN ,  Young Ki LEE ,  Sung Keun PARK

Inventor： Chang Hyun LIM ,  Seog Moon CHOI ,  Sang Hyun SHIN ,  Young Ki LEE ,  Sung Keun PARK

IPC: H05K1/00 ,  H05K3/00

CPC classification number: H05K3/02 ,  H05K1/0201 ,  H05K1/053 ,  H05K3/0061 ,  H05K2201/062 ,  H05K2201/09881 ,  H05K2201/09972 ,  H05K2203/0315

Abstract: Disclosed herein are a heat-dissipating substrate and a fabricating method thereof. The heat-dissipating substrate includes a plating layer divided by a first insulator formed in a division area. A metal plate is formed on an upper surface of the plating layer and filled with a second insulator at a position corresponding to the division area, with an anodized layer formed on a surface of the metal plate. A circuit layer is formed on the anodized layer which is formed on an upper surface of the metal plate. The heat-dissipating substrate and fabricating method thereof achieves thermal isolation by a first insulator formed in a division area and a second insulator.

Abstract translation: 这里公开了散热基板及其制造方法。 散热基板包括由形成在分割区域中的第一绝缘体分割的镀层。 金属板形成在镀层的上表面上，并且在对应于分割区域的位置处填充有第二绝缘体，阳极氧化层形成在金属板的表面上。 在形成在金属板的上表面上的阳极氧化层上形成电路层。 散热基板及其制造方法通过形成在分割区域和第二绝缘体中的第一绝缘体进行热隔离。

公开(公告)号：US07895188B2

公开(公告)日：2011-02-22

申请号：US11741923

申请日：2007-04-30

Applicant: Jin Won Lee ,  Young Ki Lee ,  Seung Woo Kang ,  Sang Jeong Lee ,  Hyun Ju Jin ,  Byung Jip Kim ,  June Hwa Song

Inventor： Jin Won Lee ,  Young Ki Lee ,  Seung Woo Kang ,  Sang Jeong Lee ,  Hyun Ju Jin ,  Byung Jip Kim ,  June Hwa Song

IPC: G06F7/00 ,  G06F17/30

CPC classification number: G06F17/30675

Abstract: The present invention relates to a processing method of data stream using Border Monitoring Query, and more particularly a monitoring method and a system for data streams which are a large volume of data and continuously generated such as financial ticker, GPS data or a ubiquitous sensor network (USN).The objectives of the present invention are to process a large number of BMQs over data streams in high-performance and scalable manner. For this purpose, the invention presents BMQ-Index, a scalable and high performance data stream monitoring framework. The main idea of BMQ-Index is shared and incremental processing. For shared processing, BMQ-Index adopts a query indexing approach, thereby achieving a high level of scalability. Once BMQ-Index is built on registered queries, only relevant queries are quickly searched for upon an incoming data. For incremental processing, BMQ-Index employs an incremental access method, i.e., an index structure to store delta query information and an incremental search algorithm. Thus, successive BMQ evaluations are greatly accelerated.

Abstract translation: 本发明涉及使用边界监视查询的数据流的处理方法，更具体地说，涉及一种数据流的监视方法和系统，该数据流是大量的数据并连续生成的，例如金融报价单，GPS数据或普遍存在的传感器网络 （USN）。 本发明的目标是以高性能和可扩展的方式处理数据流上的大量BMQ。 为此，本发明提出了可扩展和高性能的数据流监测框架BMQ-Index。 BMQ-Index的主要思想是共享和增量处理。 对于共享处理，BMQ-Index采用查询索引方式，从而实现了高度的可扩展性。 一旦BMQ-Index建立在注册查询上，只有在输入数据时快速搜索相关查询。 对于增量处理，BMQ-Index使用增量访问方法，即用于存储增量查询信息和增量搜索算法的索引结构。 因此，连续的BMQ评估大大加快。

公开(公告)号：US20100053178A1

公开(公告)日：2010-03-04

申请号：US12554154

申请日：2009-09-04

Applicant: Young-ki Lee ,  Hyo Park ,  Hyun-joong Kong

Inventor： Young-ki Lee ,  Hyo Park ,  Hyun-joong Kong

IPC: G06T1/00 ,  H04N5/262 ,  H04N5/765

CPC classification number: G09G5/006 ,  G09G2340/0435 ,  H04N5/232 ,  H04N5/23206 ,  H04N5/77 ,  H04N5/775 ,  H04N9/7921

Abstract: An image processing apparatus and method are provided. The image processing apparatus includes: at least one image input unit, to which a plurality of input images are input according to respective frame rates; and a controller that arranges an operation time and an operation order of each of tasks for processing a corresponding image of the plurality of input images according to the respective frame rates, and performs each of the tasks according to the operation time and the operation order.

Abstract translation: 提供了一种图像处理装置和方法。 图像处理装置包括：至少一个图像输入单元，根据各个帧速率输入多个输入图像; 以及控制器，其根据各个帧速率来布置用于处理多个输入图像的对应图像的每个任务的操作时间和操作顺序，并且根据操作时间和操作顺序执行每个任务。