公开(公告)号：US20110061901A1

公开(公告)日：2011-03-17

申请号：US12614407

申请日：2009-11-07

申请人： Chang Hyun LIM ,  Seog Moon CHOI ,  Sang Hyun SHIN ,  Young Ki LEE ,  Sung Keun PARK

发明人： Chang Hyun LIM ,  Seog Moon CHOI ,  Sang Hyun SHIN ,  Young Ki LEE ,  Sung Keun PARK

IPC分类号： H05K1/00 ,  H05K3/00

CPC分类号： H05K3/02 ,  H05K1/0201 ,  H05K1/053 ,  H05K3/0061 ,  H05K2201/062 ,  H05K2201/09881 ,  H05K2201/09972 ,  H05K2203/0315

摘要： Disclosed herein are a heat-dissipating substrate and a fabricating method thereof. The heat-dissipating substrate includes a plating layer divided by a first insulator formed in a division area. A metal plate is formed on an upper surface of the plating layer and filled with a second insulator at a position corresponding to the division area, with an anodized layer formed on a surface of the metal plate. A circuit layer is formed on the anodized layer which is formed on an upper surface of the metal plate. The heat-dissipating substrate and fabricating method thereof achieves thermal isolation by a first insulator formed in a division area and a second insulator.

摘要翻译： 这里公开了散热基板及其制造方法。 散热基板包括由形成在分割区域中的第一绝缘体分割的镀层。 金属板形成在镀层的上表面上，并且在对应于分割区域的位置处填充有第二绝缘体，阳极氧化层形成在金属板的表面上。 在形成在金属板的上表面上的阳极氧化层上形成电路层。 散热基板及其制造方法通过形成在分割区域和第二绝缘体中的第一绝缘体进行热隔离。

公开(公告)号：US20120111610A1

公开(公告)日：2012-05-10

申请号：US13013736

申请日：2011-01-25

申请人： Kwang Soo KIM ,  Sang Hyun SHIN ,  Jung Eun KANG ,  Chang Hyun LIM ,  Seog Moon CHOI ,  Sung Keun PARK

发明人： Kwang Soo KIM ,  Sang Hyun SHIN ,  Jung Eun KANG ,  Chang Hyun LIM ,  Seog Moon CHOI ,  Sung Keun PARK

IPC分类号： H05K1/02 ,  C23C28/00

CPC分类号： H01L23/3735 ,  H01L23/142 ,  H01L23/4334 ,  H01L23/49531 ,  H01L2924/00013 ,  H01L2924/0002 ,  H01L2224/13099 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2224/29099 ,  H01L2224/29599 ,  H01L2924/00

摘要： Disclosed herein are a heat-radiating substrate and a method for manufacturing the same. The heat-radiating substrate includes: an anodized substrate having an anodized film formed over a metal substrate; a circuit pattern formed on one surface of the anodized substrate; and a metal layer formed on the other surface of the anodized substrate. The metal layer formed on the other surface of the anodized substrate has the same area as that of the circuit pattern formed on one surface thereof, and is formed within an edge of the anodized substrate. The metal layer is added, making it possible to minimize a warpage problem of the substrate. In addition, a heat radiating plate is in direct contact with the anodized substrate, thereby making it possible to solve a performance deterioration problem of the heat-radiating substrate and a heat generating element and improve a heat-radiating performance.

摘要翻译： 这里公开了散热基板及其制造方法。 散热基板包括：阳极氧化基板，其具有形成在金属基板上的阳极氧化膜; 形成在所述阳极氧化基板的一个表面上的电路图案; 以及形成在阳极氧化基板的另一表面上的金属层。 形成在阳极氧化基板的另一个表面上的金属层具有与在其一个表面上形成的电路图案相同的面积，并且形成在阳极氧化基板的边缘内。 添加金属层，使得可以使基板的翘曲问题最小化。 此外，散热板与阳极化基板直接接触，从而可以解决散热基板和发热元件的性能劣化问题，并提高散热性能。

公开(公告)号：US20110312109A1

公开(公告)日：2011-12-22

申请号：US13220258

申请日：2011-08-29

申请人： Young Ki LEE ,  Seog Moon CHOI ,  Sang Hyun SHIN

发明人： Young Ki LEE ,  Seog Moon CHOI ,  Sang Hyun SHIN

IPC分类号： H01L33/48

CPC分类号： H01L33/483 ,  H01L25/0753 ,  H01L33/58 ,  H01L33/62 ,  H01L33/641 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2924/00014 ,  H01L2924/00

摘要： An LED package having an anodized insulation layer which increases heat radiation effect to prolong the lifetime LEDs and maintains high luminance and high output, and a method therefor. The LED package includes an Al substrate having a reflecting region and a light source mounted on the substrate and connected to patterned electrodes. The package also includes an anodized insulation layer formed between the patterned electrodes and the substrate and a lens covering over the light source of the substrate. The Al substrate provides superior heat radiation effect of the LED, thereby significantly increasing the lifetime and light emission efficiency of the LED.

摘要翻译： 一种具有阳极氧化绝缘层的LED封装，其方法为增加散热效果以延长寿命LED并保持高亮度和高输出。 LED封装包括具有反射区域的Al衬底和安装在衬底上并连接到图案化电极的光源。 封装还包括形成在图案化电极和衬底之间的阳极化绝缘层和覆盖在衬底的光源上的透镜。 Al衬底提供了LED的优异的散热效果，从而显着增加了LED的寿命和发光效率。

公开(公告)号：US20110065219A1

公开(公告)日：2011-03-17

申请号：US12952760

申请日：2010-11-23

申请人： Sang Hyun SHIN ,  Seog Moon Choi ,  Young Ki Lee

发明人： Sang Hyun SHIN ,  Seog Moon Choi ,  Young Ki Lee

IPC分类号： H01L33/52 ,  H05K3/10

CPC分类号： H01L33/486 ,  H01L33/641 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2924/01322 ,  H05K1/053 ,  H05K3/0052 ,  Y10T29/49155 ,  H01L2924/00014 ,  H01L2924/00

摘要： A circuit board for a light emitting diode package improved in heat radiation efficiency and a manufacturing method thereof. In a simple manufacturing process, insulating layers are formed by anodizing on a portion of a thermally conductive board body and plated with a conductive material. In the light emitting diode package, a board body is made of a thermally conductive metal. Insulating oxidation layers are formed at a pair of opposing edges of the board body. First conductive patterns are formed on the insulating oxidation layers, respectively. Also, second conductive patterns are formed in contact with the board body at a predetermined distance from the first conductive patterns, respectively. The light emitting diode package ensures heat generated from the light emitting diode to radiate faster and more effectively. Additionally, the insulating layers are formed integral with the board body by anodizing, thus enhancing productivity and durance.

摘要翻译： 一种用于散热效率提高的发光二极管封装的电路板及其制造方法。 在简单的制造工艺中，通过在导热板本体的一部分上阳极氧化并且电镀导电材料来形成绝缘层。 在发光二极管封装中，板体由导热金属制成。 绝缘氧化层形成在板体的一对相对的边缘处。 分别在绝缘氧化层上形成第一导电图案。 此外，第二导电图案分别形成为与板体相距预定距离与第一导电图案接触。 发光二极管封装确保了发光二极管产生的热量更快更有效地辐射。 此外，绝缘层通过阳极氧化与板体一体形成，从而提高生产率和耐久性。

公开(公告)号：US20090227050A1

公开(公告)日：2009-09-10

申请号：US12467513

申请日：2009-05-18

申请人： Sang Hyun SHIN ,  Seog Moon CHOI ,  Young Ki LEE

发明人： Sang Hyun SHIN ,  Seog Moon CHOI ,  Young Ki LEE

IPC分类号： H01L21/00

CPC分类号： H01L33/483 ,  H01L33/60 ,  H01L33/641 ,  H01L2224/48091 ,  H01L2924/00014

摘要： A high luminance and high output LED package using an LED as a light source and a fabrication method thereof. The LED package includes an Al substrate with a recessed multi-stepped reflecting surface formed therein and a light source composed of LEDs mounted on the reflecting surface and electrically connected to patterned electrodes. The LED package also includes anodized insulation layers formed between the patterned electrodes and the substrate, and an encapsulant covering over the light source of the substrate. The LED package further includes an Al heat radiator formed under the LEDs to enhance heat radiation capacity. According to the present invention, the substrate is made of Al material and anodized to form insulation layers thereon, allowing superior heat radiation effect of the LED, thereby significantly increasing the lifetime and light emission efficiency of the LED package.

摘要翻译： 使用LED作为光源的高亮度和高输出LED封装及其制造方法。 LED封装包括Al基板，其中形成有凹入的多阶反射表面，以及由安装在反射表面上并与图案化电极电连接的LED组成的光源。 LED封装还包括形成在图案化电极和衬底之间的阳极氧化绝缘层，以及覆盖在衬底的光源上的密封剂。 LED封装还包括形成在LED下面的Al散热器，以增强散热能力。 根据本发明，基板由Al材料制成并阳极氧化以在其上形成绝缘层，从而允许LED的良好的散热效果，从而显着提高LED封装的寿命和发光效率。

公开(公告)号：US20150084089A1

公开(公告)日：2015-03-26

申请号：US14555186

申请日：2014-11-26

申请人： Young Ki LEE ,  Seog Moon CHOI ,  Sang Hyun SHIN

发明人： Young Ki LEE ,  Seog Moon CHOI ,  Sang Hyun SHIN

IPC分类号： H01L33/48 ,  H01L33/62

CPC分类号： H01L33/486 ,  H01L33/60 ,  H01L33/62 ,  H05K3/28 ,  H05K2203/0315 ,  H05K2203/0542

摘要： An insulation structure for high temperature conditions and a manufacturing method thereof. In the insulation structure, a substrate has a conductive pattern formed on at least one surface thereof for electrical connection of a device. A metal oxide layer pattern is formed on a predetermined portion of the conductive pattern by anodization, the metal oxide layer pattern made of one selected from a group consisting of Al, Ti and Mg.

摘要翻译： 一种用于高温条件的绝缘结构及其制造方法。 在绝缘结构中，衬底具有形成在其至少一个表面上的用于电连接器件的导电图案。 通过阳极氧化在导电图案的预定部分上形成金属氧化物层图案，金属氧化物层图案由选自Al，Ti和Mg的一种形成。

公开(公告)号：US20090095975A1

公开(公告)日：2009-04-16

申请号：US12332678

申请日：2008-12-11

申请人： Sang Hyun SHIN ,  Seog Moon Choi ,  Young Ki Lee ,  Yong Sik Kim

发明人： Sang Hyun SHIN ,  Seog Moon Choi ,  Young Ki Lee ,  Yong Sik Kim

IPC分类号： H01L33/00

CPC分类号： H01L33/62 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L2224/26175 ,  H01L2224/29 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29339 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/83385 ,  H01L2224/83805 ,  H01L2924/00013 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/12041 ,  H01L2924/157 ,  H01L2924/15724 ,  H01L2924/15747 ,  H01L2924/15787 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/00012 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299

摘要： A light emitting diode package for preventing an electric short circuit among semiconductor layers and with excellent bonding strength. The light emitting diode package includes a package substrate, a light emitting diode chip bonded to an upper surface of the package substrate, and a bonding material for bonding the light emitting diode chip to the package substrate. The package substrate has a recess formed in a bonding surface thereof to accommodate the bonding material.

摘要翻译： 一种用于防止半导体层之间的电短路并且具有优异的接合强度的发光二极管封装。 发光二极管封装包括封装衬底，结合到封装衬底的上表面的发光二极管芯片，以及用于将发光二极管芯片接合到封装衬底的接合材料。 封装基板具有形成在其接合表面中的凹部以容纳接合材料。

公开(公告)号：US20120001544A1

公开(公告)日：2012-01-05

申请号：US12904512

申请日：2010-10-14

申请人： Tae Hoon KIM ,  Sang Hyun SHIN ,  Cheol Ho HEO ,  Young Ki LEE ,  Ji Hyun PARK ,  Ki Ho SEO

发明人： Tae Hoon KIM ,  Sang Hyun SHIN ,  Cheol Ho HEO ,  Young Ki LEE ,  Ji Hyun PARK ,  Ki Ho SEO

IPC分类号： H01J7/44 ,  H01J9/00

CPC分类号： H01L25/167 ,  H01L27/3276 ,  H01L27/3288 ,  H01L33/641 ,  H01L51/529 ,  H01L2924/0002 ,  H05K1/0203 ,  H05K3/445 ,  H05K2201/10106 ,  H05K2201/10128 ,  H05K2203/0315 ,  H01L2924/00

摘要： Disclosed are a light emitting module and a method of manufacturing the light emitting module. The light emitting module includes: a heat radiating substrate which includes a metal substrate with through holes, an internal insulating layer formed along inner walls of the through holes, and an external insulating layer covering all outer surfaces of the metal substrate; a light emitting component unit disposed on a top surface of the heat radiating substrate; a driving circuit unit which is electrically connected to the light emitting component unit, and is mounted on the heat radiating substrate to apply a driving signal to the light emitting component unit; a passive component which is mounted on the heat radiating substrate and is electrically connected to the driving circuit unit; and circuit wiring layers which are disposed on a top and a bottom of the heat radiating substrate, respectively, and are interconnected therebetween through vias formed on the through holes with the internal insulating layer of the heat radiating substrate, and play a role of electrical interconnection of the driving circuit unit and the light emitting component unit, or the driving circuit unit and the passive component.

摘要翻译： 公开了发光模块和制造发光模块的方法。 发光模块包括：散热基板，其包括具有通孔的金属基板，沿着通孔的内壁形成的内部绝缘层，以及覆盖金属基板的所有外表面的外部绝缘层; 设置在散热基板的上表面上的发光部件单元; 驱动电路单元，其电连接到所述发光部件单元，并且安装在所述散热基板上以向所述发光部件单元施加驱动信号; 无源部件，其被安装在散热基板上并电连接到驱动电路单元; 以及电路布线层，其分别设置在散热基板的顶部和底部，并且通过形成在通孔上的通孔与散热基板的内部绝缘层相互连接，并且起到电互连的作用 驱动电路单元和发光部件单元，或者驱动电路单元和无源部件。

公开(公告)号：US20200285674A1

公开(公告)日：2020-09-10

申请号：US16812222

申请日：2020-03-06

申请人： Sang Hyun SHIN

发明人： Sang Hyun SHIN

IPC分类号： G06F16/93 ,  G06F3/0484 ,  G06F16/9535

摘要： Provided is a method for providing a customized identification (ID) card performed by a computing device. The method comprises displaying a profile of a user, and displaying an ID card of the user in response to selecting the profile of the user, wherein the ID card comprises one or more functional elements, and a layout of the ID card is customized according to an input of the user.

公开(公告)号：US20200285355A1

公开(公告)日：2020-09-10

申请号：US16812227

申请日：2020-03-06

申请人： Sang Hyun SHIN

发明人： Sang Hyun SHIN

IPC分类号： G06F3/0482 ,  G06F3/0486 ,  G06F3/0484

摘要： Provided is a method for customizing the color of an object on an application driven by a computing device. The method comprises configuring a palette including at least one palette color, displaying a color list of the palette, and customizing the color of the object by applying a palette color selected by a user from the color list to the object, wherein the at least one palette color includes a first partial color and a second partial color, which is distinguished from the first partial color.