摘要:
A semiconductor device (2) includes: a FLR (65) that is disposed on a semiconductor substrate so as to divide the semiconductor substrate into an inner region and an outer region; a first bonding pad (24a to 24d) that is disposed in the inner region and is connected to an external circuit by a wire (14a to 14d) whose one end is connected to the external circuit; and a second bonding pad (26a to 26d) that is disposed in the outer region and on which the other end of the wire is bonded.
摘要:
A cab includes left and right rear pole members having internal spaces and prescribed shapes in cross-section. The right rear pole member includes a first hole portion that extends along the longitudinal direction of the right rear pole member and penetrates the right rear pole member in the left-and-right direction of the right rear pole member, and a first plate-shaped member inserted into and secured in the first hole portion.
摘要:
A thin-film transistor includes a gate layer, a gate insulting layer, a semiconductor layer, a drain layer, a passivation layer (each of which being formed on or over an insulating substrate), and a conductive layer formed on the passivation layer. The conductive layer is connected to the gate layer or the drain layer by way of a contact hole penetrating at least the passivation layer. The passivation layer has a multiple-layer structure comprising at least a first sublayer and a second sublayer stacked, the first sublayer having a lower etch rate than that of the second sublayer. The first sublayer is disposed closer to the substrate than the second sublayer. The second sublayer has a thickness equal to or less than that of the conductive layer. The shape or configuration of the passivation layer and the underlying gate insulating layer can be well controlled in the etching process, and the conductive layer formed on the passivation layer is prevented from being divided.
摘要:
A method for manufacturing a liquid crystal display that provides a wide viewing angle and in which its manufacturing processes are shortened and high reliability is provided. The method includes the steps of forming a gate electrode metal layer and forming a gate electrode by patterning using photolithography; forming an interlayer insulating film, an a−Si layer, an n+ a−Si layer, and a drain electrode metal layer and forming a drain line and an island by performing patterning, ashing processing, reflow processing using photolithography, and peeling; forming an insulating film on a transparent insulating substrate and forming an insulating film contact used to provide a connection to a source electrode of an island at a specified position by patterning or a printing method; forming a transparent conductive film and forming a pixel electrode and common electrode by patterning using photolithography.
摘要:
Disclosed is a macromolecule-crystal forming apparatus and method capable of obtaining a macromolecule crystal in a simplified and efficient manner. The device comprises a first container containing a sample of macromolecule, a second container containing a gel acting as a buffer material during the crystallization of the macromolecule, and a third container containing a precipitant solution having a function of facilitating the aggregation of molecules during the crystallization of the macromolecule. These containers are connected together in a given manner so as to allow the macromolecule sample and the precipitant to be brought into contact with one another through the gel to induce the crystallization of the macromolecule.
摘要:
A commutator utilizing a carbon composite base material, the carbon composite base material including a carbon base material; and an iron layer. The iron layer, to which a metal material can be joined, is formed on a surface of the carbon base material, iron powders, which are used to form the iron layer, are subjected to a treatment so as to increase surface-adsorbed oxygen before placing the iron powders to the surface of the carbon base material that is formed in advance by sintering, and sintering is applied to the iron powders placed on the surface of the carbon base material at a temperature not less than a diffusion temperature of carbon and not more than a melting point of iron in order to form the iron layer on the surface of the carbon base material.
摘要:
The present invention relates to a polishing composition for a substrate including a metal such as wiring, etc., formed on a semiconductor wafer, which can provide a high polishing rate without causing scratches on the wiring metal, a method of producing the polishing composition, and a polishing method. The polishing composition for a semiconductor wafer comprises an acid and an aqueous medium dispersion containing positively-charged silica particles having an amino group-containing silane coupling agent bonded on a surface thereof, the polishing composition having a pH of 2 to 6.
摘要:
A thin-film transistor includes a gate layer, a gate insulting layer, a semiconductor layer, a drain layer, a passivation layer (each of which being formed on or over an insulating substrate), and a conductive layer formed on the passivation layer. The conductive layer is connected to the gate layer or the drain layer by way of a contact hole penetrating at least the passivation layer. The passivation layer has a multiple-layer structure comprising at least a first sublayer and a second sublayer stacked, the first sublayer having a lower etch rate than that of the second sublayer. The first sublayer is disposed closer to the substrate than the second sublayer. The second sublayer has a thickness equal to or less than that of the conductive layer. The shape or configuration of the passivation layer and the underlying gate insulating layer can be well controlled in the etching process, and the conductive layer formed on the passivation layer is prevented from being divided.
摘要:
A solid-state imaging device is provided. The imaging device includes an imaging portion which includes light receiving portions and vertical transfer registers, a horizontal transfer portion, an output part for outputting an electrical signal converted from electric charges transferred from the horizontal transfer portion, a first reference potential applying means, and a second reference potential applying means. The imaging portion, the horizontal transfer portion and the output part are formed in a first conductivity type semiconductor substrate having a second conductivity type region, and a reference potential is applied to the second conductivity type semiconductor region. The first reference potential applying means applies a reference potential to the second conductivity type semiconductor region corresponding to an area where the output part is formed. The second reference potential applying means applies a reference potential to the second conductivity type semiconductor region corresponding to an area where the imaging portion is formed.
摘要:
A solid-state imaging device and a charge transfer method are provided. The solid-state imaging device includes light receiving portions arranged in a matrix of rows and columns, vertical transfer portions, and a horizontal transfer portion. The vertical transfer portions are formed for each column of the matrix of the light receiving portions, for transferring charges transferred from the light receiving portions in a vertical direction. The horizontal transfer portion transfers the charges transferred from the vertical transfer portions in a horizontal direction. The vertical transfer portions divide the charges transferred to the vertical transfer portions and transfer the divided charges in the vertical direction. The horizontal transfer portion transfers the divided charges in a mixed state in the horizontal direction.