公开(公告)号：US20050194687A1

公开(公告)日：2005-09-08

申请号：US11114118

申请日：2005-04-26

申请人： Koji Yamaguchi

发明人： Koji Yamaguchi

IPC分类号： H01L23/12 ,  H01L21/60 ,  H01L23/31 ,  H01L23/485 ,  H01L23/48 ,  H01L21/44

CPC分类号： H01L24/12 ,  H01L23/3114 ,  H01L24/11 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/0231 ,  H01L2224/0401 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/81801 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/00

摘要： A semiconductor substrate has an integrated circuit, an interconnect electrically connected to the inside of the semiconductor substrate, and an electrode formed on the interconnect. A plurality of resin layers are separately formed on the semiconductor substrate so that part of the semiconductor substrate is exposed. A redistribution interconnect is electrically connected to the electrode. An external terminal is formed on the redistribution interconnect and supported by the resin layers.

公开(公告)号：US06915092B2

公开(公告)日：2005-07-05

申请号：US10669054

申请日：2003-09-24

申请人： Koji Yamaguchi ,  Tomonori Mori ,  Yasufumi Yoshino

发明人： Koji Yamaguchi ,  Tomonori Mori ,  Yasufumi Yoshino

IPC分类号： G03G21/18 ,  G03G15/00

CPC分类号： G03G21/181 ,  G03G21/1875 ,  G03G2215/00987

摘要： A remanufacturing method for remanufacturing a process cartridge includes (i) a pin removing step of removing a pin which connects a transfer member unit and a drum unit; (ii) a drum unit removing step; (iii) a one-end cover removing step of removing an end cover from one longitudinal end of the transfer member unit; (iv) a screw unit removing step of removing a screw unit, disposed in a removed developer accommodating portion, provided in the transfer member unit; (v) a developer removing step of removing the developer accommodated in the removed developer accommodating portion through the opening of the screw unit; (vi) a screw unit mounting step of inserting a screw into the removed developer accommodating portion through the opening of the screw unit, and mounting the screw unit to a transfer member unit frame; (vii) a one-end cover mounting step of mounting the one-end cover to the transfer member unit; and (viii) a coupling step of coupling the transfer member unit and the drum unit by pins.

摘要翻译： 一种用于再制造处理盒的再制造方法包括：（i）去除拆卸连接转印构件单元和鼓单元的销的销的移除步骤; （ii）鼓单元去除步骤; （iii）一端盖拆卸步骤，从所述转移构件单元的一个纵向端部移除端盖; （iv）螺钉单元去除步骤，其移除设置在所述转移构件单元中的设置在去除的显影剂容纳部分中的螺钉单元; （v）通过螺杆单元的开口去除容纳在去除的显影剂容纳部分中的显影剂的显影剂移除步骤; （vi）螺钉单元安装步骤，通过螺钉单元的开口将螺钉插入去除的显影剂容纳部分，并将螺钉单元安装到转印构件单元框架上; （vii）一端盖安装步骤，将一端盖安装到转印件单元上; 和（viii）通过销将所述转移构件单元和所述鼓单元联接的联接步骤。

公开(公告)号：US20050048698A1

公开(公告)日：2005-03-03

申请号：US10898174

申请日：2004-07-26

申请人： Koji Yamaguchi

发明人： Koji Yamaguchi

IPC分类号： H01L25/18 ,  H01L21/768 ,  H01L23/31 ,  H01L23/48 ,  H01L25/065 ,  H01L25/07 ,  H01L21/44 ,  H01L21/48 ,  H01L21/50

CPC分类号： H01L21/76898 ,  H01L23/3114 ,  H01L23/481 ,  H01L23/49816 ,  H01L24/48 ,  H01L24/97 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/05001 ,  H01L2224/05009 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05548 ,  H01L2224/13025 ,  H01L2224/16 ,  H01L2224/16145 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06586 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2224/85 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： Exemplary embodiments of the present invention include a semiconductor device, a method for manufacturing the same, a circuit board and an electronic apparatus with increased productivity and reliability. An exemplary method for manufacturing a semiconductor device of the present invention includes forming a conductive part in a concave part on a first surface of a semiconductor substrate, the first surface having a plurality of chip mounting areas. Stacking at least one semiconductor chip in each of the chip mounting areas, providing a sealing member on the first surface of the semiconductor substrate and making part of a second surface of the semiconductor substrate thin so as to make the conductive part penetrate from the first surface to the second surface.

摘要翻译： 本发明的示例性实施例包括具有提高的生产率和可靠性的半导体器件，其制造方法，电路板和电子设备。 本发明的制造半导体器件的示例性方法包括在半导体衬底的第一表面上的凹部中形成导电部件，第一表面具有多个芯片安装区域。 在每个芯片安装区域中堆叠至少一个半导体芯片，在半导体衬底的第一表面上提供密封构件，并使半导体衬底的第二表面的一部分变薄，以使导电部分从第一表面 到第二个表面。

公开(公告)号：US06603210B2

公开(公告)日：2003-08-05

申请号：US09902746

申请日：2001-07-12

申请人： Kiyoharu Kishimoto ,  Ryuzo Fukao ,  Koji Yamaguchi ,  Hiroyuki Tsukamoto ,  Yuji Yamashita ,  Yuji Kikuchi ,  Tomonori Kanai

发明人： Kiyoharu Kishimoto ,  Ryuzo Fukao ,  Koji Yamaguchi ,  Hiroyuki Tsukamoto ,  Yuji Yamashita ,  Yuji Kikuchi ,  Tomonori Kanai

IPC分类号： H01L2348

CPC分类号： H01L21/6835 ,  H01L21/4846 ,  H01L23/3121 ,  H01L23/498 ,  H01L24/97 ,  H01L2221/68345 ,  H01L2224/16225 ,  H01L2224/81005 ,  H01L2224/97 ,  H01L2924/07811 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/3025 ,  H05K1/0233 ,  H05K1/113 ,  H05K3/0058 ,  H05K3/205 ,  H05K3/284 ,  H05K3/4644 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49155 ,  H01L2224/81 ,  H01L2924/00

摘要： For producing a semiconductor module, an electrically insulating layer and an electrically conductive layer are formed on a Nickel-base metal film over a metallic surface, the electrically conductive layer is connected electrically to an electric element through an electrically conductive joint arranged between the electric element and the electrically conductive layer, at least a part of the electric element and at least a part of the electrically conductive joint are covered with a molding resin, and subsequently, the Nickel-base metal film is removed from the metallic surface so that a combination of the Nickel-base metal film, the electrically insulating layer, the electrically conductive layer, the electrically conductive joint and the molding resin is separated from the metallic surface.

公开(公告)号：US06394898B1

公开(公告)日：2002-05-28

申请号：US09043927

申请日：1998-07-29

申请人： Yuji Nagao ,  Takanori Akiyama ,  Naoki Kawajiri ,  Seiji Hayashi ,  Susumu Murata ,  Koji Yamaguchi ,  Yuji Ikeda ,  Mitsuru Todaiji ,  Yasuhiro Takagi ,  Shunichi Nakamura ,  Keiji Yano ,  Muneoki Kamata ,  Shingo Kataoka ,  Koji Osuka

发明人： Yuji Nagao ,  Takanori Akiyama ,  Naoki Kawajiri ,  Seiji Hayashi ,  Susumu Murata ,  Koji Yamaguchi ,  Yuji Ikeda ,  Mitsuru Todaiji ,  Yasuhiro Takagi ,  Shunichi Nakamura ,  Keiji Yano ,  Muneoki Kamata ,  Shingo Kataoka ,  Koji Osuka

IPC分类号： A63F922

CPC分类号： A63F9/143

摘要： A loop track for race horses is disposed at the center of a horse race game device. Twelve race horses run on the track. A gate is disposed in a paddock in the track. The gate is advanced to a start point of the track from the paddock. Twelve satellites are disposed on three sides of the track. A large projector for displaying images of developments, etc. of a race is disposed on one of the short sides of the track. Speakers for live broadcasting, fanfares, BGM, etc. are disposed on both sides of the large projector. The horse race game device enables a larger number of running objects to be raced at once, whereby race developments are made more amusing.

摘要翻译： 赛马的赛道是放置在赛马游戏装置的中心。 十二匹马跑在赛道上。 一个门被放置在轨道上的围场。 门从提升到从围场开始的轨道。 十二颗卫星设在轨道的三侧。 用于显示比赛的发展等的图像的大型投影仪设置在轨道的短边之一上。 现场直播，粉丝，BGM等的扬声器都放置在大型投影机的两侧。 赛马游戏装置可以让更多的跑步物品一次性进行比赛，从而让种族发展变得更有趣。

公开(公告)号：US6042765A

公开(公告)日：2000-03-28

申请号：US762056

申请日：1996-12-09

申请人： Hiroshi Sugahara ,  Koji Yamaguchi ,  Yoshitaka Nakatani ,  Koichi Hirao

发明人： Hiroshi Sugahara ,  Koji Yamaguchi ,  Yoshitaka Nakatani ,  Koichi Hirao

IPC分类号： B29C44/32 ,  B29C70/50 ,  B29C70/52 ,  B29C44/24

CPC分类号： B29C44/32 ,  B29C70/506 ,  B29C70/508 ,  B29C70/52

摘要： A method of the invention can produce a fiber-reinforced thermoplastic resin foamed product having less unevenness in a thickness of a surface layer and excellent mechanical strength. In the method, a fiber-reinforced thermoplastic resin sheet is continuously shaped into a hollow member, and a foaming resin composition containing a thermoplastic resin and a foaming agent is supplied into an interior of the obtained hollow member. The foaming agent is foamed so that the hollow member is shaped into a desired form by the foaming pressure.

摘要翻译： 本发明的方法可以生产出具有较小表面层厚度不均匀性和优异机械强度的纤维增强热塑性树脂发泡产品。 在该方法中，将纤维增强热塑性树脂片连续成形为中空部件，将含有热塑性树脂和发泡剂的发泡性树脂组合物供给到所得中空部件的内部。 发泡剂发泡，使得中空构件通过发泡压力成形为所需形状。

公开(公告)号：US05999648A

公开(公告)日：1999-12-07

申请号：US613927

申请日：1996-03-11

申请人： Koji Yamaguchi

发明人： Koji Yamaguchi

IPC分类号： G06F3/033 ,  G06F3/037 ,  G06F3/048 ,  G06K9/22 ,  G06K9/62

CPC分类号： G06F3/04883 ,  G06K9/00416

摘要： In a character-figure editing apparatus, a user can correctly select a desired character or figure from a plurality of characters and figures on a display section. The user inputs the character, the figure, and the editing operation by handwriting. A decision section identifies the handwritten information as one of the character, the figure and the editing operation. A memory section stores the character information and the figure information identified by the decision section. A display section displays the input handwriting information, the character and the figure stored in the memory section. The input handwritten information is temporarily stored as a series of coordinates in order. The decision section selects a corresponding character or figure in accordance with the input handwritten information when the handwritten information is identified as the editing operation. Then an editing section edits the character or the figure in accordance with the editing operation.

摘要翻译： 在字符图形编辑装置中，用户可以从显示部分上的多个字符和图形中正确地选择期望的字符或图形。 用户通过手写输入字符，图形和编辑操作。 决定部分将手写信息识别为字符，图形和编辑操作之一。 存储器部分存储由判定部分识别的字符信息和图形信息。 显示部分显示存储在存储器部分中的输入手写信息，字符和图形。 输入的手写信息按照一系列的坐标被暂时存储。 当手写信息被识别为编辑操作时，判定部分根据输入的手写信息来选择对应的字符或图形。 然后编辑部分根据编辑操作编辑字符或图形。

公开(公告)号：US5716670A

公开(公告)日：1998-02-10

申请号：US434759

申请日：1995-05-04

申请人： Jin-Joo Park ,  Atsushi Kimura ,  Koji Yamaguchi ,  Akira Yamakawa

发明人： Jin-Joo Park ,  Atsushi Kimura ,  Koji Yamaguchi ,  Akira Yamakawa

IPC分类号： C01B21/068 ,  C04B35/593 ,  C04B35/626 ,  B05D7/00

CPC分类号： C04B35/5935 ,  C01B21/0687 ,  C01P2004/80 ,  C01P2006/10 ,  Y10T428/2991 ,  Y10T428/2993

摘要： The invention relates to material silicon nitride powder used for production of silicon nitride ceramics products. Provided herein is a material powder which can offer a compact having a homogeneous packing structure of the powder with good reproducibility and also to provide a method for producing the same. Accordingly to the method, a silicon nitride powder is heat treated in two-stage processing, one stage in an inert gas or reducing atmosphere at 100.degree. C.-1000.degree. C. for 5-600 min., and another stage in an oxidizing atmosphere at 300.degree. C.-1200.degree. C. for 5-600 min. As a result of this treatment, a silicon nitride powder is obtained in which its powder particles are crystalline in their interior and are coated with an amorphous layer having a 1-10 nm surface thickness and composed mainly of Si, N, O, and H, an atomic number ratio of oxygen to nitrogen (O/N) of the surface layer being within a range of 0.1-2.0.

摘要翻译： 本发明涉及用于生产氮化硅陶瓷制品的材料氮化硅粉末。 本文提供的是能够提供具有良好重现性的具有粉末的均匀包装结构的压块的材料粉末，并且还提供其制造方法。 根据该方法，氮化硅粉末在二级加工中进行热处理，在惰性气体或还原气氛中，在100℃-1000℃下进行5-600分钟，另一阶段为氧化 气氛在300℃-1200℃下进行5-600分钟。 作为该处理的结果，得到其粉末颗粒在其内部是结晶的氮化硅粉末，并且涂覆有具有1-10nm表面厚度并且主要由Si，N，O和H组成的非晶层 表面层的氧与氮的原子数比（O / N）在0.1〜2.0的范围内。

公开(公告)号：US5478649A

公开(公告)日：1995-12-26

申请号：US219377

申请日：1994-03-29

申请人： Jin-Joo Park ,  Atsushi Kimura ,  Koji Yamaguchi ,  Akira Yamakawa

发明人： Jin-Joo Park ,  Atsushi Kimura ,  Koji Yamaguchi ,  Akira Yamakawa

IPC分类号： C01B21/068 ,  C04B35/593 ,  C04B35/626 ,  B32B5/16 ,  C01B21/06

CPC分类号： C04B35/5935 ,  C01B21/0687 ,  C01P2004/80 ,  C01P2006/10 ,  Y10T428/2991 ,  Y10T428/2993

摘要： The invention relates to material silicon nitride powder used for production of silicon nitride ceramics products. Provided herein is a material powder which can offer a compact having a homogeneous packing structure of the powder with good reproducibility and also to provide a method for producing the same. According to the method, a silicon nitride powder is heat treated in two-stage processing, one stage in an inert gas or reducing atmosphere at 100.degree. C.-1000.degree. C. for 5-600 min., and another stage in an oxidizing atmosphere at 300.degree. C.-1200.degree. C. for 5-600 min. As a result of this treatment, a silicon nitride powder is obtained in which its powder particles are crystalline in their interior and are coated with an amorphous layer having a 1-10 nm surface thickness and composed mainly of Si, N, O, and H, an atomic number ratio of oxygen to nitrogen (O/N) of the surface layer being within a range of 0.1-2.0.

摘要翻译： 本发明涉及用于生产氮化硅陶瓷制品的材料氮化硅粉末。 本文提供的是能够提供具有良好重现性的具有粉末的均匀包装结构的压块的材料粉末，并且还提供其制造方法。 根据该方法，氮化硅粉末在两步加工中进行热处理，在惰性气体或还原气氛中，在100℃-1000℃下进行5-600分钟，另一阶段在氧化 气氛在300℃-1200℃下进行5-600分钟。 作为该处理的结果，得到其粉末颗粒在其内部是结晶的氮化硅粉末，并且涂覆有具有1-10nm表面厚度并且主要由Si，N，O和H组成的非晶层 表面层的氧与氮的原子数比（O / N）在0.1〜2.0的范围内。

公开(公告)号：US09382454B2

公开(公告)日：2016-07-05

申请号：US12951310

申请日：2010-11-22

申请人： Toshitaka Suzuki ,  Takeshi Igarashi ,  Hiroko Ikenaga ,  Yuki Saitou ,  Shinji Inokuchi ,  Koji Yamaguchi ,  Yoshikuni Hirano

发明人： Toshitaka Suzuki ,  Takeshi Igarashi ,  Hiroko Ikenaga ,  Yuki Saitou ,  Shinji Inokuchi ,  Koji Yamaguchi ,  Yoshikuni Hirano

IPC分类号： C09J123/22 ,  C09J7/02 ,  B32B7/12 ,  B32B27/32

CPC分类号： C09J7/0296 ,  B32B7/12 ,  B32B27/32 ,  B32B27/322 ,  C09J7/243 ,  C09J7/29 ,  C09J123/22 ,  C09J2201/622 ,  C09J2203/306 ,  C09J2203/31 ,  C09J2423/006 ,  C09J2423/046 ,  Y10T428/2495 ,  Y10T428/28 ,  Y10T428/2878

摘要： A paint film-protecting sheet (1) that effectively prevents adhesive transfer to the paint film is provided. The paint film-protecting sheet (1) includes a pressure-sensitive adhesive (PSA) layer (20), which is comprised of a non-crosslinking PSA, disposed on a polyolefin-based resin film serving as a supporting substrate (10). At least a surface portion (12) of the supporting substrate which adjoins the PSA layer is formed of a resin material that satisfies both of the following conditions: (1) it contains W wt % of a LLDPE having a density d of 0.925 g/cm3 or less, wherein W is greater than or equal to 20; and (2) it has a LLDPE content index α of 400 or more, the LLDPE content index α being defined as (0.935−d)×W×1000.

摘要翻译： 提供了有效地防止粘合剂转移到漆膜的防漆薄片（1）。 涂膜保护片（1）包括设置在用作支撑衬底（10）的聚烯烃基树脂膜上的由非交联PSA组成的压敏粘合剂（PSA）层（20）。 至少邻接粘合剂层的支撑基材的表面部分（12）由满足以下条件的树脂材料形成：（1）其含有W wt％的密度d为0.925g / cm3以下，其中W大于或等于20; 和（2）其LLDPE含量指数α为400以上，LLDPE含量指数α定义为（0.935-d）×W×1000。