公开(公告)号：US10903392B2

公开(公告)日：2021-01-26

申请号：US16090635

申请日：2017-04-06

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Jürgen Moosburger ,  Matthias Sabathil ,  Frank Singer

IPC: H01L33/02 ,  H01L27/15 ,  H01L21/66 ,  H01L33/00 ,  H01L33/38 ,  H01L33/50

Abstract: A method of producing optoelectronic semiconductor components, the method includes: a) providing a composite comprising a semiconductor layer sequence including an active region that generates or receives radiation; b) determining a position of at least one defect region of the semiconductor layer sequence; c) forming a plurality of electrically contactable functional regions that each include a part of the semiconductor layer sequence and are free of a defect region; and d) separating the composite into a plurality of optoelectronic semiconductor components that each include at least one of the functional regions.

公开(公告)号：US10418529B2

公开(公告)日：2019-09-17

申请号：US15104434

申请日：2014-12-15

Applicant: OSRAM Opto Semiconductors GmbH ,  OSRAM GmbH

Inventor： Britta Göötz ,  Frank Singer ,  Roland Hüttinger

IPC: H01L33/50

Abstract: A conversion element includes a platelet including an inorganic glass, and first converter particles having a shell and a core, wherein the shell includes an inorganic material and the core includes a nitride or oxynitride luminescent material and the first converter particles are arranged on and/or in the platelet.

公开(公告)号：US10388633B2

公开(公告)日：2019-08-20

申请号：US15743244

申请日：2016-07-27

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Thomas Schwarz ,  Frank Singer ,  Christian Leirer

IPC: H01L33/52 ,  H01L33/58 ,  H01L33/62 ,  H01L25/075

Abstract: A video wall module and a method for producing a video wall module are disclosed. In embodiments, the video wall module includes a plurality of light emitting diode chips, each light emitting diode chip comprising a top electrode arranged at a top side of the light emitting diode chip, a bottom electrode arranged at a bottom side of the light emitting diode chip and a molded body embedding the light emitting diode chips, a front-side metallization arranged at the front side of the molded body, wherein the top electrodes are connected to the front-side metallization, a rear-side metallization arranged at a rear side of the molded body, wherein the bottom electrodes are connected to the rear-side metallization, a dielectric layer arranged at the rear side of the molded body and an outer metallization arranged at the dielectric layer, wherein the rear-side metallization is electrically conductively connected to the outer metallization.

公开(公告)号：US20190252350A1

公开(公告)日：2019-08-15

申请号：US16345449

申请日：2017-10-25

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Thomas Schwarz ,  Jürgen Moosburger ,  Frank Singer

IPC: H01L23/00 ,  H01L21/683 ,  B65G47/90

CPC classification number: H01L24/97 ,  B65G47/90 ,  H01L21/67144 ,  H01L21/6836 ,  H01L24/29 ,  H01L24/32 ,  H01L24/75 ,  H01L24/83 ,  H01L33/0095 ,  H01L2224/291 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/75303 ,  H01L2224/7565 ,  H01L2224/7598 ,  H01L2224/83192 ,  H01L2224/95001 ,  H01L2224/95136 ,  H01L2224/95146 ,  H01L2224/97 ,  H01L2224/83 ,  H01L2924/014 ,  H01L2924/00014

Abstract: A method of transferring semiconductor chips includes providing a transfer tool having a plurality of segments, each segment having a liquid receiving area; providing a plurality of semiconductor chips in a regular array on a source carrier; providing a target carrier; selectively arranging liquid drops on the liquid receiving areas of some of the segments; causing the transfer tool to approach the source carrier, each liquid drop contacting and wetting a semiconductor chip; lifting the transfer tool from the source carrier, wherein semiconductor chips wetted by liquid drops are lifted from the source carrier by the transfer tool; causing the target carrier by the transfer tool, to approach the semiconductor chips arranged on the transfer tool contacting the target carrier; and lifting the transfer tool from the target carrier, the semiconductor chips contacting the target carrier remaining on the target carrier

公开(公告)号：US20190189598A1

公开(公告)日：2019-06-20

申请号：US16322069

申请日：2017-08-01

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Frank Singer ,  Jürgen Moosburger ,  Thomas Schwarz ,  Lutz Hoeppel ,  Matthias Sabathil

IPC: H01L25/075 ,  H01L33/62 ,  H01L33/56 ,  H01L33/58

CPC classification number: H01L25/0753 ,  H01L33/54 ,  H01L33/56 ,  H01L33/58 ,  H01L33/62 ,  H01L2933/0066

Abstract: A multi-chip module is disclosed. In an embodiment, a multi-chip module includes a first carrier including a mold material and at least two light-emitting diode chips embedded at least by side faces in the first carrier, wherein the light-emitting diode chips have first electrical contacts on a front side and second electrical contacts on a rear side, wherein the front side is configured as a radiation side, wherein the first electrical contacts are connected to control lines, wherein the control lines are arranged on a front side of the first carrier, wherein the second electrical contacts are connected to a collective line, and wherein the collective line is led to a rear side of the first carrier.

公开(公告)号：US10217913B2

公开(公告)日：2019-02-26

申请号：US15036413

申请日：2014-10-30

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Markus Pindl ,  Thomas Schwarz ,  Frank Singer ,  Sandra Sobczyk

IPC: H01L33/54 ,  H01L33/00 ,  H01L31/0203 ,  H01L31/0232 ,  H01L31/18 ,  H01L33/50 ,  H01L33/48 ,  H01L33/56 ,  H01L21/56

Abstract: The invention relates to a method for producing a plurality of optoelectronic semiconductor components, comprising the following steps: preparing a plurality of semiconductor chips spaced in a lateral direction to one another; forming a housing body assembly, at least one region of which is arranged between the semiconductor chips; forming a plurality of fillets, each adjoining a semiconductor chip and being bordered in a lateral direction by a side surface of each semiconductor chip and the housing body assembly; and separating the housing body assembly into a plurality of optoelectronic components, each component having at least one semiconductor chip and a portion of the housing body assembly as a housing body, and each semiconductor chip not being covered by material of the housing body on a radiation emission surface of the semiconductor component, which surface is located opposite a mounting surface. The invention also relates to a semiconductor component.

公开(公告)号：US10193034B2

公开(公告)日：2019-01-29

申请号：US15328601

申请日：2015-07-08

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Matthias Sperl ,  Frank Singer

IPC: H01L33/00 ,  G02F1/1333 ,  H01L33/58 ,  H01L33/48 ,  H01L33/62 ,  H01L33/50 ,  H01L33/54

Abstract: A semiconductor device includes a semiconductor chip including an active region provided to generate radiation; a radiation exit face extending parallel to a main plane of extension of the active region; a molding directly adjoins at least one side face of the semiconductor device at least one back of the semiconductor chip remote from the radiation exit face; a mounting surface provided to mount the semiconductor device; and a spacer projecting beyond the radiation exit face in a vertical direction extending perpendicular to the radiation exit face.

公开(公告)号：US20180287008A1

公开(公告)日：2018-10-04

申请号：US15940929

申请日：2018-03-29

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Andreas Plößl ,  Siegfried Herrmann ,  Martin Rudolf Behringer ,  Frank Singer ,  Thomas Schwarz

IPC: H01L33/00 ,  H01L25/075 ,  H01L33/48

Abstract: A method for producing an optoelectronic semiconductor component and an optoelectronic semiconductor component are disclosed. In an embodiment the method include A) providing at least two source substrates, wherein each of the source substrates is equipped with a specific type of radiation-emitting semiconductor chip; B) providing a target substrate having a mounting plane, the mounting plane being configured for mounting the semiconductor chip; and C) transferring at least part of the semiconductor chips with a wafer-to-wafer process from the source substrates onto the target substrate so that the semiconductor chips, within one type, maintain their relative position with respect to one another, so that each type of semiconductor chips arranged on the target substrate has a different height above the mounting plane, wherein the semiconductor chips are at least one of at least partially stacked one above the other or at least partially applied to at least one casting layer.

公开(公告)号：US20180204823A1

公开(公告)日：2018-07-19

申请号：US15743244

申请日：2017-07-27

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Thomas Schwarz ,  Frank Singer ,  Christian Leirer

IPC: H01L25/075 ,  H01L33/52 ,  H01L33/62 ,  H01L33/58

CPC classification number: H01L25/0753 ,  H01L33/52 ,  H01L33/58 ,  H01L33/62 ,  H01L2933/005 ,  H01L2933/0058 ,  H01L2933/0066

Abstract: A video wall module and a method for producing a video wall module are disclosed. In embodiments, the video wall module includes a plurality of light emitting diode chips, each light emitting diode chip comprising a top electrode arranged at a top side of the light emitting diode chip, a bottom electrode arranged at a bottom side of the light emitting diode chip and a molded body embedding the light emitting diode chips, a front-side metallization arranged at the front side of the molded body, wherein the top electrodes are connected to the front-side metallization, a rear-side metallization arranged at a rear side of the molded body, wherein the bottom electrodes are connected to the rear-side metallization, a dielectric layer arranged at the rear side of the molded body and an outer metallization arranged at the dielectric layer, wherein the rear-side metallization is electrically conductively connected to the outer metallization.

公开(公告)号：US20180182943A1

公开(公告)日：2018-06-28

申请号：US15735990

申请日：2016-06-14

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Norwin von Malm ,  Frank Singer

IPC: H01L33/62 ,  H01L33/60 ,  H01L33/38 ,  F21V8/00 ,  H01L33/00

CPC classification number: H01L33/62 ,  G02B6/0073 ,  G02B6/0083 ,  H01L33/0095 ,  H01L33/382 ,  H01L33/486 ,  H01L33/60 ,  H01L2933/0066 ,  H01L2933/0091

Abstract: A component comprising a support and a semiconductor body arranged on the support, the support formed by a molded body and a metal layer. The metal layer has a first subregion and a second subregion laterally spaced apart by an intermediate space and thereby electrically separated. The molded body fills the intermediate space and has a surface extending in lateral directions free from the subregions of the metal layer and forms the rear side of the support. The support has a side face formed by a surface of the molded body extending in vertical directions, at least one of the subregions formed such that electrical contact can be made by way of the side face.