公开(公告)号：US20050122001A1

公开(公告)日：2005-06-09

申请号：US11037307

申请日：2005-01-18

申请人： Qing Ma ,  Dong Shim

发明人： Qing Ma ,  Dong Shim

IPC分类号： B81B3/00 ,  H03H9/02 ,  H03H9/05 ,  H03H9/25 ,  H01L41/107

CPC分类号： H03H9/0542 ,  H03H9/02779 ,  H03H9/6403

摘要： Microelectromechanical system (MEMS) apparatus and methods for surface acoustic wave (SAW) switching are disclosed. The apparatus includes a piezoelectric substrate having spaced apart input and output SAW transducers. A MEMS switch is arranged between the input and output SAW transducers The MEMS switch has a deformable member in electromagnetic communication with one or more actuation electrodes formed on or above the substrate. The deformable member is deformable to mechanically contact the substrate to deflect or absorb a SAW generated by the input SAW transducer.

摘要翻译： 公开了用于表面声波（SAW）切换的微机电系统（MEMS）装置和方法。 该装置包括具有间隔开的输入和输出SAW换能器的压电基片。 MEMS开关布置在输入和输出SAW换能器之间MEMS开关具有与形成在基板上或上方的一个或多个致动电极电磁连通的可变形构件。 可变形构件可变形以机械地接触衬底以偏转或吸收由输入SAW换能器产生的SAW。

公开(公告)号：US20050083158A1

公开(公告)日：2005-04-21

申请号：US10971793

申请日：2004-10-22

申请人： Qing Ma

发明人： Qing Ma

IPC分类号： B81B3/00 ,  H01H59/00 ,  H01L21/00

CPC分类号： H01H59/0009

摘要： A microelectromechanical system (MEMS) switch that includes a signal contact, an actuation electrode and a beam that engages the signal contact when a voltage is applied to the actuation electrode. The signal contact includes a first portion and a second portion. The actuation electrode is positioned between the first and second portions of the signal contact.

摘要翻译： 一种微电子机械系统（MEMS）开关，其包括信号触点，致动电极和当电压施加到致动电极时与信号触点接合的光束。 信号触点包括第一部分和第二部分。 致动电极位于信号触点的第一和第二部分之间。

公开(公告)号：US06737754B2

公开(公告)日：2004-05-18

申请号：US09777833

申请日：2001-02-05

申请人： Qing Ma ,  Jin Lee ,  Chun Mu ,  Quat Vu ,  Jian Li ,  Larry Mosley

发明人： Qing Ma ,  Jin Lee ,  Chun Mu ,  Quat Vu ,  Jian Li ,  Larry Mosley

IPC分类号： H01L2328

CPC分类号： H01L23/3121 ,  H01L23/4334 ,  H01L2924/0002 ,  H01L2924/12044 ,  H01L2924/00

摘要： A semiconductor device having a multilayer laminate that includes a thermally stable, flexible polymer film, a semiconductor die, a molding compound, and a heat dissipation member. The die has an active surface and an inactive surface, in which the active surface includes a plurality of contacts. The molding compound contacts both the laminate and the die, but does not contact the die's active or inactive surfaces. The heat dissipation member contacts the die's inactive surface.

摘要翻译： 一种具有多层叠层的半导体器件，其包括热稳定的，柔性的聚合物膜，半导体管芯，模塑料和散热构件。 模具具有活性表面和非活性表面，其中活性表面包括多个触点。 模塑料与层压体和模具接触，但不接触模具的活性或非活性表面。 散热构件接触模具的非活性表面。

公开(公告)号：US06562653B1

公开(公告)日：2003-05-13

申请号：US09668770

申请日：2000-09-22

申请人： Qing Ma ,  Harry Fujimoto

发明人： Qing Ma ,  Harry Fujimoto

IPC分类号： H01L2150

CPC分类号： H01L23/49827 ,  H01L25/0652 ,  H01L2224/16 ,  H01L2924/3011

摘要： An integrated circuit package which includes an integrated circuit that is connected to a silicon substrate. The silicon substrate may have a via. The package may further include a solder bump that is attached to both the integrated circuit and the silicon subtstrate. The silicon substrate has a coefficient of thermal expansion that matches the coefficient of thermal expansion of the integrated circuit.

摘要翻译： 一种集成电路封装，其包括连接到硅衬底的集成电路。 硅衬底可以具有通孔。 该封装还可以包括连接到集成电路和硅基板两者的焊料凸块。 硅衬底具有与集成电路的热膨胀系数相匹配的热膨胀系数。

公开(公告)号：US06362091B1

公开(公告)日：2002-03-26

申请号：US09524766

申请日：2000-03-14

申请人： Ebrahim Andideh ,  Qing Ma ,  Quan Tran ,  Steve Towle

发明人： Ebrahim Andideh ,  Qing Ma ,  Quan Tran ,  Steve Towle

IPC分类号： H01L214763

CPC分类号： H01L23/5329 ,  H01L21/76801 ,  H01L21/76807 ,  H01L21/76829 ,  H01L21/76835 ,  H01L23/53295 ,  H01L2924/0002 ,  H01L2924/00

摘要： An improved semiconductor device and method for making it. That semiconductor device includes a first insulating layer, having a low-k dielectric constant that preferably comprises a carbon doped oxide, that is formed on a substrate. The device further includes a second layer, which is formed on the first layer, that has a relatively high dielectric constant and superior mechanical strength. The second layer is preferably under compressive stress. A third layer may be formed on the second layer, which has a relatively low dielectric constant and relatively poor mechanical strength, and a fourth layer may be formed on the third layer, which has a relatively high dielectric constant and superior mechanical strength.

公开(公告)号：US06271469B1

公开(公告)日：2001-08-07

申请号：US09438221

申请日：1999-11-12

申请人： Qing Ma ,  Chun Mu ,  Harry Fujimoto

发明人： Qing Ma ,  Chun Mu ,  Harry Fujimoto

IPC分类号： H01L2302

CPC分类号： H01L21/561 ,  H01L21/56 ,  H01L21/568 ,  H01L23/3114 ,  H01L23/4334 ,  H01L23/485 ,  H01L24/19 ,  H01L24/96 ,  H01L24/97 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16225 ,  H01L2224/20 ,  H01L2224/211 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73267 ,  H01L2224/92244 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01078 ,  H01L2924/14 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/18162 ,  H01L2924/3025 ,  H01L2924/351 ,  H01L2924/00

摘要： A microelectronic package including a microelectronic die having an active surface and at least one side. An encapsulation material is disposed adjacent the microelectronic die side(s), wherein the encapsulation material includes at least one surface substantially planar to the microelectronic die active surface. A first dielectric material layer may be disposed on at least a portion of the microelectronic die active surface and the encapsulation material surface. At least one conductive trace is then disposed on the first dielectric material layer. The conductive trace(s) is in electrical contact with the microelectronic die active surface. At least one conductive trace extends vertically adjacent the microelectronic die active surface and vertically adjacent the encapsulation material surface.

摘要翻译： 一种微电子封装，其包括具有活性表面和至少一个侧面的微电子管芯。 封装材料邻近微电子管芯侧设置，其中封装材料包括至少一个与微电子管芯有效表面平面的表面。 第一介电材料层可以设置在微电子管芯有源表面和封装材料表面的至少一部分上。 然后至少一个导电迹线设置在第一介电材料层上。 导电迹线与微电子管芯有源表面电接触。 至少一个导电迹线垂直邻近微电子管芯有源表面并垂直邻近封装材料表面延伸。

公开(公告)号：US06229216B1

公开(公告)日：2001-05-08

申请号：US09228323

申请日：1999-01-11

申请人： Qing Ma ,  Harry Fujimoto

发明人： Qing Ma ,  Harry Fujimoto

IPC分类号： H01L2310

CPC分类号： H01L23/49827 ,  H01L25/0652 ,  H01L2224/16 ,  H01L2924/3011

摘要： An integrated circuit package which includes an integrated circuit that is connected to a silicon substrate. The silicon substrate may have a via. The package may further include a solder bump that is attached to both the integrated circuit and the silicon substrate. The silicon substrate has a coefficient of thermal expansion that matches the coefficient of thermal expansion of the integrated circuit.

摘要翻译： 一种集成电路封装，其包括连接到硅衬底的集成电路。 硅衬底可以具有通孔。 封装还可以包括连接到集成电路和硅衬底两者的焊料凸块。 硅衬底具有与集成电路的热膨胀系数相匹配的热膨胀系数。

公开(公告)号：US09420707B2

公开(公告)日：2016-08-16

申请号：US12653722

申请日：2009-12-17

申请人： Qing Ma ,  Chuan Hu ,  Patrick Morrow

发明人： Qing Ma ,  Chuan Hu ,  Patrick Morrow

IPC分类号： H05K1/11 ,  H05K3/46 ,  H01L23/498 ,  H05K3/42

CPC分类号： H01L23/49822 ,  B32B2457/08 ,  H01L21/4857 ,  H01L21/486 ,  H01L23/3675 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/49894 ,  H01L24/17 ,  H01L24/32 ,  H01L24/73 ,  H01L2224/16227 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2224/81815 ,  H01L2924/0002 ,  H01L2924/01005 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01016 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01024 ,  H01L2924/01025 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/05442 ,  H01L2924/14 ,  H01L2924/15184 ,  H01L2924/15788 ,  H01L2924/16251 ,  H05K3/42 ,  H05K3/4605 ,  H05K2201/0195 ,  H05K2201/096 ,  Y10T156/10 ,  H01L2924/00

摘要： Disclosed are embodiments of a substrate for an integrated circuit (IC) device. The substrate includes a core comprised of two or more discrete glass layers that have been bonded together. A separate bonding layer may be disposed between adjacent glass layers to couple these layers together. The substrate may also include build-up structures on opposing sides of the multi-layer glass core, or perhaps on one side of the core. Electrically conductive terminals may be formed on both sides of the substrate, and an IC die may be coupled with the terminals on one side of the substrate. The terminals on the opposing side may be coupled with a next-level component, such as a circuit board. One or more conductors extend through the multi-layer glass core, and one or more of the conductors may be electrically coupled with the build-up structures disposed over the core. Other embodiments are described and claimed.

摘要翻译： 公开了用于集成电路（IC）装置的基板的实施例。 衬底包括由已经结合在一起的两个或更多个离散的玻璃层组成的芯。 可以在相邻的玻璃层之间设置单独的粘合层，以将这些层连接在一起。 衬底还可以包括在多层玻璃芯的相对侧上或者可能在芯的一侧上的堆积结构。 导电端子可以形成在基板的两侧，并且IC管芯可以与基板的一侧上的端子耦合。 相对侧上的端子可以与诸如电路板的下一级组件耦合。 一个或多个导体延伸通过多层玻璃芯，并且一个或多个导体可以与布置在芯上的积聚结构电耦合。 描述和要求保护其他实施例。

公开(公告)号：US09368429B2

公开(公告)日：2016-06-14

申请号：US13631744

申请日：2012-09-28

申请人： Qing Ma ,  Johanna M. Swan ,  Min Tao ,  Charles A. Gealer ,  Edward A. Zarbock

发明人： Qing Ma ,  Johanna M. Swan ,  Min Tao ,  Charles A. Gealer ,  Edward A. Zarbock

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L29/40 ,  H01L23/00 ,  G01P15/08 ,  B81C1/00 ,  H01L25/065 ,  H01L23/498 ,  H01L23/538

CPC分类号： B81C1/00301 ,  B81B7/007 ,  B81C1/00238 ,  B81C2203/0145 ,  G01P15/0802 ,  H01L23/481 ,  H01L23/49816 ,  H01L23/5384 ,  H01L24/03 ,  H01L25/0652 ,  H01L2224/0401 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/73204 ,  H01L2924/01327 ,  H01L2924/07811 ,  H01L2924/12042 ,  H01L2924/1461 ,  H01L2924/00 ,  H01L2924/014

摘要： Integration of sensor chips with integrated circuit (IC) chips. At least a first sensor chip including a first sensor is affixed to a first side of an interposer to hermitically seal the first sensor within a first cavity. An IC chip is affixed to a second side of the interposer opposite the first sensor, the IC chip is electrically coupled to the first sensor by a through via in the interposer. In embodiments, the first sensor includes a MEMS device and the IC chip comprises a circuit to amplify a signal from the MEMS device. The interposer may be made of glass, with the first sensor chip and the IC chip flip-chip bonded to the interposer by compression or solder. Lateral interconnect traces provide I/O between the devices on the interposer and/or a PCB upon which the interpose is affixed.

摘要翻译： 传感器芯片与集成电路（IC）芯片的集成。 至少包括第一传感器的第一传感器芯片固定到插入件的第一侧，以将第一传感器密封在第一腔内。 IC芯片被固定到与第一传感器相对的插入件的第二侧，IC芯片通过插入器中的通孔电耦合到第一传感器。 在实施例中，第一传感器包括MEMS器件，并且IC芯片包括放大来自MEMS器件的信号的电路。 插入器可以由玻璃制成，其中第一传感器芯片和IC芯片倒装芯片通过压缩或焊接接合到插入器。 横向互连迹线在插入件上的器件和/或其上插入插入物的PCB之间提供I / O。

公开(公告)号：US09173918B2

公开(公告)日：2015-11-03

申请号：US13879558

申请日：2011-10-14

申请人： Zhiquan Zhang ,  G. Burkhard Mackensen ,  Qing Ma ,  Mihai V. Podgoreanu

发明人： Zhiquan Zhang ,  G. Burkhard Mackensen ,  Qing Ma ,  Mihai V. Podgoreanu

IPC分类号： A61K38/06 ,  C07K5/08 ,  A61P13/12 ,  A61K38/07 ,  A61K38/17

CPC分类号： A61K38/07 ,  A61K38/1709

摘要： The present invention provides a method of treating, ameliorating and/or preventing cardiac surgery-associated acute kidney injury (AKI) in a subject, comprising administering to the subject a therapeutically effective amount of an annexin A1 (ANXA1) peptide such that the AKI is treated, ameliorated and/or prevented.

摘要翻译： 本发明提供了治疗，改善和/或预防受试者心脏手术相关的急性肾损伤（AKI）的方法，其包括向受试者施用治疗有效量的膜联蛋白A1（ANXA1）肽，使得AKI为 治疗，改善和/或预防。