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公开(公告)号:US20180261266A1
公开(公告)日:2018-09-13
申请号:US15889191
申请日:2018-02-05
Applicant: Rambus Inc.
Inventor: James E. Harris , Thomas Vogelsang , Frederick A. Ware , Ian P. Shaeffer
IPC: G11C7/10 , G11C8/10 , G11C11/4076 , G11C11/408 , G11C11/4091 , G11C5/02 , G11C7/08 , G11C7/06 , G11C7/12 , G11C7/22 , G11C8/08
CPC classification number: G11C7/1039 , G11C5/025 , G11C7/06 , G11C7/065 , G11C7/08 , G11C7/12 , G11C7/222 , G11C8/08 , G11C8/10 , G11C11/4076 , G11C11/4087 , G11C11/4091
Abstract: Row activation operations within a memory component are carried out with respect to subrows instead of complete storage rows to reduce power consumption. Further, instead of activating subrows in response to row commands, subrow activation operations are deferred until receipt of column commands that specify the column operation to be performed and the subrow to be activated.
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公开(公告)号:US10074417B2
公开(公告)日:2018-09-11
申请号:US15522182
申请日:2015-11-04
Applicant: Rambus Inc.
Inventor: Frederick A. Ware , James E. Harris
IPC: G11C7/22 , G11C11/4093 , G11C8/12 , G11C5/06 , G11C5/04
CPC classification number: G11C11/4093 , G11C5/04 , G11C5/063 , G11C7/22 , G11C8/12
Abstract: A memory module with multiple memory devices includes a buffer system that manages communication between a memory controller and the memory devices. Each memory device supports an access mode and a low-power mode, the latter used to save power for devices that are not immediately needed. The module provides granular power management using a chip-select decoder that decodes chip-select signals from the memory controller into power-state signals that determine which of the memory devices are in which of the modes. Devices can thus be brought out of the low-power mode in relatively small numbers, as needed, to limit power consumption.
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公开(公告)号:US20180181505A1
公开(公告)日:2018-06-28
申请号:US15864732
申请日:2018-01-08
Applicant: Rambus Inc.
Inventor: Frederick A. Ware , Holden Jessup
IPC: G06F13/16
Abstract: The described embodiments provide a system for controlling an integrated circuit memory device by a memory controller. During operation, the system sends a memory-access request from the memory controller to the memory device using a first link. After sending the memory-access request, the memory controller sends to the memory device a command that specifies performing a timing-calibration operation for a second link. The system subsequently transfers data associated with the memory-access request using the second link, wherein the timing-calibration operation occurs between sending the memory-access request and transferring the data associated with the memory-access request.
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公开(公告)号:US20180166120A1
公开(公告)日:2018-06-14
申请号:US15829787
申请日:2017-12-01
Applicant: Rambus Inc.
Inventor: Frederick A. Ware , John Eric Linstadt , Zhichao Lu , Kenneth Lee Wright
IPC: G11C11/4091 , G06F11/10
Abstract: Memory devices, controllers and associated methods are disclosed. In one embodiment, a memory device is disclosed. The memory device includes storage cells that are each formed with a metal-oxide-semiconductor (MOS) transistor having a floating body. Data is stored as charge in the floating body. A transfer interface receives a read command to access data stored in a first group of the storage cells. Sensing circuitry detects the data stored in the first group of storage cells. The transfer interface selectively performs a writeback operation of the sensed data associated with the read command.
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公开(公告)号:US09997233B1
公开(公告)日:2018-06-12
申请号:US15285974
申请日:2016-10-05
Applicant: Rambus Inc.
Inventor: Frederick A. Ware , John Eric Linstadt , Kenneth L. Wright
IPC: G11C11/4093 , G11C11/4091 , G11C11/4076 , G11C7/10 , G06F12/14 , G06F13/16
CPC classification number: G11C11/4093 , G06F12/1433 , G06F13/1673 , G06F13/1678 , G06F2212/1052 , G11C5/04 , G11C7/1072 , G11C11/4072 , G11C11/4076 , G11C11/408 , G11C11/4091 , G11C29/22 , G11C29/32 , G11C29/38
Abstract: In a memory module having a buffer component, a plurality of data signaling paths and a plurality of memory dies each coupled to a respective one of the data signaling paths, the buffer component receives and stores a first configuration value that specifies a memory-die quantity N, where N is permitted to range from a first value corresponding to the quantity of the data signaling paths to at least one value less than the first value. The buffer component further receives a memory read command and enables, in accordance with the first configuration value, a quantity N of the memory dies to output read data in response to the memory read command.
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96.
公开(公告)号:US09979416B2
公开(公告)日:2018-05-22
申请号:US14941564
申请日:2015-11-14
Applicant: Rambus Inc.
Inventor: Frederick A. Ware , John Eric Linstadt
CPC classification number: H03M13/05 , G06F3/0619 , G06F3/0653 , G06F3/0673 , G06F13/1668 , H03M13/09 , H03M13/1102 , H03M13/151 , H03M13/1515 , H03M13/19
Abstract: Memory controllers, devices and associated methods are disclosed. In one embodiment, a memory controller includes write circuitry to transmit write data to a memory device, the write circuitry includes a write error detection correction (EDC) encoder to generate first error information associated with the write data. Data bus inversion (DBI) circuitry conditionally inverts data bits associated with each of the write data words based on threshold criteria. Read circuitry receives read data from the memory device. The read circuitry includes a read EDC encoder to generate second error information associated with the received read data. Logic evaluates the first and second error information and conditionally reverse-inverts at least a portion of the read data based on the decoding.
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97.
公开(公告)号:US09959914B2
公开(公告)日:2018-05-01
申请号:US15169331
申请日:2016-05-31
Applicant: Rambus Inc.
Inventor: Richard E. Perego , Frederick A. Ware
CPC classification number: G11C7/1072 , G06F13/1678 , G06F13/1684 , G06F13/1694 , G11C5/06 , G11C7/1045 , G11C7/1075
Abstract: A memory system includes a memory controller with multiple command/address ports and a memory device having corresponding request ports. The memory controller issues commands to memory device to cause the memory device to “loop-back” signals conveyed to memory device over one of the command/address ports via a bidirectional data link; these signals can be deterministic test patterns. The memory controller compares the returned information with the originally transmitted patterns to perform calibration. In one embodiment, because the return links are already calibrated, errors can be attributed to issues in the forward links; the memory controller then adjusts timing of the forward links to minimize the errors.
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公开(公告)号:US09941005B2
公开(公告)日:2018-04-10
申请号:US15338872
申请日:2016-10-31
Applicant: Rambus Inc.
Inventor: Deepak Chandra Sekar , Gary Bela Bronner , Frederick A. Ware
CPC classification number: G11C13/0069 , G11C13/0002 , G11C13/0007 , G11C13/0023 , G11C13/003 , G11C13/004 , G11C13/0097 , G11C2213/15 , G11C2213/72 , G11C2213/74 , G11C2213/75 , G11C2213/78 , G11C2213/79
Abstract: A memory cell includes a first resistive memory element, a second resistive memory element electrically coupled with the first resistive memory element at a common node, and a switching element comprising an input terminal electrically coupled with the common node, the switching element comprising a driver configured to float during one or more operations.
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公开(公告)号:US20180082884A1
公开(公告)日:2018-03-22
申请号:US15824762
申请日:2017-11-28
Applicant: Rambus Inc.
Inventor: Frederick A. Ware , Ely K. Tsern , Ian P. Shaeffer
IPC: H01L21/768 , H01L25/065
Abstract: This application is directed to a system including a plurality of devices that are stacked one on top of another. Each device includes a substrate having two opposing surfaces. A first row of contacts is coupled on a first surface and includes a first contact and a second contact that are adjacent to each other. A second row of contacts is coupled on a respective second surface and includes a third contact. Each contact in the second row of contacts is physically aligned with an opposite contact in the first row. The third contact is disposed opposite and physically aligned with the first contact in the first row, and electrically coupled to the second contact in the first row. Operational circuitry is electrically coupled to at least the first contact on the first row, and at least two of the plurality of devices have distinct operational circuitry.
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公开(公告)号:US09911468B2
公开(公告)日:2018-03-06
申请号:US15390674
申请日:2016-12-26
Applicant: Rambus Inc.
Inventor: James E. Harris , Thomas Vogelsang , Frederick A. Ware , Ian P. Shaeffer
IPC: G11C7/00 , G11C7/10 , G11C5/02 , G11C11/4076 , G11C11/408 , G11C11/4091 , G11C7/06 , G11C7/08 , G11C7/12 , G11C7/22 , G11C8/08 , G11C8/10
CPC classification number: G11C7/1039 , G11C5/025 , G11C7/06 , G11C7/065 , G11C7/08 , G11C7/12 , G11C7/222 , G11C8/08 , G11C8/10 , G11C11/4076 , G11C11/4087 , G11C11/4091
Abstract: Row activation operations within a memory component are carried out with respect to subrows instead of complete storage rows to reduce power consumption. Further, instead of activating subrows in response to row commands, subrow activation operations are deferred until receipt of column commands that specify the column operation to be performed and the subrow to be activated.
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