公开(公告)号：US20090115040A1

公开(公告)日：2009-05-07

申请号：US11936516

申请日：2007-11-07

申请人： Zigmund Ramirez Camacho ,  Henry Descalzo Bathan ,  Abelardo Jr. Advincula ,  Lionel Chien Hui Tay

发明人： Zigmund Ramirez Camacho ,  Henry Descalzo Bathan ,  Abelardo Jr. Advincula ,  Lionel Chien Hui Tay

IPC分类号： H01L23/495 ,  H01L21/56

CPC分类号： H01L23/49548 ,  H01L21/4832 ,  H01L23/3107 ,  H01L23/49541 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05554 ,  H01L2224/32245 ,  H01L2224/45014 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/10162 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： An integrated circuit package system includes: forming an array of external interconnects with an intersecting region between the external interconnects; removing the intersecting region for forming an isolation hole between the external interconnects; mounting an integrated circuit die over the external interconnects; connecting an internal interconnect between the integrated circuit die and the external interconnects; and forming a package encapsulation over the integrated circuit die with the external interconnects partially exposed.

摘要翻译： 集成电路封装系统包括：形成具有外部互连之间的相交区域的外部互连阵列; 去除用于在外部互连之间形成隔离孔的交叉区域; 在外部互连上安装集成电路管芯; 连接集成电路管芯和外部互连件之间的内部互连; 以及在所述集成电路管芯上形成封装封装，所述外部互连部分露出。

公开(公告)号：US20090072366A1

公开(公告)日：2009-03-19

申请号：US11857402

申请日：2007-09-18

申请人： Guruprasad Badakere Govindaiah ,  Zigmund Ramirez Camacho ,  Jeffrey D. Punzalan ,  Henry Descalzo Bathan ,  Lionel Chien Hui Tay

发明人： Guruprasad Badakere Govindaiah ,  Zigmund Ramirez Camacho ,  Jeffrey D. Punzalan ,  Henry Descalzo Bathan ,  Lionel Chien Hui Tay

IPC分类号： H01L23/495 ,  H01L21/56

CPC分类号： H01L23/49503 ,  H01L23/495 ,  H01L23/49541 ,  H01L24/48 ,  H01L24/49 ,  H01L25/03 ,  H01L25/105 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49109 ,  H01L2224/73265 ,  H01L2225/1029 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01015 ,  H01L2924/01033 ,  H01L2924/01076 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00012

摘要： An integrated circuit package system includes: forming a die-attach paddle, a terminal pad, and an external interconnect with the external interconnect below the terminal pad; connecting an integrated circuit die with the terminal pad and the external interconnect; and forming an encapsulation, having a first side and a second side at an opposing side to the first side, surrounding the integrated circuit die with the terminal pad exposed at the first side and the external interconnect extending below the second side.

摘要翻译： 集成电路封装系统包括：在端子焊盘下方形成管芯附接焊盘，端子焊盘和与外部互连的外部互连; 将集成电路管芯与端子焊盘和外部互连连接; 并且形成封装件，其具有与所述第一侧相对的一侧的第一侧和第二侧，围绕所述集成电路管芯，所述端子焊盘在所述第一侧暴露并且所述外部互连件延伸到所述第二侧的下方。

公开(公告)号：US08513801B2

公开(公告)日：2013-08-20

申请号：US12193540

申请日：2008-08-18

申请人： Lionel Chien Hui Tay ,  Jairus Legaspi Pisigan ,  Zigmund Ramirez Camacho

发明人： Lionel Chien Hui Tay ,  Jairus Legaspi Pisigan ,  Zigmund Ramirez Camacho

IPC分类号： H01L23/34

CPC分类号： H01L23/49838 ,  H01L23/13 ,  H01L23/3121 ,  H01L23/49816 ,  H01L23/49833 ,  H01L24/48 ,  H01L24/73 ,  H01L25/03 ,  H01L25/105 ,  H01L25/16 ,  H01L2224/32225 ,  H01L2224/45014 ,  H01L2224/48091 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/15151 ,  H01L2924/15311 ,  H01L2924/19107 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207

摘要： An integrated circuit package system includes: mounting a first integrated circuit over a carrier; mounting an interposer, having an opening, over the first integrated circuit and the carrier with the interposer having an overhang over the carrier; connecting an internal interconnect, through the opening, between the carrier and the interposer; and forming an encapsulation over the first integrated circuit, the internal interconnect, and the carrier.

摘要翻译： 集成电路封装系统包括：将第一集成电路安装在载体上; 在所述第一集成电路和所述载体上安装具有开口的插入件，所述插入件在所述载体上具有突出端; 通过开口在载体和插入件之间连接内部互连件; 以及在第一集成电路，内部互连和载体上形成封装。

公开(公告)号：US08421198B2

公开(公告)日：2013-04-16

申请号：US11856841

申请日：2007-09-18

申请人： Lionel Chien Hui Tay ,  Zigmund Ramirez Camacho ,  Abelardo Hadap Advincula, Jr.

发明人： Lionel Chien Hui Tay ,  Zigmund Ramirez Camacho ,  Abelardo Hadap Advincula, Jr.

IPC分类号： H01L23/495

CPC分类号： H01L23/49541 ,  H01L23/3107 ,  H01L23/49548 ,  H01L24/16 ,  H01L24/48 ,  H01L2224/16 ,  H01L2224/45014 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19043 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： An integrated circuit package system includes: connecting an integrated circuit die and external interconnects; forming an encapsulation over the integrated circuit die and a portion of the external interconnects; and forming an isolation hole between the external interconnects and into a side of the encapsulation exposing the external interconnects.

摘要翻译： 集成电路封装系统包括：连接集成电路管芯和外部互连; 在所述集成电路管芯和所述外部互连的一部分上形成封装; 以及在所述外部互连件之间形成隔离孔并且进入所述封装的暴露所述外部互连的一侧。

公开(公告)号：US08344495B2

公开(公告)日：2013-01-01

申请号：US12636696

申请日：2009-12-11

申请人： Zigmund Ramirez Camacho ,  Philip Lyndon Cablao ,  Lionel Chien Hui Tay ,  Frederick Rodriguez Dahilig

发明人： Zigmund Ramirez Camacho ,  Philip Lyndon Cablao ,  Lionel Chien Hui Tay ,  Frederick Rodriguez Dahilig

IPC分类号： H01L23/498

CPC分类号： H01L21/568 ,  H01L21/4846 ,  H01L21/486 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/5389 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/16225 ,  H01L2224/16237 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45155 ,  H01L2224/45164 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48465 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/85001 ,  H01L2924/00014 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01076 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05599

摘要： A method of manufacture of an integrated circuit packaging system includes: providing a substrate external layer having an opening; forming a convex interconnect within the opening with the convex interconnect having a protrusion and a horizontal flange substantially horizontally coplanar with the substrate external layer; forming an insulation layer over the substrate external layer and the convex interconnect; forming a horizontal conductive pathway on the insulation layer; forming a single interlayer conductive connector from the horizontal conductive pathway to the convex interconnect; and connecting an integrated circuit and the horizontal conductive pathway.

摘要翻译： 一种集成电路封装系统的制造方法，包括：提供具有开口的基板外层; 在所述开口内形成凸形互连件，所述凸起互连件具有突出部和与所述基板外部层基本上水平共面的水平凸缘; 在所述衬底外层和所述凸互连之上形成绝缘层; 在绝缘层上形成水平导电通路; 从所述水平导电路径形成单层间导电连接器到所述凸互连; 并连接集成电路和水平导电通路。

公开(公告)号：US08216883B2

公开(公告)日：2012-07-10

申请号：US13023329

申请日：2011-02-08

申请人： Zigmund Ramirez Camacho ,  Dioscoro A. Merilo ,  Lionel Chien Hui Tay

发明人： Zigmund Ramirez Camacho ,  Dioscoro A. Merilo ,  Lionel Chien Hui Tay

IPC分类号： H01L21/58

CPC分类号： H01L23/49541 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/4951 ,  H01L23/49513 ,  H01L23/49548 ,  H01L23/49568 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/83 ,  H01L24/97 ,  H01L2221/68345 ,  H01L2224/29007 ,  H01L2224/2919 ,  H01L2224/32014 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/83192 ,  H01L2224/8385 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/078 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/01028 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A method for manufacturing a semiconductor package system includes: providing a leadframe, having an open center, with leads adjacent to a peripheral edge of the leadframe; making a die support pad, formed without tie bars, separately from the leadframe; providing a coverlay tape for positioning the support pad centered within the leadframe; attaching a semiconductor die to the die support pad through a die attach adhesive, the semiconductor die being spaced from the leads; and connecting a bonding pad on the semiconductor die to one of the leads using a bonding wire.

摘要翻译： 一种用于制造半导体封装系统的方法，包括：提供具有开放中心的引线框架，其具有与引线框架的周边边缘相邻的引线; 制成与引线框分开形成的没有连接条的模具支撑垫; 提供用于将所述支撑垫定位在所述引线框内的中心的覆盖带; 通过管芯附着粘合剂将半导体管芯附接到管芯支撑焊盘，半导体管芯与引线间隔开; 以及使用接合线将半导体管芯上的接合焊盘连接到引线之一。

公开(公告)号：US20090294935A1

公开(公告)日：2009-12-03

申请号：US12131037

申请日：2008-05-30

申请人： Lionel Chien Hui Tay ,  Seng Guan Chow ,  Zigmund Ramirez Camacho

发明人： Lionel Chien Hui Tay ,  Seng Guan Chow ,  Zigmund Ramirez Camacho

IPC分类号： H01L23/495 ,  H01L21/56

CPC分类号： H01L23/49541 ,  H01L23/3107 ,  H01L24/48 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor package system includes: providing a leadframe having inner frame bars, outer frame bars, a die pad, tiebars, and rows of leads, the inner frame bars being coplanar with outer frame bars; attaching a semiconductor chip to the die pad; attaching bond wires between the semiconductor chip and the rows of leads; encapsulating the semiconductor chip, the bond wires, the inner frame bars, the outer frame bars, the die pad, the tiebars, and the rows of leads in an encapsulant; cutting a groove to remove the inner frame bars; and singulating the leadframe and the encapsulant to remove the outer frame bars.

摘要翻译： 半导体封装系统包括：提供具有内框架条，外框架条，管芯焊盘，拉杆和一排引线的引线框架，内框架杆与外框架杆共面; 将半导体芯片附接到芯片焊盘; 在半导体芯片和引线列之间附加接合线; 在封装材料中封装半导体芯片，接合线，内框架条，外框架条，管芯焊盘，拉杆和引线列; 切割凹槽以移除内框架条; 并且分离引线框和密封剂以去除外框架条。

公开(公告)号：US20090115032A1

公开(公告)日：2009-05-07

申请号：US11936532

申请日：2007-11-07

申请人： Zigmund Ramirez Camacho ,  Jairus Legaspi Pisigan ,  Jose Alvin Caparas ,  Lionel Chien Hui Tay

发明人： Zigmund Ramirez Camacho ,  Jairus Legaspi Pisigan ,  Jose Alvin Caparas ,  Lionel Chien Hui Tay

IPC分类号： H01L23/495 ,  H01L21/60

CPC分类号： H01L23/49551 ,  H01L23/552 ,  H01L24/48 ,  H01L25/105 ,  H01L2224/32245 ,  H01L2224/45014 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2225/1029 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： An integrated circuit package system includes: forming a lead having a both top contact portion and a bottom contact portion; connecting an integrated circuit die and the lead; and forming a package encapsulation, having a top side and a bottom side, over the integrated circuit die. The forming the package encapsulation includes partially exposing the top contact portion at the top side, and partially exposing the bottom contact portion along the bottom side with the bottom contact portion extending beyond a nonhorizontal portion of the package encapsulation.

摘要翻译： 集成电路封装系统包括：形成具有两个顶部接触部分和底部接触部分的引线; 连接集成电路管芯和引线; 以及在集成电路管芯上形成具有顶侧和底侧的封装封装。 形成封装封装包括部分地暴露顶侧的顶部接触部分，并且使底部接触部分沿底部部分露出，底部接触部分延伸超过封装封装的非水平部分。

公开(公告)号：US08278148B2

公开(公告)日：2012-10-02

申请号：US11854989

申请日：2007-09-13

申请人： Jeffrey D. Punzalan ,  Jairus Legaspi Pisigan ,  Lionel Chien Hui Tay ,  Zigmund Ramirez Camacho

发明人： Jeffrey D. Punzalan ,  Jairus Legaspi Pisigan ,  Lionel Chien Hui Tay ,  Zigmund Ramirez Camacho

IPC分类号： H01L23/495

CPC分类号： H01L23/49503 ,  H01L23/3107 ,  H01L23/49541 ,  H01L23/49548 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49 ,  H01L2224/73265 ,  H01L2224/85001 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00012

摘要： An integrated circuit package system is provided including forming a leadframe having a frame and a die paddle having leads thereon. The leads are held with respect to the die paddle. The leads are separated from the die paddle, and a die is attached to the die paddle. Bond wires are bonded between the leads and the die. The die and bond wires are encapsulated. The leadframe is singulated to separate the frame and the die paddle.

摘要翻译： 提供了一种集成电路封装系统，包括形成具有框架的引线框架和在其上具有引线的管芯焊盘。 导线相对于芯片被保持。 引线与管芯分离，并且管芯附接到管芯焊盘。 接合线结合在引线和芯片之间。 管芯和接合线被封装。 引导框架被单独分离框架和模具桨。

公开(公告)号：US08252634B2

公开(公告)日：2012-08-28

申请号：US12488043

申请日：2009-06-19

申请人： Zigmund Ramirez Camacho ,  Jose Alvin Caparas ,  Lionel Chien Hui Tay

发明人： Zigmund Ramirez Camacho ,  Jose Alvin Caparas ,  Lionel Chien Hui Tay

IPC分类号： H01L21/00

CPC分类号： H01L23/4951 ,  H01L23/3135 ,  H01L23/49541 ,  H01L23/49548 ,  H01L23/49572 ,  H01L23/49575 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/0554 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16245 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A method of manufacture of an integrated circuit packaging system includes: providing inwardly converging leadfingers having continuously decreasing widths along lengths thereof to inward ends thereof; electrically connecting an integrated circuit device on the leadfingers only on portions of the continuously decreasing widths; and encapsulating the integrated circuit device and the leadfingers with an encapsulation.

摘要翻译： 一种集成电路封装系统的制造方法，其特征在于包括：沿其长度方向向其内端提供具有连续减小的宽度的向内会聚的引线管; 仅在连续减小宽度的部分上将导线器上的集成电路器件电连接; 并用封装封装集成电路器件和引线管。