公开(公告)号：US20240025733A1

公开(公告)日：2024-01-25

申请号：US18352357

申请日：2023-07-14

申请人： CALIENT TECHNOLOGIES, INC.

发明人： Andrew HOCKING ,  Scott A. MILLER

IPC分类号： B81B7/04 ,  B81B5/00 ,  B81B3/00

CPC分类号： B81B7/04 ,  B81B5/00 ,  B81B3/0051 ,  B81B2201/042 ,  B81B2203/0154

摘要： A MEM array may comprise a first stage comprising a first stage reflective surface, and a second stage comprising a second stage reflective surface. The MEM array may comprise a base wafer positioned below the first stage and the second stage; and a first frame pivotally coupled to the first stage. The first frame may be pivotally coupled to a second frame, which may comprise a second frame high aspect ratio (AR) member that may be operable to reduce mechanical motion of the second stage.

公开(公告)号：US20230348259A1

公开(公告)日：2023-11-02

申请号：US17732467

申请日：2022-04-28

申请人： Vanguard International Semiconductor Corporation

发明人： WAI MUN CHONG ,  RAKESH CHAND ,  GUOFU ZHOU ,  ROHIT PULIKKAL KIZHAKKEYIL ,  RAMACHANDRAMURTHY PRADEEP YELEHANKA

IPC分类号： B81B3/00 ,  B81C1/00

CPC分类号： B81B3/0051 ,  B81C1/00341 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81B2203/0136 ,  B81B2207/012 ,  B81C2201/0132 ,  B81C2201/0178 ,  B81C2203/0792

摘要： A micro-electro-mechanical system (MEMS) device includes a supporting substrate, a cavity, a stopper, a MEMS structure, and a bonding dielectric layer. The cavity is located at a top surface of the supporting substrate. The stopper is adjacent to the cavity, where a top surface of the stopper and the top surface of the supporting substrate are on the same level in a height. The MEMS structure is disposed on the supporting substrate, where the MEMS structure includes a proof mass and a suspension beam. The proof mass is disposed directly above the stopper, and the suspension beam is disposed directly above the cavity. The bonding dielectric layer is disposed between the top surface of the supporting substrate and a bottom surface of the MEMS structure.

公开(公告)号：US11789255B2

公开(公告)日：2023-10-17

申请号：US17833950

申请日：2022-06-07

申请人： HAMAMATSU PHOTONICS K.K.

发明人： Daiki Suzuki ,  Shinya Iwashina ,  Yuki Morinaga

IPC分类号： G02B26/08 ,  B81B3/00 ,  B81C3/00 ,  G02B7/198 ,  G02B26/10

CPC分类号： G02B26/085 ,  B81B3/0051 ,  B81C3/00 ,  G02B7/198 ,  G02B26/101 ,  B81B2201/04

摘要： An optical module includes a mirror unit having a movable mirror portion, a magnet portion configured to generate a magnetic field acting on the movable mirror portion, and a package accommodating the magnet portion. The magnet portion has a Halbach structure including a first magnet applied with a force in a first direction, and a second magnet applied with a force in a second direction. The package has a bottom walls portion, a side wall portion, and a restriction portion configured to restrict movement of the second magnet in the second direction. The movable mirror portion is disposed in a space formed by the restriction portion.

公开(公告)号：US11668925B2

公开(公告)日：2023-06-06

申请号：US16828984

申请日：2020-03-25

申请人： COMPERTUM MICROSYSTEMS INC.

发明人： Francis Piu Man

IPC分类号： B81B3/00 ,  G02B26/08

CPC分类号： G02B26/085 ,  B81B3/001 ,  B81B3/0051 ,  B81B2201/042

摘要： A MEMS micro-mirror device includes a middle substrate, a movable structure, at least one stopper coupled with the movable structure, at least one flexure, an upper cap, and a lower cap. The movable structure includes a micro-mirror plate having a reflective surface. The flexure connects the stopper and the middle substrate. The upper cap, bonded with the middle substrate, has a first opening for allowing the movable structure's movement and has at least one first recess facing a first side of the flexure and a first side of the stopper. The lower cap, bonded with the middle substrate, has a second opening for allowing space for the movement and has at least one second recess facing a second side of the flexure and a second side of the stopper.

公开(公告)号：US20180306581A1

公开(公告)日：2018-10-25

申请号：US15948174

申请日：2018-04-09

申请人： Seiko Epson Corporation

发明人： Makoto FURUHATA ,  Kei KANEMOTO

IPC分类号： G01C19/5733 ,  G01P3/22 ,  G01C19/5769 ,  B60W30/02 ,  B60W10/184 ,  B60W10/22

CPC分类号： G01C19/5733 ,  B60W10/184 ,  B60W10/22 ,  B60W30/02 ,  B60W2420/10 ,  B81B3/0051 ,  B81B3/0078 ,  B81B2201/0242 ,  G01C19/574 ,  G01C19/5769 ,  G01P3/22

摘要： A physical quantity sensor includes a driven section and a drive spring that supports the driven section so that the driven section is displaceable in a first direction. The drive spring has a serpentine shape and includes a plurality of spring structures extending in a second direction that intersects a first direction. At least one of the spring structures has a thin section that is thinner in a third direction that intersects the first and second directions than the other portions of the drive spring.

公开(公告)号：US10071903B2

公开(公告)日：2018-09-11

申请号：US14677730

申请日：2015-04-02

申请人： MEMS DRIVE, INC.

发明人： Xiaolei Liu ,  Roman Gutierrez ,  Guiqin Wang ,  Benson Mai ,  Matthew Ng

IPC分类号： B81B3/00

CPC分类号： B81B3/0051 ,  B81B3/007 ,  B81B2203/0163 ,  Y10T74/20

摘要： A flexure includes a support first end connected to a first frame; a support second end connected to a second frame; and a buckled section connecting the first support end to the second support end. The length of the flexure is substantially greater than its width, and the width of the flexure is substantially greater than its thickness. During operation, the flexure is maintained in a buckled state where the flexure's stiffness is significantly less than in the unbuckled state. In one implementation, a stage includes a flexure array joining a first frame and a second frame, where: the first frame and the second frame are substantially on a plane; the flexure array is substantially on the plane prior to buckling by the flexures of the flexure array; and the flexure array is bent substantially out of the plane after buckling by the flexures.

公开(公告)号：US09963340B2

公开(公告)日：2018-05-08

申请号：US14958372

申请日：2015-12-03

申请人： Honeywell International Inc.

发明人： Gregory C. Brown

IPC分类号： B81B3/00 ,  G01L9/00 ,  B81C1/00

CPC分类号： B81B3/0051 ,  B81B2201/0264 ,  B81B2203/0127 ,  B81B2203/0315 ,  B81C1/00158 ,  B81C2201/013 ,  B81C2201/0143 ,  B81C2203/0118 ,  G01L9/0047 ,  G01L9/0054 ,  G01L9/0055 ,  G01L19/0618

摘要： A pressure sensor die assembly comprises a base substrate having a first surface, a stop structure on the first surface, and a diaphragm structure coupled to the first surface. The diaphragm structure comprises a first side with a cavity section including a first cavity and a second cavity surrounding the first cavity; a pressure sensing diaphragm portion having a first thickness and defined by the first cavity; and an over pressure diaphragm portion having a second thickness and defined by the second cavity, the second thickness greater than the first thickness. When an over pressure is applied, at least some area of the pressure sensing diaphragm portion is deflected and supported by the stop structure. As over pressure is increased, the over pressure diaphragm portion deflects and engages with the first surface such that additional area of the pressure sensing diaphragm portion is deflected and supported by the stop structure.

公开(公告)号：US20180057352A1

公开(公告)日：2018-03-01

申请号：US15683420

申请日：2017-08-22

申请人： Robert Bosch GmbH

发明人： Odd-Axel Pruetz

IPC分类号： B81B3/00 ,  G01P15/125

CPC分类号： B81B3/0051 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81B2201/025 ,  B81B2203/0136 ,  G01C19/5719 ,  G01P15/125 ,  G01P2015/0814

摘要： A micromechanical component is provided, the micromechanical component including a deflection device which is deflectable parallel to a deflection direction, and the micromechanical component including a damping device, a surface of the deflection device facing the damping device being greater than a sectional area of the deflection device disposed perpendicular to the deflection direction and situated in a region of the deflection device that is facing away from the damping device.

公开(公告)号：US20180057350A1

公开(公告)日：2018-03-01

申请号：US15681062

申请日：2017-08-18

申请人： Robert Bosch GmbH

发明人： Juergen Mueller

IPC分类号： B81B3/00

CPC分类号： B81B3/001 ,  B81B3/0051 ,  B81B2203/0172 ,  B81B2203/0376

摘要： A micromechanical system includes a substrate; a functional element that is mounted to as to allow movement in relation to the substrate; and an elastic stop element. The stop element has a first end that is attached to the substrate, and a second end that is configured to engage with the functional element when the functional element is deflected by a predefined amount from a neutral position. The stop element has an elastic configure in a first direction that coincides with a preferred direction of the functional element, and in a second direction that extends at a right angle to the first direction.

公开(公告)号：US20170363424A1

公开(公告)日：2017-12-21

申请号：US15625314

申请日：2017-06-16

申请人： COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES

发明人： Federico MASPERO ,  Loic JOET

IPC分类号： G01C19/5762 ,  B81C99/00 ,  H01G5/14 ,  B81B3/00 ,  G01P15/125 ,  G01P15/08

CPC分类号： G01C19/5762 ,  B81B3/0045 ,  B81B3/0051 ,  B81B3/0062 ,  B81B2201/0228 ,  B81B2201/0242 ,  B81B2201/033 ,  B81B2203/053 ,  B81C99/003 ,  G01P15/125 ,  G01P2015/0822 ,  H01G5/14

摘要： Microelectromechanical sensor comprising a fixed part and a mobile part suspended from the fixed part such that the mobile part can move at least in an out-of-plane displacement direction, the fixed part comprising at least first electrodes extending parallel to the displacement direction of the mobile part, the mobile part comprising a seismic mass and at least second electrodes extending parallel to the out-of-plane displacement direction, the first electrodes and the second electrodes being located relative to each other so as to be interdigitated, in which the second electrodes are directly connected to the inertial mass and only part of the face of each mobile electrode is facing an electrode fixed at rest.