RADIATION DETECTING SYSTEM
    91.
    发明申请
    RADIATION DETECTING SYSTEM 审中-公开
    辐射检测系统

    公开(公告)号:US20080224180A1

    公开(公告)日:2008-09-18

    申请号:US12048557

    申请日:2008-03-14

    Inventor: Fumito NARIYUKI

    CPC classification number: H01L31/0376 H01L27/14676 Y02E10/50

    Abstract: A radiation detecting system includes at least a carrier collective electrode layer, a radiation-sensitive semiconductor layer, at least one charge transfer layer, and a voltage applying electrode formed on an insulating substrate and wherein at least one of the charge transfer layers includes chalcogenide compounds containing therein chalcogenide elements larger than the stoichiometric value by not smaller than 3% of the stoichiometric value in a composition thereof.

    Abstract translation: 放射线检测系统至少包括载流子集合电极层,辐射敏感半导体层,至少一个电荷转移层和形成在绝缘基板上的电压施加电极,并且其中至少一个电荷转移层包括硫族化合物 其中含有大于化学计量值的硫族化物元素不少于其组成中化学计量值的3%。

    Image sensor comprising thin film transistor optical sensor having offset region
    92.
    发明授权
    Image sensor comprising thin film transistor optical sensor having offset region 有权
    图像传感器包括具有偏移区域的薄膜晶体管光学传感器

    公开(公告)号:US06952022B2

    公开(公告)日:2005-10-04

    申请号:US10732320

    申请日:2003-12-09

    Abstract: The present invention relates to an image sensor comprising an amorphous silicon thin-film transistor optical sensor which functions as an image sensor used for an X-ray photography device, a fingerprint recognition apparatus, a scanner, etc., and a method of manufacturing the image sensor. Since the thin-film transistor optical sensor according to the present invention has a high-resistance silicon region by disposing an offset region in a channel region, a dark leakage current of the optical sensor remains in a low level even under a high voltage. Therefore, it is possible to apply a high voltage to the thin-film transistor optical sensor according to the present invention so that the image senor can be sensitive to a weak light. In addition, since the storage capacitance in the image sensor is formed in a double structure, the image sensor has a high value of capacitance. Furthermore, since a lower common electrode is electrically connected to an upper common electrode, the image sensor has a stable structure.

    Abstract translation: 本发明涉及一种图像传感器,包括用作用于X射线摄影装置的图像传感器,指纹识别装置,扫描仪等的非晶硅薄膜晶体管光学传感器及其制造方法 图像传感器。 由于根据本发明的薄膜晶体管光学传感器通过在沟道区域中设置偏移区域而具有高电阻硅区域,所以即使在高电压下,光学传感器的暗漏电流也保持在低电平。 因此,可以对根据本发明的薄膜晶体管光学传感器施加高电压,使得图像传感器可以对弱光敏感。 此外,由于图像传感器中的存储电容形成为双重结构,所以图像传感器具有高的电容值。 此外,由于下部公共电极与上部公共电极电连接,所以图像传感器具有稳定的结构。

    Photoelectric conversion semiconductor manufacturing method
    95.
    发明授权
    Photoelectric conversion semiconductor manufacturing method 失效
    光电转换半导体制造方法

    公开(公告)号:US4464415A

    公开(公告)日:1984-08-07

    申请号:US353335

    申请日:1982-03-01

    Inventor: Shunpei Yamazaki

    Abstract: A semi-amporphous, photoelectric conversion semiconductor manufacturing method in which substrates are disposed in a reaction chamber having a gas inlet and a gas outlet and a gas mixture containing at least a semiconductor material gas which includes a dangling bond neutralizer and a carrier gas is introduced into the reaction chamber. An electromagnetic field is applied to the gas mixture to ionize it into a gas mixture plasma in the reaction chamber. The plasma is passed to the substrates where the semiconductor material doped with the neutralizer is deposited on each substrate. The semiconductor material deposited on each substrate becomes a semi-amporphous, photoelectric conversion semiconductor by holding the atmospheric pressure in the reaction chamber below 1 atm and maintaining the substrate at a temperature lower than the temperature at which the semiconductor material on the substrate becomes crystallized.

    Abstract translation: 介绍了一种半淀积光电转换半导体制造方法,其中将基板设置在具有气体入口和气体出口的反应室中,以及至少含有包括悬挂键中和器和载气的半导体材料气体的气体混合物 进入反应室。 将电磁场施加到气体混合物以将其电离成反应室中的气体混合物等离子体。 将等离子体传递到其上掺杂有中和剂的半导体材料沉积在每个衬底上的衬底。 沉积在每个基板上的半导体材料通过将反应室中的大气压保持在1atm以下,并将基板保持在比基板上的半导体材料结晶的温度低的温度下,成为半淀积光电转换半导体。

    CARRIER-SELECTIVE CONTACT JUNCTION SILICON SOLAR CELL AND MANUFACTURING METHOD THEREFOR

    公开(公告)号:US20230307569A1

    公开(公告)日:2023-09-28

    申请号:US18327071

    申请日:2023-06-01

    Abstract: A method of manufacturing a carrier-selective contact junction silicon solar cell includes: preparing a conductive silicon substrate; forming a first passivation layer and a second passivation layer on and under the conductive silicon substrate, respectively; forming an electron-selective contact layer under the second passivation layer; forming a hole-selective contact layer on the first passivation layer; forming an upper transparent electrode on the hole-selective contact layer; forming an upper metal electrode on the upper transparent electrode; and forming a lower metal electrode under the electron-selective contact layer. In forming the hole-selective contact layer, a sandwich-structured multilayer film is formed by depositing a copper iodide thin film on a top surface and a bottom surface of an iodine thin film, and a single-film copper iodide thin film is formed by low-temperature annealing the sandwich-structured multilayer film.

Patent Agency Ranking