公开(公告)号：US20160029478A1

公开(公告)日：2016-01-28

申请号：US14809714

申请日：2015-07-27

Applicant: Infineon Technologies AG

Inventor： Reinhold Bayerer

IPC: H05K1/02 ,  H05K3/30 ,  H05K5/00 ,  H05K1/18

CPC classification number: H05K1/0256 ,  H01L23/04 ,  H01L2924/0002 ,  H05K1/18 ,  H05K1/181 ,  H05K3/30 ,  H05K3/306 ,  H05K2201/0761 ,  H05K2201/09036 ,  H05K2201/10166 ,  H05K2201/10303 ,  H05K2201/2036 ,  H01L2924/00

Abstract: A power semiconductor module includes a module housing having a top side, a first terminal group, and a second terminal group. A circuit board, which has a first electrode and a second electrode, is mountable on the power semiconductor module in such a way that in the mounted state each terminal of the first group is electrically conductively connected to the first electrode and each terminal of the second group is electrically conductively connected to the second electrode. A first isolation web and/or a second isolation web is provided. Each isolation web is fixed to the circuit board even in the unmounted state, and arranged between the first terminal group and the second terminal group in the mounted state.

Abstract translation: 功率半导体模块包括具有顶侧，第一端子组和第二端子组的模块外壳。 具有第一电极和第二电极的电路板可以安装在功率半导体模块上，使得在安装状态下，第一组的每个端子与第一电极和第二电极的每个端子导电连接 组与第二电极导电连接。 提供了第一隔离网和/或第二隔离网。 即使处于未安装状态，每个隔离网固定到电路板，并且在安装状态下布置在第一端子组和第二端子组之间。

公开(公告)号：US20160014894A1

公开(公告)日：2016-01-14

申请号：US14864895

申请日：2015-09-25

Applicant: FUJIFILM CORPORATION

Inventor： YASUSHI ENDO ,  NOBUYUKI TADA ,  KENJI NAOI ,  TOMOHITO ASAI ,  HIDEO IKEDA ,  MICHIHIRO SHIBATA

IPC: H05K1/11 ,  H05K1/09

CPC classification number: H05K1/11 ,  C08F220/18 ,  C09J133/08 ,  C09J133/10 ,  C09J133/26 ,  G06F3/044 ,  G06F2203/04103 ,  G06F2203/04112 ,  H05K1/0289 ,  H05K1/092 ,  H05K3/285 ,  H05K3/4673 ,  H05K2201/0108 ,  H05K2201/0761 ,  H05K2201/0769 ,  C08F2220/1858 ,  C08F220/20

Abstract: This wiring board is provided with: a plurality of metal wires disposed upon an insulating substrate; and a transparent adhesive agent layer which is disposed upon the metal wires, and which is in direct contact with the metal wires. The metal wires include: a first metal wire which has a pulse signal supplied thereto; and a second metal wire which has a fixed electric potential applied thereto. The pulse signal has a reference level identical to the fixed electric potential, and has a pulse train in which a plurality of pulses having a pulse width of not more than 3 msec are arranged, the integral time of the pulses in a period of 600 seconds being less than 60 seconds.

Abstract translation: 该布线板设置有：设置在绝缘基板上的多个金属线; 以及设置在金属线上并与金属线直接接触的透明粘合剂层。 金属线包括：具有供给脉冲信号的第一金属线; 以及施加有固定电位的第二金属线。 脉冲信号具有与固定电位相同的参考电平，并且具有脉冲序列，其中布置脉冲宽度不超过3毫秒的多个脉冲，脉冲在600秒的周期内的积分时间 小于60秒。

公开(公告)号：US20150305164A1

公开(公告)日：2015-10-22

申请号：US14647807

申请日：2015-01-11

Applicant: SHENZHEN CHINA STAR OPTOELECTRONIC TECHNOLOGY CO., LTD.

Inventor： Che-chang HU ,  Kuang-Yao CHANG ,  Qian CAO

IPC: H05K3/02 ,  F21V29/70

CPC classification number: H05K3/02 ,  F21V29/70 ,  H05K1/056 ,  H05K2201/0761 ,  H05K2201/10106 ,  H05K2203/0228 ,  H05K2203/302

Abstract: A method for manufacturing a printed circuit board of a backlight module is provided. The printed circuit board includes a light bar region and a heat dissipating region. The light bar region used for mounting a light bar of the backlight module and formed with a conductive circuit for supplying power for the light bar. The heat dissipating region is connected with the light bar region. A connection location of the light bar region and the heat dissipating region is subjected to cutting to form a slot located at a side of the printed circuit board in order to prevent short-circuiting between the heat dissipating region and the conductive circuit of the light bar region. The cutting is made to partly penetrate through the thickness of a dielectric layer on which the conductive circuit is formed in order to completely separate the light bar region from the heat dissipating region.

Abstract translation: 提供一种用于制造背光模块的印刷电路板的方法。 印刷电路板包括光条区域和散热区域。 用于安装背光模块的光棒并形成有用于为光棒供电的导电电路的光条区域。 散热区域与光条区域连接。 对光棒区域和散热区域的连接位置进行切割以形成位于印刷电路板侧的狭槽，以防止散热区域与光条的导电电路之间的短路 地区。 切割部分地穿透其上形成有导电电路的电介质层的厚度，以便将光条区域与散热区域完全分离。

公开(公告)号：US09084345B2

公开(公告)日：2015-07-14

申请号：US13811279

申请日：2013-01-11

Applicant: Shenzhen China Star Optoelectronics Technology Co., Ltd.

Inventor： Che-chang Hu ,  Kuang-Yao Chang ,  Qian Cao

IPC: H05K1/02 ,  G02F1/1335 ,  H05K1/05

CPC classification number: H05K1/0203 ,  G02B6/0001 ,  G02F1/1336 ,  G02F2001/133612 ,  G02F2001/133628 ,  H05K1/056 ,  H05K2201/0761 ,  H05K2201/10106 ,  H05K2203/0228 ,  H05K2203/302

Abstract: The present invention discloses a backlight module, a printed circuit board used for a backlight module, and a manufacturing method for the same. The printed circuit board comprises a light bar region and a heat dissipating region. The light bar region used for mounting a light bar of the backlight module and formed with a conductive circuit for supplying power for the light bar; and the heat dissipating region connected with the light bar region, wherein, a connection location of the light bar region and the heat dissipating region disposes with a cutting slot and the cutting slot locates at a side of the printed circuit board for mounting the light bar in order to prevent a short-circuit connection between the heat dissipating region and the conductive circuit of the light bar region through the cutting slot. The present invention can avoid the short circuit problem due to uncompleted etching of the conductive layer on the heat dissipating region of the printed circuit board.

Abstract translation: 本发明公开了一种背光模块，背光模块用的印刷电路板及其制造方法。 印刷电路板包括光条区域和散热区域。 所述灯条区域用于安装所述背光模块的灯条并形成有用于为所述灯条供电的导电电路; 以及与轻棒区域连接的散热区域，其中，光条区域和散热区域的连接位置与切割槽配合，并且切割槽位于印刷电路板的侧面，用于安装光条 以防止散热区域和通过切割槽的光条区域的导电电路之间的短路连接。 本发明可以避免由于印刷电路板的散热区上的导电层的未完成蚀刻引起的短路问题。

公开(公告)号：US20150041859A1

公开(公告)日：2015-02-12

申请号：US13962622

申请日：2013-08-08

Applicant: Infineon Technologies AG

Inventor： Ralf Otremba ,  Josef Höglauer

IPC: H01L23/522 ,  H01L29/778

CPC classification number: H01L23/5226 ,  H01L23/3107 ,  H01L23/49503 ,  H01L23/49541 ,  H01L23/49827 ,  H01L23/49838 ,  H01L29/2003 ,  H01L29/778 ,  H01L2224/48091 ,  H05K1/0262 ,  H05K1/181 ,  H05K2201/0761 ,  H05K2201/093 ,  H05K2201/09309 ,  H05K2201/09336 ,  H05K2201/09972 ,  H01L2924/00014

Abstract: A redistribution board includes a first conductive layer including a redistribution structure for low voltage signals, a second conductive layer including a redistribution structure for high voltage signals, and a non-conductive layer. The second conductive layer is spaced apart from the first conductive layer by the non-conductive layer. The redistribution board further includes a conductive connector extending from a mounting surface of the redistribution board to the second conductive layer. The conductive connector is surrounded by a low voltage trace of the first conductive layer.

Abstract translation: 再分配板包括：第一导电层，包括用于低电压信号的再分配结构;第二导电层，包括用于高电压信号的再分配结构;以及非导电层。 第二导电层通过非导电层与第一导电层间隔开。 再分配板还包括从再分布板的安装表面延伸到第二导电层的导电连接器。 导电连接器被第一导电层的低电压迹线围绕。

公开(公告)号：US20140192514A1

公开(公告)日：2014-07-10

申请号：US13811279

申请日：2013-01-11

Applicant: Che-chang Hu ,  Kuang-Yao Chang ,  Qian Cao

Inventor： Che-chang Hu ,  Kuang-Yao Chang ,  Qian Cao

IPC: F21V15/01 ,  H05K1/02

CPC classification number: H05K1/0203 ,  G02B6/0001 ,  G02F1/1336 ,  G02F2001/133612 ,  G02F2001/133628 ,  H05K1/056 ,  H05K2201/0761 ,  H05K2201/10106 ,  H05K2203/0228 ,  H05K2203/302

Abstract: The present invention discloses a backlight module, a printed circuit board used for a backlight module, and a manufacturing method for the same. The printed circuit board comprises a light bar region and a heat dissipating region. The light bar region used for mounting a light bar of the backlight module and formed with a conductive circuit for supplying power for the light bar; and the heat dissipating region connected with the light bar region, wherein, a connection location of the light bar region and the heat dissipating region disposes with a cutting slot and the cutting slot locates at a side of the printed circuit board for mounting the light bar in order to prevent a short-circuit connection between the heat dissipating region and the conductive circuit of the light bar region through the cutting slot. The present invention can avoid the short circuit problem due to uncompleted etching of the conductive layer on the heat dissipating region of the printed circuit board.

Abstract translation: 本发明公开了一种背光模块，背光模块用的印刷电路板及其制造方法。 印刷电路板包括光条区域和散热区域。 所述灯条区域用于安装所述背光模块的灯条并形成有用于为所述灯条供电的导电电路; 以及与轻棒区域连接的散热区域，其中，光条区域和散热区域的连接位置与切割槽配合，切割槽位于印刷电路板的侧面，用于安装光条 以防止散热区域和通过切割槽的光条区域的导电电路之间的短路连接。 本发明可以避免由于印刷电路板的散热区上的导电层的未完成蚀刻引起的短路问题。

公开(公告)号：US20130136887A1

公开(公告)日：2013-05-30

申请号：US13681872

申请日：2012-11-20

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Young Kyung Kim

IPC: H05K1/05

CPC classification number: H05K1/056 ,  H05K3/0061 ,  H05K3/022 ,  H05K2201/0154 ,  H05K2201/0761 ,  H05K2201/0909 ,  H05K2201/09145 ,  H05K2201/09154 ,  H05K2201/09827 ,  H05K2201/09845 ,  H05K2203/0228 ,  Y10T156/10

Abstract: There is provided a copper clad laminate (CCL) including: a metal plate; an insulating layer having a planar area greater than that of the metal plate and laminated on the metal plate; and a copper layer laminated on the insulating layer, wherein edges of the insulating layer extend outwardly beyond edges of the metal plate so that an insulation distance insulating the edges of the metal plate from edges of the copper layer is formed. The insulating layer may include a polyimide layer, and a polyimide bonding layer.

Abstract translation: 提供了一种覆铜层压板（CCL），包括：金属板; 绝缘层，其平面面积大于金属板的面积，并且层压在金属板上; 以及层叠在所述绝缘层上的铜层，其中所述绝缘层的边缘向外延伸超过所述金属板的边缘，使得形成将所述金属板的边缘与所述铜层的边缘绝缘的绝缘距离。 绝缘层可以包括聚酰亚胺层和聚酰亚胺接合层。

公开(公告)号：US08426746B2

公开(公告)日：2013-04-23

申请号：US13048904

申请日：2011-03-16

Applicant: Yasunori Yamanaka

Inventor： Yasunori Yamanaka

IPC: H05K1/16

CPC classification number: H05K3/306 ,  H05K1/0256 ,  H05K3/3447 ,  H05K2201/0761 ,  H05K2201/09063 ,  H05K2203/1572

Abstract: An electronic device includes an electronic component provided with leads. A printed circuit board has a front surface and a back surface and is provided with through holes and a groove hole. The through holes are capable of receiving the leads, respectively. The groove hole is formed so as to cross straight lines that connect the through holes. A first insulating spacer is provided on the groove hole between the leads so as to isolate the leads from each other and is positioned between the electronic component and the front surface of the printed circuit board. A second insulating spacer is inserted through the groove hole from the back surface of the printed circuit board and engages with the first insulating spacer so as to isolate end portions of the leads from each other.

Abstract translation: 电子设备包括具有引线的电子部件。 印刷电路板具有前表面和后表面，并且设置有通孔和凹槽。 通孔能够分别接收引线。 凹槽形成为穿过连接通孔的直线。 在引线之间的槽孔中设置第一绝缘隔离物，以将引线彼此隔离并且位于电子部件和印刷电路板的前表面之间。 第二绝缘隔离物从印刷电路板的后表面穿过槽孔插入，并与第一绝缘垫片接合，以使导线的端部彼此隔离。

公开(公告)号：US08378227B2

公开(公告)日：2013-02-19

申请号：US12585754

申请日：2009-09-24

Applicant: Seiichi Inoue

Inventor： Seiichi Inoue

IPC: H05K1/11

CPC classification number: H05K3/246 ,  H05K1/0256 ,  H05K1/036 ,  H05K3/0032 ,  H05K3/1208 ,  H05K3/125 ,  H05K3/28 ,  H05K2201/0116 ,  H05K2201/015 ,  H05K2201/0195 ,  H05K2201/0347 ,  H05K2201/0761 ,  H05K2201/0769 ,  H05K2201/09036 ,  H05K2201/09881 ,  H05K2203/013 ,  H05K2203/1147 ,  H05K2203/1173 ,  Y10T29/49155

Abstract: A method of forming a wiring board comprises: a step of forming a receptive layer having a porous structure on a substrate; a step of forming wiring portions in a desired conductive pattern on a surface of the receptive layer by ejecting a colloidal metal solution for drawing by an ink-jet system based on image date of the conductive pattern; and a step of performing a migration-proof treatment on at least part of the receptive layer exposed between mutually adjacent wiring portions.

Abstract translation: 形成布线板的方法包括：在基板上形成具有多孔结构的接收层的步骤; 基于导电图案的图像日期，通过喷射通过喷墨系统进行拉伸的胶体金属溶液，在接收层的表面上形成所需导电图案中的布线部分的步骤; 以及对相互相邻的布线部之间露出的接受层的至少一部分进行防迁移处理的步骤。

公开(公告)号：US08110434B2

公开(公告)日：2012-02-07

申请号：US12693096

申请日：2010-01-25

Applicant: Takashi Okada ,  Kiyokazu Okada ,  Akinori Ono ,  Taku Nishiyama

Inventor： Takashi Okada ,  Kiyokazu Okada ,  Akinori Ono ,  Taku Nishiyama

IPC: H01L21/44 ,  H01L21/50 ,  H01L21/48 ,  H01L21/82

CPC classification number: H05K1/0256 ,  H01L2224/48091 ,  H01L2224/49171 ,  H01L2924/181 ,  H05K1/117 ,  H05K3/0052 ,  H05K3/284 ,  H05K2201/0761 ,  H05K2201/09145 ,  H05K2201/09227 ,  H05K2203/0228 ,  H01L2924/00012 ,  H01L2924/00014

Abstract: A circuit board has a curved portion provided in at least one side of an external shape thereof. An external connecting terminal is provided on a first main surface of the circuit board. A semiconductor element is mounted on a second main surface of the circuit board. A first wiring network is provided in a region except the terminal region on the first main surface. A second wiring network is provided on the second main surface. Distance from the side including the curved portion to the first wiring network is larger than distance from at least one of the other sides to the first wiring networks, and distance from the side including the curved portion to the second wiring network is larger than distance from at least one of the other sides to the second wiring networks.

Abstract translation: 电路板具有设置在其外部形状的至少一侧的弯曲部分。 外部连接端子设置在电路板的第一主表面上。 半导体元件安装在电路板的第二主表面上。 第一布线网络设置在除了第一主表面上的端子区域之外的区域中。 第二配线网络设置在第二主表面上。 从包括弯曲部分到第一布线网络的一侧的距离大于从另一侧至第一布线网络中的至少一个的距离，并且从包括弯曲部分到第二布线网络的一侧的距离大于距离 至少一个对方到第二布线网络。