公开(公告)号：USD505964S1

公开(公告)日：2005-06-07

申请号：US29194887

申请日：2003-12-03

申请人： Masanori Minamio ,  Yoshinobu Kunitomo ,  Mutsuo Tsuji ,  Koichi Yamauchi

设计人： Masanori Minamio ,  Yoshinobu Kunitomo ,  Mutsuo Tsuji ,  Koichi Yamauchi

公开(公告)号：US20050110121A1

公开(公告)日：2005-05-26

申请号：US11018541

申请日：2004-12-21

申请人： Masanori Minamio ,  Haruto Nagata ,  Tetsushi Nishio

发明人： Masanori Minamio ,  Haruto Nagata ,  Tetsushi Nishio

IPC分类号： H01L23/12 ,  H01L21/50 ,  H01L21/56 ,  H01L23/28 ,  H01L23/48 ,  H01L23/495 ,  H01L23/50 ,  H01L25/10

CPC分类号： H01L23/4951 ,  H01L21/56 ,  H01L23/4952 ,  H01L23/49548 ,  H01L23/49575 ,  H01L24/45 ,  H01L24/48 ,  H01L24/81 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/16145 ,  H01L2224/16245 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48465 ,  H01L2224/81801 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06586 ,  H01L2225/1029 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/00015 ,  H01L2224/05599 ,  H01L2924/00012 ,  H01L2924/00

摘要： A resin-encapsulated semiconductor device includes: a semiconductor chip on a surface of which a group of electrodes is disposed; a plurality of inner leads arranged along a periphery of the semiconductor chip; connecting members for connecting the electrodes of the semiconductor chip with the respective inner leads, an encapsulating resin for encapsulating surfaces of the semiconductor chip and the connecting members; and external electrodes exposed from the encapsulating resin. Each of the inner leads extends across the periphery of the semiconductor chip from an internal side to an external side of the periphery, and includes a protruded portion provided on a surface of the inner lead on an external side relative to the periphery of the semiconductor chip, the protruded portion being protruded in a thickness direction. Conductive bumps as the connecting members on the electrodes of the semiconductor chip are connected with internal portions of the respective inner leads, the internal portions being positioned inward relative to the protruded portions. The external electrodes are formed on surfaces of the protruded portions, and tip ends of the external electrodes are protruded relative to a back face of the semiconductor chip.

摘要翻译： 树脂封装的半导体器件包括：在其表面上设置一组电极的半导体芯片; 沿着半导体芯片的周边布置的多个内引线; 用于将半导体芯片的电极与各个内部引线连接的连接构件，用于封装半导体芯片和连接构件的表面的封装树脂; 和从封装树脂露出的外部电极。 每个内引线从外周的内侧延伸到半导体芯片的周边，并且包括设置在内引线的相对于半导体芯片周边的外侧的表面上的突出部 突出部分沿厚度方向突出。 作为半导体芯片的电极上的连接构件的导电凸块与内部引线的内部部分连接，内部部分相对于突出部分位于内侧。 外部电极形成在突出部的表面上，外部电极的前端相对于半导体芯片的背面突出。

公开(公告)号：US20050088565A1

公开(公告)日：2005-04-28

申请号：US10969822

申请日：2004-10-21

申请人： Katsutoshi Shimizu ,  Masanori Minamio ,  Kouichi Yamauchi

发明人： Katsutoshi Shimizu ,  Masanori Minamio ,  Kouichi Yamauchi

IPC分类号： H01L27/14 ,  H01L23/02 ,  H01L23/04 ,  H01L23/08 ,  H01L23/50 ,  H01L27/146 ,  H01L31/0203 ,  H04N5/335 ,  H04N5/372 ,  H04N5/225

CPC分类号： H01L27/14618 ,  H01L24/32 ,  H01L24/97 ,  H01L27/14683 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00

摘要： A solid-state imaging-device includes a base, frame-shaped ribs provided on the base and forming an internal space, a plurality of wiring members for electrically leading the internal space of a housing formed by the base and the ribs to an external portion, an imaging element fixed to the base inside the internal space, a transparent plate fixed to an upper surface of the ribs, and connecting members electrically connecting electrodes of the imaging element to the wiring members, wherein a plurality of protrusions are provided in a region of the base that faces the imaging element, and the imaging element is fixed by adhesive to the base while being supported by the protrusions. The protrusions enable the imaging element to avoid distortion caused by following the surface of the base, thereby suppressing the effect on electrical properties of the imaging element.

摘要翻译： 固态成像装置包括基部，设置在基部上并形成内部空间的框状肋，多个布线构件，用于将由基部和肋形成的壳体的内部空间电引导到外部部分 ，固定在内部空间内的基座的成像元件，固定到肋的上表面的透明板，以及将成像元件的电极电连接到布线构件的连接构件，其中在区域中设置多个突起 面向成像元件的基部，并且成像元件通过粘合剂固定到基部，同时由突起支撑。 突起使得成像元件能够避免由于跟随基底的表面引起的变形，从而抑制对成像元件的电性能的影响。

公开(公告)号：US20050074912A1

公开(公告)日：2005-04-07

申请号：US10927715

申请日：2004-08-27

申请人： Kouichi Yamauchi ,  Masanori Minamio ,  Katsutoshi Shimizu ,  Haruto Nagata

发明人： Kouichi Yamauchi ,  Masanori Minamio ,  Katsutoshi Shimizu ,  Haruto Nagata

IPC分类号： H01L27/14 ,  H01L21/00 ,  H01L21/50 ,  H01L23/00 ,  H01L23/02 ,  H01L23/34 ,  H01L23/50 ,  H01L27/146 ,  H01L31/0203 ,  H04N5/335 ,  H04N101/00

CPC分类号： H01L27/14618 ,  H01L24/73 ,  H01L24/97 ,  H01L27/14625 ,  H01L27/14683 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2924/00012

摘要： A solid-state imaging device is manufactured according to the steps below. A lattice-shaped rib forming member, which is an aggregation of a plurality of frame-shaped ribs for configuring a plurality of solid-state imaging devices, is resin-molded. An aggregate wiring board is used, which has regions corresponding to a plurality of the wiring boards, and in which a plurality of the wiring members are provided in each of the regions, and the imaging element is fastened to each region of the aggregate wiring board and the electrodes of the imaging elements and the wiring members are connected by a thin metal wire. The rib forming member is placed on the wiring board face and joined to the wiring board face, so that the imaging element is disposed inside the lattice elements of the rib forming member. The transparent plate is fastened to an upper face of the rib forming member, and each housing is cut in a direction perpendicular to the base portion, and in a direction dividing into two the width of the rib forming member, and separating the solid-state imaging devices into individual pieces It is possible to make a low cost housing, avoiding deformations caused by a difference in thermal expansion between the wiring board and the ribs made of a resin, when forming a plurality of housings together.

摘要翻译： 根据以下步骤制造固态成像装置。 作为用于配置多个固态成像装置的多个框状肋的聚集体的格子状肋形成构件被树脂模制。 使用具有与多个布线板对应的区域的集合布线板，并且在各区域中设置有多个布线构件，并且将摄像元件紧固到聚集布线板的各个区域 并且成像元件的电极和布线构件通过细金属丝连接。 肋形成构件被放置在布线板面上并且接合到布线板面，使得成像元件设置在肋形成构件的格子元件的内部。 将透明板紧固到肋形成构件的上表面，并且将每个壳体沿垂直于基部的方向切割，并且沿着分成肋形成构件的宽度的两个方向切割，并且将固态 成像装置成为单独的部件当将多个壳体一起形成时，可以制造低成本的壳体，以避免由布线板和由树脂制成的肋之间的热膨胀差引起的变形。

公开(公告)号：US06864117B2

公开(公告)日：2005-03-08

申请号：US10669229

申请日：2003-09-24

申请人： Masanori Minamio ,  Hiroshi Horiki ,  Tetsushi Nishio

发明人： Masanori Minamio ,  Hiroshi Horiki ,  Tetsushi Nishio

IPC分类号： H01L27/14 ,  H01L23/00 ,  H01L23/08 ,  H01L27/146 ,  H01L31/02 ,  H01L31/0203 ,  H04N5/335 ,  H01L21/00

CPC分类号： H01L27/14601 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2924/00014 ,  H01L2224/05599

摘要： A method for producing a solid-state imaging device including a base of an insulation material having a frame form in planar shape with an aperture formed in an inner region thereof and having a substantially uniform thickness; a wiring provided on one surface of the base and extending toward the outside from the peripheral portion of the aperture; and an imaging element mounted on the surface of the base provided with the wiring so that a light-receptive region of the element faces the aperture. Cavities for resin-molding a plurality of the bases are formed and a tape member supporting thin metal plate leads for forming a plurality of sets of wirings corresponding to the respective bases is loaded between molds having pins for forming positioning holes of the base; and the thin metal plate leads are placed in the cavities. Then, a sealing resin is filled in the cavities and cured. A resin molded member, in which the thin metal plate leads are embedded, is taken out; and the tape member is removed from the resin molded member, and the resin molded member is divided into a plurality of pieces on which an imaging element is mounted. The base on which the imaging element is mounted can be formed to have a practically sufficient flatness.

摘要翻译： 一种固体摄像装置的制造方法，其特征在于，包括：具有平面形状的框架形状的绝缘材料的基部，所述绝缘材料的底部形成在其内部区域中并且具有基本均匀的厚度; 设置在基座的一个表面上并从孔的周边部分朝向外部延伸的布线; 以及安装在设置有布线的基座的表面上的成像元件，使得元件的光接收区域面向孔。 形成用于树脂成型多个基座的腔体，并且在具有用于形成基座的定位孔的销的模具之间装载用于形成与各个基座相对应的多组布线的用于形成多组布线的支撑薄金属板引线的带构件引线; 并且薄金属板引线被放置在空腔中。 然后，将密封树脂填充到空腔中并固化。 将金属板引线嵌入其中的树脂模制件被取出; 从树脂成型体除去带状部件，将树脂成形体分割成安装有摄像元件的多个片。 安装成像元件的基座可以形成为具有实际上足够的平坦度。

公开(公告)号：US09030003B2

公开(公告)日：2015-05-12

申请号：US13697886

申请日：2012-03-26

申请人： Masanori Minamio ,  Tatsuo Sasaoka

发明人： Masanori Minamio ,  Tatsuo Sasaoka

IPC分类号： H01L23/495 ,  H01L23/10 ,  H01L23/433 ,  H01L21/56 ,  H01L23/00

CPC分类号： H01L23/49558 ,  H01L21/565 ,  H01L21/566 ,  H01L23/29 ,  H01L23/4334 ,  H01L23/49537 ,  H01L23/49562 ,  H01L23/49568 ,  H01L23/49575 ,  H01L23/49586 ,  H01L24/48 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/1301 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： An encapsulated semiconductor device includes: a first conduction path formative plate (1); a second conduction path formative plate (5) joined to the first conduction path formative plate; a power element (12) bonded to the first conduction path formative plate; a heatsink (14) held by the first conduction path formative plate with an insulation sheet (13) interposed between the heatsink and the first conduction path formative plate; and an encapsulation resin (9) configured to encapsulate the first and second conduction path formative plates. A through hole (3) or a lead gap (1b) is formed in a region of the first conduction path formative plate in contact with the insulation sheet. The insulation sheet is press-fitted into the through hole or the lead gap.

摘要翻译： 封装的半导体器件包括：第一导电路径形成板（1）; 连接到第一传导路径形成板的第二传导路径形成板（5） 功率元件（12），其接合到所述第一传导路径形成板; 由所述第一导电路径形成板保持的散热片（14），其间插入在所述散热器和所述第一导电路径形成板之间的绝缘片（13） 以及被配置为封装所述第一和第二导电路径形成板的封装树脂（9）。 在与绝缘片接触的第一传导路径形成板的区域中形成有通孔（3）或引线间隙（1b）。 绝缘片被压配合到通孔或引线间隙中。

公开(公告)号：US09013029B2

公开(公告)日：2015-04-21

申请号：US13882436

申请日：2012-08-08

申请人： Masanori Minamio ,  Tatsuo Sasaoka

发明人： Masanori Minamio ,  Tatsuo Sasaoka

IPC分类号： H01L23/495 ,  H01L21/48 ,  H01L23/433 ,  B23K20/02 ,  B23K20/16 ,  B23K20/227 ,  B23K20/233 ,  B23K35/00

CPC分类号： H01L21/4842 ,  B23K20/023 ,  B23K20/16 ,  B23K20/227 ,  B23K20/233 ,  B23K35/002 ,  B23K35/004 ,  B23K35/007 ,  B23K2101/18 ,  B23K2101/42 ,  B23K2103/04 ,  B23K2103/10 ,  B23K2103/12 ,  H01L21/4825 ,  H01L21/4835 ,  H01L23/4334 ,  H01L23/495 ,  H01L23/49537 ,  H01L23/49575 ,  H01L24/73 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/00

摘要： A joined body which is formed by, first, an aqueous solution containing an oxide film remover is disposed on a junction region of a first metal plate. Then, with the aqueous solution remaining on the first metal plate, a second metal plate is placed on the first metal plate. Thereafter, a load is applied to junction regions of the first metal plate and the second metal plate in the vertical direction, thereby joining the first metal plate and the second metal plate together to form a junction portion.

摘要翻译： 首先在含有氧化膜去除剂的水溶液中形成的接合体设置在第一金属板的接合区域上。 然后，将水溶液保留在第一金属板上，将第二金属板放置在第一金属板上。 此后，在垂直方向上对第一金属板和第二金属板的接合区域施加负载，从而将第一金属板和第二金属板接合在一起形成接合部。

公开(公告)号：US20120299166A1

公开(公告)日：2012-11-29

申请号：US13577362

申请日：2011-11-30

申请人： Masanori Minamio ,  Zyunya Tanaka ,  Ryoutarou Imura

发明人： Masanori Minamio ,  Zyunya Tanaka ,  Ryoutarou Imura

IPC分类号： H01L23/495 ,  B23K20/00 ,  H01L21/58

CPC分类号： B21D39/032 ,  H01L23/49537 ,  H01L23/49551 ,  H01L23/49568 ,  H01L23/49575 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/32245 ,  H01L2224/45014 ,  H01L2224/451 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/1301 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

摘要： A conduction path includes a first conduction path forming plate (11) made of a first metal and having a through hole (13), and a second conduction path forming plate (15) made of a second metal and having a press-fit portion (17) press-fitted into the through hole. A wall surface of the through hole and a side surface of the press-fit portion forms an inclined bonding surface (18) inclined relative to a normal line of an overlap surface of the first conduction path forming plate and the second conduction path forming plate, and a bonding portion (25) formed by metal flow is formed in a region located in a periphery of the inclined bonding surface.

摘要翻译： 导电路径包括由第一金属制成并具有通孔（13）的第一导电路径形成板（11）和由第二金属制成并具有压配部分的第二导电路径形成板（15） 17）压入通孔。 通孔的壁面和压入部的侧面形成相对于第一导电路形成板和第二导电路径形成板的重叠面的法线倾斜的倾斜接合面（18） 并且在位于倾斜接合表面的周边的区域中形成由金属流形成的接合部分（25）。

公开(公告)号：US08077900B2

公开(公告)日：2011-12-13

申请号：US12396010

申请日：2009-03-02

申请人： Masanori Minamio ,  Yoshihiro Tomita ,  Koji Nomura

发明人： Masanori Minamio ,  Yoshihiro Tomita ,  Koji Nomura

IPC分类号： H04R11/04

CPC分类号： H04R31/00 ,  Y10T29/49005

摘要： A microphone includes: a substrate including a tone hole and having a top surface on which a substrate electrode is provided; a converter provided on the top surface of the substrate and including a main body having a back space, a diaphragm provided at the bottom of the back space of the main body, and a converter electrode provided on a region of a bottom surface of the main body facing the substrate electrode; and a bump connecting the substrate electrode and the converter electrode to each other. The diaphragm vibrates in response to sound entering from the tone hole. The converter converts sound into a signal.

摘要翻译： 麦克风包括：包括音孔并具有其上设置有基板电极的顶表面的基板; 设置在所述基板的上表面上的转换器，具有设置在所述主体的后部空间的底部的隔膜，设置在所述主体的后部空间的底部的隔膜以及设置在所述主体的底面的区域的转换电极 身体面向衬底电极; 以及将基板电极和转换器电极彼此连接的凸块。 响应于从音孔进入的声音，隔膜振动。 转换器将声音转换为信号。

公开(公告)号：US20110163328A1

公开(公告)日：2011-07-07

申请号：US13048221

申请日：2011-03-15

申请人： Yoshiki TAKAYAMA ,  Masanori Minamio ,  Tetsushi Nishio

发明人： Yoshiki TAKAYAMA ,  Masanori Minamio ,  Tetsushi Nishio

IPC分类号： H01L33/48

CPC分类号： H01L31/0203 ,  H01L33/54 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00

摘要： An optical semiconductor device includes: a package having a bottom portion and a sidewall portion; a semiconductor chip having an optical element formed on one surface thereof and having an opposite surface to the one surface fixed to the bottom portion of the package; a transparent member fixed to the semiconductor chip so as to cover the optical element; and a sealing resin filling a space between the package and the semiconductor chip. The sidewall portion has in an upper part thereof an overhang portion that projects toward inside of the package. The transparent member is exposed from a window portion formed by the overhang portion.

摘要翻译： 光学半导体器件包括：具有底部和侧壁部分的封装; 半导体芯片，其具有在其一个表面上形成并且具有与固定到封装的底部的一个表面相对的表面的光学元件; 固定到所述半导体芯片以便覆盖所述光学元件的透明构件; 以及填充封装和半导体芯片之间的空间的密封树脂。 侧壁部分的上部具有向包装内部突出的突出部分。 透明构件从由突出部形成的窗口部露出。