公开(公告)号：US6010579A

公开(公告)日：2000-01-04

申请号：US26035

申请日：1998-02-19

Applicant: Francois J. Henley ,  Nathan W. Cheung

Inventor： Francois J. Henley ,  Nathan W. Cheung

IPC: B24C1/00 ,  B26F3/00 ,  B26F3/02 ,  B32B5/16 ,  B81C1/00 ,  H01L21/00 ,  H01L21/18 ,  H01L21/20 ,  H01L21/22 ,  H01L21/223 ,  H01L21/265 ,  H01L21/30 ,  H01L21/301 ,  H01L21/302 ,  H01L21/304 ,  H01L21/36 ,  H01L21/38 ,  H01L21/425 ,  H01L21/44 ,  H01L21/46 ,  H01L21/461 ,  H01L21/48 ,  H01L21/50 ,  H01L21/762 ,  H01L21/78 ,  H01L21/8238

CPC classification number: H01L21/187 ,  B81C1/0038 ,  H01L21/2007 ,  H01L21/2236 ,  H01L21/26506 ,  H01L21/304 ,  H01L21/7624 ,  H01L21/76254 ,  H01L21/7813 ,  B81C2201/0191 ,  B81C2201/0192 ,  Y10S117/915 ,  Y10S156/93 ,  Y10S438/974 ,  Y10S438/977 ,  Y10T156/11 ,  Y10T156/1158 ,  Y10T156/19 ,  Y10T428/21 ,  Y10T428/24893 ,  Y10T428/249956

Abstract: A donor substrate (10) for forming multiple thin films of material (12). In one embodiment, a first thin film of material is separated or cleaved from a donor substrate by introducing energetic particles (22) through a surface of a donor substrate (10) to a selected depth (20) underneath the surface, where the particles have a relatively high concentration to define donor substrate material (12) above the selected depth. Energy is provided to a selected region of the substrate to cleave a thin film of material from the donor substrate. Particles are introduced again into the donor substrate underneath a fresh, or cleaved, surface of the donor substrate. A second thin film of material is then cleaved from the donor substrate.

Abstract translation: 一种用于形成材料（12）的多个薄膜的施主衬底（10）。 在一个实施例中，通过将能量粒子（22）通过供体衬底（10）的表面引导到表面下方的所选择的深度（20），将第一薄膜材料从供体衬底分离或切割，其中颗粒具有 在所选择的深度上限定施主衬底材料（12）的相对高的浓度。 能量被提供到衬底的选定区域以从施主衬底切割材料薄膜。 将颗粒再次引入供体底物的供体底物的新鲜或切割的表面下方。 然后从供体基材上切下第二薄膜材料。

公开(公告)号：US20230141149A1

公开(公告)日：2023-05-11

申请号：US18092995

申请日：2023-01-04

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Martin B. Wolk ,  Michael Benton Free ,  Margaret M. Vogel-Martin ,  Evan L. Schwartz ,  Mieczyslaw H. Mazurek ,  Terry O. Collier

IPC: B32B3/26 ,  G03F7/16 ,  G03F7/34 ,  B82Y40/00 ,  G03F7/00 ,  C03C17/28 ,  C03C17/34 ,  H10K59/38 ,  H10K59/12 ,  H10K85/40 ,  H10K77/10

CPC classification number: B32B3/263 ,  G03F7/161 ,  G03F7/34 ,  B82Y40/00 ,  G03F7/0002 ,  C03C17/28 ,  C03C17/34 ,  H01L27/322 ,  H01L27/3244 ,  H01L51/0094 ,  H01L51/0097 ,  Y10T428/24521 ,  B81C2201/0191 ,  H01L2221/68368 ,  H01L51/004

Abstract: Organic light emitting diode (OLED) devices are disclosed that include a first layer; a backfill layer having a structured first side and a second side; a planarization layer having a structured first side and a second side; and a second layer; wherein the second side of the backfill layer is coincident with and adjacent to the first layer, the second side of the planarization layer is coincident with and adjacent to the second layer, the structured first side of the backfill layer and structured first side of the planarization layer form a structured interface, the refractive index of the backfill layer is index matched to the first layer, and the refractive index of the planarization layer is index matched to the second layer.

公开(公告)号：US09711744B2

公开(公告)日：2017-07-18

申请号：US13723716

申请日：2012-12-21

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Martin B. Wolk ,  Michael Benton Free ,  Margaret M. Vogel-Martin ,  Evan L. Schwartz ,  Mieczyslaw H. Mazurek ,  Terry O. Collier

IPC: B32B3/26 ,  H01L51/00 ,  G03F7/16 ,  G03F7/34 ,  B82Y40/00 ,  H01L27/32 ,  G03F7/00 ,  C03C17/28 ,  C03C17/34

CPC classification number: H01L51/0097 ,  B32B3/263 ,  B81C2201/0191 ,  B82Y40/00 ,  C03C17/28 ,  C03C17/34 ,  G03F7/0002 ,  G03F7/161 ,  G03F7/34 ,  H01L27/322 ,  H01L27/3244 ,  H01L51/004 ,  H01L51/0094 ,  H01L2221/68368 ,  H01L2227/326 ,  H01L2251/301 ,  H01L2251/5338 ,  H01L2251/5369 ,  Y10T428/24521

Abstract: A transfer tape is disclosed that includes a carrier, a template layer having a first surface applied to the carrier and having a second surface opposite the first surface, wherein the second surface comprises a non-planar structured surface, a release coating disposed upon the non-planar structured surface of the template layer, and a backfill layer disposed upon and conforming to the non-planar structured surface of the release coating. In some embodiments, the backfill layer includes a silsesquioxane such as polyvinyl silsesquioxane. The disclosed transfer tape can be used to transfer replicated structures to a receptor substrate.

公开(公告)号：US08895406B2

公开(公告)日：2014-11-25

申请号：US13071027

申请日：2011-03-24

Applicant: John A. Rogers ,  Ralph G. Nuzzo ,  Matthew Meitl ,  Heung Cho Ko ,  Jongseung Yoon ,  Etienne Menard ,  Alfred J. Baca

Inventor： John A. Rogers ,  Ralph G. Nuzzo ,  Matthew Meitl ,  Heung Cho Ko ,  Jongseung Yoon ,  Etienne Menard ,  Alfred J. Baca

IPC: H01L21/30 ,  H01L21/302 ,  H01L21/469 ,  B82Y10/00 ,  B82Y20/00 ,  H01L29/15 ,  H01L31/0687 ,  H01L31/0725 ,  B81C1/00 ,  H01L29/20 ,  H01L21/78 ,  H01L31/072 ,  H01L31/068 ,  H01L33/00

CPC classification number: H01L31/0735 ,  B81C1/0046 ,  B81C2201/0191 ,  B82Y10/00 ,  B82Y20/00 ,  B82Y40/00 ,  H01L21/7813 ,  H01L29/155 ,  H01L29/20 ,  H01L31/03046 ,  H01L31/068 ,  H01L31/0687 ,  H01L31/072 ,  H01L31/0725 ,  H01L31/184 ,  H01L31/1844 ,  H01L33/0079 ,  H01L2924/0002 ,  Y02E10/52 ,  Y02E10/544 ,  Y02E10/547 ,  Y02P70/521 ,  Y10T156/1195 ,  H01L2924/00

Abstract: Provided are methods for making a device or device component by providing a multilayer structure having a plurality of functional layers and a plurality of release layers and releasing the functional layers from the multilayer structure by separating one or more of the release layers to generate a plurality of transferable structures. The transferable structures are printed onto a device substrate or device component supported by a device substrate. The methods and systems provide means for making high-quality and low-cost photovoltaic devices, transferable semiconductor structures, (opto-)electronic devices and device components.

Abstract translation: 提供了通过提供具有多个功能层和多个释放层的多层结构来制造器件或器件部件的方法，并且通过分离一个或多个释放层从多层结构释放功能层以产生多个 可转让结构。 可转移结构被印刷到由器件衬底支撑的器件衬底或器件部件上。 该方法和系统提供制造高质量和低成本的光伏器件，可转移的半导体结构（光电）器件和器件部件的手段。

公开(公告)号：US20140178646A1

公开(公告)日：2014-06-26

申请号：US13723716

申请日：2012-12-21

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Martin B. Wolk ,  Michael Benton Free ,  Margaret M. Vogel-Martin ,  Evan L. Schwartz ,  Mieczyslaw H. Mazurek ,  Terry O. Collier

IPC: B32B3/26

CPC classification number: H01L51/0097 ,  B32B3/263 ,  B81C2201/0191 ,  B82Y40/00 ,  C03C17/28 ,  C03C17/34 ,  G03F7/0002 ,  G03F7/161 ,  G03F7/34 ,  H01L27/322 ,  H01L27/3244 ,  H01L51/004 ,  H01L51/0094 ,  H01L2221/68368 ,  H01L2227/326 ,  H01L2251/301 ,  H01L2251/5338 ,  H01L2251/5369 ,  Y10T428/24521

Abstract: A transfer tape is disclosed that includes a carrier, a template layer having a first surface applied to the carrier and having a second surface opposite the first surface, wherein the second surface comprises a non-planar structured surface, a release coating disposed upon the non-planar structured surface of the template layer, and a backfill layer disposed upon and conforming to the non-planar structured surface of the release coating. In some embodiments, the backfill layer includes a silsesquioxane such as polyvinyl silsesquioxane. The disclosed transfer tape can be used to transfer replicated structures to a receptor substrate.

Abstract translation: 公开了一种转印带，其包括载体，模板层，其具有施加到载体的第一表面并具有与第一表面相对的第二表面，其中第二表面包括非平面结构化表面， 模板层的平面结构化表面，以及设置在剥离涂层的非平面结构化表面上并与其贴合的回填层。 在一些实施方案中，回填层包括倍半硅氧烷，例如聚乙烯基倍半硅氧烷。 所公开的转移带可用于将复制结构转移到受体底物。

公开(公告)号：US08667673B2

公开(公告)日：2014-03-11

申请号：US12840763

申请日：2010-07-21

Applicant: Takayuki Yamada ,  Kazuaki Tabata

Inventor： Takayuki Yamada ,  Kazuaki Tabata

IPC: H05K3/02 ,  H05K3/10

CPC classification number: C25D5/12 ,  B32B3/085 ,  B32B15/00 ,  B32B15/04 ,  B32B15/043 ,  B32B15/20 ,  B32B2255/06 ,  B32B2255/205 ,  B32B2307/202 ,  B32B2457/00 ,  B81C99/008 ,  B81C99/009 ,  B81C2201/0191 ,  B81C2201/0197 ,  C23C26/00 ,  C23C28/021 ,  C23C28/023 ,  C25D5/022 ,  C25D5/16 ,  Y10T29/49128 ,  Y10T29/49146 ,  Y10T29/49155 ,  Y10T29/49169 ,  Y10T29/49172 ,  Y10T428/12493 ,  Y10T428/12882 ,  Y10T428/24917 ,  Y10T428/24983

Abstract: A method for fabricating a laminated structure includes (i) preparing a first substrate having electroconductivity, (ii) forming a first electroconductive film having a prescribed hardness on the first substrate by an electroforming, (iii) forming a second electroconductive film having a hardness that is lower than the prescribed hardness on the first electroconductive film by an electroforming, (iv) patterning the first electroconductive film and the second electroconductive film to a prescribed pattern to form a plurality of electroconductive film patterns, and (v) subjecting the first substrate and a second substrate repeatedly to pressure contact and release to transfer sequentially the plurality of electroconductive film patterns on the first substrate onto the second substrate.

Abstract translation: 一种层叠结构体的制造方法，其特征在于，具备：（i）制备具有导电性的第一基板，（ii）通过电铸在所述第一基板上形成具有规定硬度的第一导电膜，（iii）形成具有硬度的第二导电膜， 通过电铸，比第一导电膜上的规定硬度低，（iv）将第一导电膜和第二导电膜图案化为规定图案以形成多个导电膜图案，（v）使第一基板和 重复第二衬底以压力接触和释放以顺序地将第一衬底上的多个导电膜图案转印到第二衬底上。

公开(公告)号：US08535791B2

公开(公告)日：2013-09-17

申请号：US12369205

申请日：2009-02-11

Applicant: Ali Dhinojwala ,  Pulickel M. Ajayan ,  Sunny Sethi

Inventor： Ali Dhinojwala ,  Pulickel M. Ajayan ,  Sunny Sethi

IPC: B32B5/02

CPC classification number: B81C1/00206 ,  B81C1/00111 ,  B81C2201/0191 ,  B82Y30/00 ,  B82Y40/00 ,  C01B31/0226 ,  C01B32/16 ,  C09J7/00 ,  C09J2201/626 ,  Y10T156/109 ,  Y10T428/24008 ,  Y10T428/24364 ,  Y10T428/24893 ,  Y10T428/249921 ,  Y10T428/25 ,  Y10T428/26 ,  Y10T428/29 ,  Y10T428/2913 ,  Y10T428/298 ,  Y10T428/30 ,  Y10T442/2213 ,  Y10T442/2221

Abstract: Aligned carbon nanotube-polymer composite materials, systems and methods include a substrate that carries an adhesive coating thereon. A plurality of carbon nanostructures are adhered to the substrate by the adhesive coating, such that the nanostructures are formed into a predetermined architecture, such that the architecture of the nanostructures defines at least one orientation for a plurality of nanostructures, and defies the approximate spacing between the nanostructures and/or groups of nanostructures. The adherence of the carbon nanostructures in the adhesive coating stabilizes the predetermined architecture of the nanostructures, such that the architecture renders the composite material superhydrophobic.

Abstract translation: 对准的碳纳米管 - 聚合物复合材料，系统和方法包括在其上承载粘合剂涂层的基底。 通过粘合剂涂层将多个碳纳米结构粘附到基底上，使得纳米结构形成预定的结构，使得纳米结构的结构限定了多个纳米结构的至少一个取向，并且抵消了 纳米结构和/或纳米结构组。 粘合剂涂层中碳纳米结构的粘附稳定了纳米结构的预定结构，使得该结构使复合材料具有超疏水性。

公开(公告)号：US08470701B2

公开(公告)日：2013-06-25

申请号：US12418071

申请日：2009-04-03

Applicant: John A. Rogers ,  Tae Ho Kim ,  Won Mook Choi ,  Dae Hyeong Kim ,  Matthew Meitl ,  Etienne Menard ,  John Carlisle

Inventor： John A. Rogers ,  Tae Ho Kim ,  Won Mook Choi ,  Dae Hyeong Kim ,  Matthew Meitl ,  Etienne Menard ,  John Carlisle

IPC: H01L21/20

CPC classification number: H01L21/20 ,  B81B7/0093 ,  B81C1/0038 ,  B81C2201/0191 ,  H01L23/3732 ,  H01L2924/0002 ,  H01L2924/00

Abstract: Various heat-sinked components and methods of making heat-sinked components are disclosed where diamond in thermal contact with one or more heat-generating components are capable of dissipating heat, thereby providing thermally-regulated components. Thermally conductive diamond is provided in patterns capable of providing efficient and maximum heat transfer away from components that may be susceptible to damage by elevated temperatures. The devices and methods are used to cool flexible electronics, integrated circuits and other complex electronics that tend to generate significant heat. Also provided are methods of making printable diamond patterns that can be used in a range of devices and device components.

Abstract translation: 公开了各种散热部件和制造散热部件的方法，其中与一个或多个发热部件热接触的金刚石能够散热，从而提供热调节部件。 导热金刚石以能够提供有效和最大的热传递的图案提供，远离可能易受高温损坏的部件。 这些器件和方法用于冷却易于产生显着热量的柔性电子器件，集成电路和其他复杂电子器件。 还提供了制造可在一系列装置和装置部件中使用的可印刷金刚石图案的方法。

公开(公告)号：US20100282397A1

公开(公告)日：2010-11-11

申请号：US12840763

申请日：2010-07-21

Applicant: Takayuki YAMADA ,  Kazuaki TABATA

Inventor： Takayuki YAMADA ,  Kazuaki TABATA

IPC: C25D5/10 ,  B32B38/10

CPC classification number: C25D5/12 ,  B32B3/085 ,  B32B15/00 ,  B32B15/04 ,  B32B15/043 ,  B32B15/20 ,  B32B2255/06 ,  B32B2255/205 ,  B32B2307/202 ,  B32B2457/00 ,  B81C99/008 ,  B81C99/009 ,  B81C2201/0191 ,  B81C2201/0197 ,  C23C26/00 ,  C23C28/021 ,  C23C28/023 ,  C25D5/022 ,  C25D5/16 ,  Y10T29/49128 ,  Y10T29/49146 ,  Y10T29/49155 ,  Y10T29/49169 ,  Y10T29/49172 ,  Y10T428/12493 ,  Y10T428/12882 ,  Y10T428/24917 ,  Y10T428/24983

Abstract: A laminated structure includes: a plurality of first electroconductive films each having a prescribed hardness; and a plurality of second electroconductive films each having a hardness that is lower than the prescribed hardness. The first and second electroconductive films are laminated alternately.

Abstract translation: 叠层结构包括：具有规定硬度的多个第一导电膜; 以及多个第二导电膜，其各自具有低于规定硬度的硬度。 第一和第二导电膜交替层叠。

公开(公告)号：US07799414B2

公开(公告)日：2010-09-21

申请号：US11314359

申请日：2005-12-22

Applicant: Takayuki Yamada ,  Kazuaki Tabata

Inventor： Takayuki Yamada ,  Kazuaki Tabata

IPC: B32B9/00

CPC classification number: C25D5/12 ,  B32B3/085 ,  B32B15/00 ,  B32B15/04 ,  B32B15/043 ,  B32B15/20 ,  B32B2255/06 ,  B32B2255/205 ,  B32B2307/202 ,  B32B2457/00 ,  B81C99/008 ,  B81C99/009 ,  B81C2201/0191 ,  B81C2201/0197 ,  C23C26/00 ,  C23C28/021 ,  C23C28/023 ,  C25D5/022 ,  C25D5/16 ,  Y10T29/49128 ,  Y10T29/49146 ,  Y10T29/49155 ,  Y10T29/49169 ,  Y10T29/49172 ,  Y10T428/12493 ,  Y10T428/12882 ,  Y10T428/24917 ,  Y10T428/24983

Abstract: A laminated structure includes: a plurality of first electroconductive films each having a prescribed hardness; and a plurality of second electroconductive films each having a hardness that is lower than the prescribed hardness. The first and second electroconductive films are laminated alternately.

Abstract translation: 叠层结构包括：具有规定硬度的多个第一导电膜; 以及多个第二导电膜，其各自具有低于规定硬度的硬度。 第一和第二导电膜交替层叠。