公开(公告)号：US20090233460A1

公开(公告)日：2009-09-17

申请号：US12049807

申请日：2008-03-17

Applicant: Yung-Hsin HUANG

Inventor： Yung-Hsin HUANG

IPC: H05K1/14

CPC classification number: H05K1/117 ,  H01R31/06 ,  H01R2201/06 ,  H05K2201/049 ,  H05K2201/09245

Abstract: An output adapting device of a plug-in power system is used to connect an output terminal of the plug-in power system with an input terminal of an electronic device, so as to transmit the power from the plug-in power system to the electronic device. The adapting device includes an output adapting terminal and an input adapting terminal respectively corresponding to the output terminal and the input terminal, in which corresponding pins of the corresponding terminals have identical potential, and at least one corresponding pair of pins of the output adapting terminal and the input adapting terminal have different potential. Furthermore, the adapting device also includes an adapting unit for adapting and outputting the power from the output adapting terminal to another pin with identical potential of the input adapting terminal. Therefore, the output terminal of the plug-in power system can be standardized for widely applying in various electronic devices.

Abstract translation: 插电系统的输出适配装置用于将插入式电力系统的输出端与电子设备的输入端连接起来，以将电力从插电系统传输到电子装置 设备。 适配装置包括分别对应于输出端子和输入端子的输出适配端子和输入适配端子，其中相应端子的相应引脚具有相同的电位，以及输出适配端子和至少一个对应的一对引脚 输入适配终端具有不同的潜力。 此外，适配装置还包括适配单元，用于将输出适配端子的功率适配并输出到具有输入适配终端相同电位的另一个引脚。 因此，插电式电源系统的输出端子可以被标准化，广泛应用于各种电子设备。

公开(公告)号：US20090196009A1

公开(公告)日：2009-08-06

申请号：US12320641

申请日：2009-01-30

Applicant: Wataru TSUKADA

Inventor： Wataru TSUKADA

IPC: H01L23/538 ,  H05K3/30 ,  H05K1/11

CPC classification number: H05K1/181 ,  H05K2201/09245 ,  H05K2201/097 ,  H05K2201/10159 ,  H05K2201/10689 ,  Y02P70/611 ,  Y10T29/4913

Abstract: A semiconductor module includes a plurality of rectangular shaped semiconductor devices which are arranged in two rows such that each pair of adjacent semiconductor devices is in orientations differed by 90 degrees from each other. A plurality of wirings connect the semiconductor devices included in one of the two rows to the semiconductor devices included in the other row such that the semiconductor devices arranged in the same orientations are connected to each other.

Abstract translation: 半导体模块包括多个矩形半导体器件，它们被布置成两行，使得每对相邻的半导体器件的取向彼此相差90度。 多个布线将包括在两行之一中的半导体器件连接到另一行中包括的半导体器件，使得以相同取向排列的半导体器件彼此连接。

公开(公告)号：US20080185175A1

公开(公告)日：2008-08-07

申请号：US12068169

申请日：2008-02-04

Applicant: Koichi Tanaka

Inventor： Koichi Tanaka

IPC: H01R12/04 ,  H05K3/36

CPC classification number: H05K3/462 ,  H05K1/0289 ,  H05K3/4647 ,  H05K2201/09245 ,  H05K2203/0733 ,  H05K2203/1327 ,  Y10T29/49126

Abstract: A multilayer wiring board includes at least two wiring boards having wiring layers containing wiring patterns formed on both sides. A pair of fin-shaped bumps are formed at desired positions on wiring patterns on the surfaces facing each other, of the wiring boards, so that the bumps assume a slender shape as seen in plan view and that the bumps intersect each other. The pair of fin-shaped bumps are electrically connected to form an inter-board connection terminal. Further, an insulating layer is formed between the wiring boards, and protection films are formed to cover the entire surface except pad areas defined at predetermined positions on outer wiring layers of the wiring boards.

Abstract translation: 多层布线基板包括至少两个布线板，布线层包含形成在两侧的布线图案。 在布线板的彼此相对的表面上的布线图案的期望位置处形成一对鳍状凸起，使得凸起呈现如平面图中看到的细长形状，并且凸块彼此相交。 一对鳍状凸块电连接以形成板间连接端子。 此外，在布线板之间形成绝缘层，并且形成保护膜以覆盖限定在布线板的外部布线层上的预定位置处的焊盘区域之外的整个表面。

公开(公告)号：US07381098B2

公开(公告)日：2008-06-03

申请号：US11402544

申请日：2006-04-11

Applicant: Bernard Harold Hammond, Jr. ,  David Patrick Murray ,  Ian Robert George

Inventor： Bernard Harold Hammond, Jr. ,  David Patrick Murray ,  Ian Robert George

IPC: H01R24/00

CPC classification number: H01R13/6466 ,  H01R4/2416 ,  H01R13/6658 ,  H01R13/719 ,  H01R24/64 ,  H01R2107/00 ,  H05K1/0228 ,  H05K1/162 ,  H05K3/4644 ,  H05K2201/09236 ,  H05K2201/09245 ,  H05K2201/09263 ,  H05K2201/10189 ,  Y10S439/941 ,  Y10T29/49117 ,  Y10T29/49204 ,  Y10T29/49222

Abstract: The present disclosure relates to a telecommunications jack including a housing having a port for receiving a plug. The jack also includes a plurality of contact springs adapted to make electrical contact with the plug when the plug is inserted into the port of the housing, and a plurality of wire termination contacts for terminating wires to the jack. The jack further includes a circuit board that electrically connects the contact springs to the wire termination contacts. The circuit board includes a multi-zone crosstalk compensation arrangement for reducing crosstalk at the jack.

Abstract translation: 本公开涉及一种电信插孔，其包括具有用于接收插头的端口的壳体。 千斤顶还包括多个接触弹簧，其适于当插头插入壳体的端口时与插头电接触，以及多个用于将插线端接到插座的导线终端触头。 千斤顶还包括将接触弹簧电连接到导线终端触点的电路板。 电路板包括用于减少插座处串扰的多区串扰补偿装置。

公开(公告)号：US07336142B2

公开(公告)日：2008-02-26

申请号：US11329202

申请日：2006-01-11

Applicant: Ryszard Vogel

Inventor： Ryszard Vogel

IPC: H01P5/10

CPC classification number: H05K1/0228 ,  H01P5/187 ,  H05K1/0237 ,  H05K1/162 ,  H05K2201/09245

Abstract: The invention relates to a high frequency component of layered structure, and a method for manufacturing the component. The component comprises at least one dielectric layer parallel to the layers of the layered structure, at least two transmission lines for transmitting electrical signals, at least one capacitor, each of which is formed by overlapping parts of two transmission lines, the overlapping parts being for forming capacitive interaction between the parts, and the overlapping parts being arranged to overlap each other in a transversal direction to a dielectric layer parallel to the layers of the layered structure, the dielectric layer being in between the overlapping parts.

Abstract translation: 本发明涉及分层结构的高频分量及其制造方法。 该组件包括平行于分层结构的层的至少一个电介质层，用于传输电信号的至少两个传输线，至少一个电容器，每个电容器由两条传输线的重叠部分形成，重叠部分用于 在所述部分之间形成电容性相互作用，并且所述重叠部分被布置为在与所述层状结构的层平行的电介质层的横向方向上彼此重叠，所述电介质层位于所述重叠部分之间。

公开(公告)号：US07265300B2

公开(公告)日：2007-09-04

申请号：US10800696

申请日：2004-03-16

Applicant: Luc Adriaenssens ,  Amid Hashim ,  Troy Long

Inventor： Luc Adriaenssens ,  Amid Hashim ,  Troy Long

IPC: H05K1/00

CPC classification number: H01R13/6466 ,  H05K1/0228 ,  H05K1/0231 ,  H05K1/0298 ,  H05K1/162 ,  H05K3/4688 ,  H05K2201/09236 ,  H05K2201/09245 ,  H05K2201/09672 ,  H05K2201/10189

Abstract: A connector is provided for simultaneously improving both the NEXT high frequency performance when low crosstalk plugs are used and the NEXT low frequency performance when high crosstalk plugs are used. The connector includes PCB substrates made of materials having different dielectric frequency characteristics.

Abstract translation: 提供连接器，用于当使用低串扰插头时同时提高NEXT高频性能，并且当使用高串扰插头时NEXT低频性能。 连接器包括由具有不同介电频率特性的材料制成的PCB衬底。

公开(公告)号：US07168993B2

公开(公告)日：2007-01-30

申请号：US11139768

申请日：2005-05-27

Applicant: Amid Hashim

Inventor： Amid Hashim

IPC: H01R24/00

CPC classification number: H05K1/0228 ,  H01R4/242 ,  H01R13/6469 ,  H01R13/6658 ,  H01R24/64 ,  H05K2201/09245 ,  H05K2201/10189

Abstract: A communications connector includes: a dielectric mounting substrate; a plurality of conductors mounted in the mounting substrate; and a wiring board. Each of the conductors includes a fixed end portion mounted in the mounting substrate and a free end portion, each of the free end portions being positioned in side-by-side and generally parallel relationship, and each of the fixed end portions being positioned in side-by side and generally parallel relationship. The wiring board is positioned between the fixed and free end portions of the conductors, the wiring board being generally perpendicular to the conductors, the wiring board including first and second conductive traces that are electrically insulated from each other. First and second conductors are electrically connected with the first and second traces. The first and second conductive traces are arranged on the wiring board to create a crossover between the first and second conductors.

Abstract translation: 通信连接器包括：电介质安装基板; 安装在安装基板上的多个导体; 和接线板。 每个导体包括安装在安装基板中的固定端部和自由端部，每个自由端部并排并且大致平行的关系，并且每个固定端部位于侧面 - 侧面和一般平行关系。 布线板位于导体的固定端和自由端之间，布线板大致垂直于导体，布线板包括彼此电绝缘的第一和第二导电迹线。 第一和第二导体与第一和第二迹线电连接。 第一和第二导电迹线布置在布线板上以在第一和第二导体之间产生交叉。

公开(公告)号：US20060267172A1

公开(公告)日：2006-11-30

申请号：US10908718

申请日：2005-05-24

Applicant: Henry Nguyen ,  Mark Burlington

Inventor： Henry Nguyen ,  Mark Burlington

IPC: H01L23/02

CPC classification number: G11C5/04 ,  G11C8/12 ,  G11C2029/1804 ,  H01L2924/0002 ,  H05K1/181 ,  H05K2201/09245 ,  H05K2201/09954 ,  H05K2201/10689 ,  H05K2203/1572 ,  Y02P70/611 ,  H01L2924/00

Abstract: A memory module substrate printed-circuit board (PCB) has multi-type footprints and an edge connector for mating with a memory module socket on a motherboard. Two or more kinds of dynamic-random-access memory (DRAM) chips with different data I/O widths can be soldered to solder pads around the multi-type footprints. When ×4 DRAM chips with 4 data I/O pins are soldered over the multi-type footprints, the memory module has a rank-select signal that drives chip-select inputs to all DRAM chips. When ×8 DRAM chips with 8 data I/O pins are soldered over the multi-type footprints, the memory module has two rank-select signals. One rank-select drives chip-select inputs to front-side DRAM chips while the second rank-select drives chip-select inputs to back-side DRAM chips. Wiring traces on the PCB cross-over data nibbles between the solder pads and the connector to allow two ×4 chips to drive a byte driven by only one ×8 chip.

Abstract translation: 存储器模块基板印刷电路板（PCB）具有多种类型的印迹和用于与主板上的存储器模块插座配合的边缘连接器。 可以将具有不同数据I / O宽度的两种或更多种动态随机存取存储器（DRAM）芯片焊接到多类型脚印周围的焊盘。 当具有4个数据I / O引脚的x4 DRAM芯片通过多种封装焊接时，存储器模块具有驱动芯片选择输入到所有DRAM芯片的等级选择信号。 当具有8个数据I / O引脚的x8 DRAM芯片通过多种封装焊接时，存储器模块具有两个等级选择信号。 一级选择驱动芯片选择输入到前端DRAM芯片，而第二级选择驱动芯片选择输入到后端DRAM芯片。 PCB交叉数据上的接线迹线在焊盘和连接器之间勉强化，以允许两个x4芯片驱动一个仅由一个x8芯片驱动的字节。

公开(公告)号：US07141742B2

公开(公告)日：2006-11-28

申请号：US10621925

申请日：2003-07-17

Applicant: Andew Harvey Barr ,  Dale John Shidla ,  Robert William Dobbs

Inventor： Andew Harvey Barr ,  Dale John Shidla ,  Robert William Dobbs

IPC: H01R12/04 ,  H05K1/00 ,  H05K3/36 ,  H01K3/10

CPC classification number: H05K1/0251 ,  H05K1/116 ,  H05K3/429 ,  H05K2201/0373 ,  H05K2201/09245 ,  H05K2201/093 ,  H05K2201/09309 ,  H05K2201/09681 ,  H05K2201/09718 ,  H05K2201/09781 ,  Y10T29/49126 ,  Y10T29/49165

Abstract: A printed circuit board includes a first conductive plane and a second conductive plane substantially parallel to the first conductive plane. The printed circuit board includes a via signal barrel transecting the first and second conductive planes and a first anti-pad positioned between the first conductive plane and the via signal barrel. The first anti-pad has a first voided area. The printed circuit board includes a second anti-pad positioned between the second conductive plane and the via signal barrel. The second anti-pad has a second voided area. The first voided area does not completely overlap the second voided area.

Abstract translation: 印刷电路板包括基本上平行于第一导电平面的第一导电平面和第二导电平面。 印刷电路板包括横穿第一和第二导电平面的通孔信号筒和位于第一导电平面和通孔信号筒之间的第一防焊盘。 第一个防磨垫具有第一个无效区域。 印刷电路板包括位于第二导电平面和通孔信号筒之间的第二防焊垫。 第二个防磨垫具有第二个无效区域。 第一排空区域不完全与第二空隙区域重叠。

公开(公告)号：US20060121789A1

公开(公告)日：2006-06-08

申请号：US11139768

申请日：2005-05-27

Applicant: Amid Hashim

Inventor： Amid Hashim

IPC: H01R24/00

CPC classification number: H05K1/0228 ,  H01R4/242 ,  H01R13/6469 ,  H01R13/6658 ,  H01R24/64 ,  H05K2201/09245 ,  H05K2201/10189

Abstract: A communications connector includes: a dielectric mounting substrate; a plurality of conductors mounted in the mounting substrate; and a wiring board. Each of the conductors includes a fixed end portion mounted in the mounting substrate and a free end portion, each of the free end portions being positioned in side-by-side and generally parallel relationship, and each of the fixed end portions being positioned in side-by side and generally parallel relationship. The wiring board is positioned between the fixed and free end portions of the conductors, the wiring board being generally perpendicular to the conductors, the wiring board including first and second conductive traces that are electrically insulated from each other. First and second conductors are electrically connected with the first and second traces. The first and second conductive traces are arranged on the wiring board to create a crossover between the first and second conductors.

Abstract translation: 通信连接器包括：电介质安装基板; 安装在安装基板上的多个导体; 和接线板。 每个导体包括安装在安装基板中的固定端部和自由端部，每个自由端部并排并且大致平行的关系，并且每个固定端部位于侧面 - 侧面和一般平行关系。 布线板位于导体的固定端和自由端之间，布线板大致垂直于导体，布线板包括彼此电绝缘的第一和第二导电迹线。 第一和第二导体与第一和第二迹线电连接。 第一和第二导电迹线布置在布线板上以在第一和第二导体之间产生交叉。